Patents by Inventor Fu Tsai

Fu Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • IMAGE SENSOR WITH PIXEL-LEVEL AUTO LIGHT ATTENUATOR
    Publication number: 20130327922
    Abstract: An image sensing device for sensing pixel data of a plurality of pixels in an image includes a substrate; a plurality of light sensing units, each of the plurality of light sensing units being formed in the substrate and corresponding to one of the plurality of pixels; and a plurality of pixel-level auto-light attenuators, each of the plurality of pixel-level light attenuators corresponding to one of the plurality of light sensing units. Each pixel-level light attenuator includes a transparent dielectric layer, formed on the corresponding light sensing unit; and an electronic-chromic layer, formed on the transparent dielectric layer.
    Type: Application
    Filed: October 7, 2012
    Publication date: December 12, 2013
    Applicant: NOVATEK MICROELECTRONICS CORP.
    Inventor: Shen-Fu Tsai
  • Isolation Rings for Packages and the Method of Forming the Same
    Publication number: 20130320572
    Abstract: A device includes a first package component, and a second package component underlying, and bonded to, the first package component. A molding material is disposed under the first package component and molded to the first and the second package components, wherein the molding material and the first package component form an interface. An isolation region includes a first edge, wherein the first edge of the isolation region contacts a first edge of the first package component and a first edge of the molding material. The isolation has a bottom lower than the interface.
    Type: Application
    Filed: May 31, 2012
    Publication date: December 5, 2013
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chih-Horng Chang, Tin-Hao Kuo, Tsung-Fu Tsai, Min-Feng Ku
  • Under-bump metallization (UBM) structure and method of forming the same
    Patent number: 8581420
    Abstract: An under-bump metallization (UBM) structure in a semiconductor device includes a copper layer, a nickel layer, and a Cu—Ni—Sn intermetallic compound (IMC) layer between the copper layer and the nickel layer.
    Type: Grant
    Filed: January 19, 2011
    Date of Patent: November 12, 2013
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tsung-Fu Tsai, Yian-Liang Kuo, Chih-Horng Chang
  • Metal bump structure
    Patent number: 8581399
    Abstract: A semiconductor device comprises a substrate comprising a major surface and a plurality of metal bumps on the major surface. Each of the plurality of metal bumps comprises a metal via on the major surface and a metal pillar on the metal via having an overlay offset between the metal pillar and metal via. A first metal bump of the metal bumps has a first overlay offset and a second metal bump of the metal bumps farther than the first metal bump to a centroid of the substrate has a second overlay offset greater than the first overlay offset.
    Type: Grant
    Filed: July 28, 2011
    Date of Patent: November 12, 2013
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tsung-Fu Tsai, Min-Feng Ku, Yian-Liang Kuo
  • Micro-bump structure
    Patent number: 8575754
    Abstract: A dished micro-bump structure with self-aligning functions is provided. The micro-bump structure takes advantage of the central concavity for achieving the accurate alignment with the corresponding micro-bumps.
    Type: Grant
    Filed: September 17, 2010
    Date of Patent: November 5, 2013
    Assignee: Industrial Technology Research Institute
    Inventors: Tsung-Fu Tsai, Tao-Chih Chang, Chau-Jie Zhan
  • METHOD AND DEVICE FOR DETECTING A BLOOD GLUCOSE LEVEL USING A ELECTROMAGNETIC WAVE
    Publication number: 20130289370
    Abstract: The present invention provides a method for detecting a blood glucose level of a subject using an electromagnetic wave. Because a different blood glucose level is accompanied by a different electromagnetic absorption constant, the present invention compares a detected blood glucose electromagnetic absorption constant of the subject with data in a blood glucose electromagnetic absorption constant database so as to obtain a blood glucose concentration of the subject. The present invention also provides a device for detecting a blood glucose level of the subject using the electromagnetic wave.
    Type: Application
    Filed: November 23, 2012
    Publication date: October 31, 2013
    Applicant: NATIONAL TAIWAN UNIVERSITY
    Inventors: Chi-Kuang Sun, Yuan-Fu Tsai, Hua Chen
  • Methods and apparatus of under bump metallization in packaging semiconductor devices
    Patent number: 8569886
    Abstract: Methods and apparatuses for wafer level packaging (WLP) semiconductor devices are disclosed. A redistribution layer (RDL) is formed on a first passivation layer in contact with a conductive pad over a surface of a die. The RDL layer is on top of a first region of the first passivation layer. A second passivation layer is formed on the RDL layer with an opening to expose the RDL layer, and over the first passivation layer. An under bump metallization (UBM) layer is formed over the second passivation layer in contact with the exposed RDL layer. A second region of the first passivation layer disjoint from the first region is determined by projecting an outer periphery of a solder ball or other connector onto the surface.
    Type: Grant
    Filed: November 22, 2011
    Date of Patent: October 29, 2013
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chia-Wei Tu, Yian-Liang Kuo, Tsung-Fu Tsai, Ru-Ying Huang, Ming-Song Sheu, Hsien-Wei Chen
  • ELECTRONIC DISPLAY DEVICE AND METHOD FOR ADJUSTING USER INTERFACE
    Publication number: 20130278496
    Abstract: An electronic display device acquires an image of a user in front of a screen of the device. The electronic display device calculates an area of the user in the image of the user and calculates an area ratio of the area of the user in the image of the user to a predefined value. The electronic display device provides a plurality of user interfaces and a plurality of ratio scopes corresponding to the plurality of user interfaces, and selects one of the plurality of user interfaces corresponding to one of the plurality of ratio scopes according to the area ratio located to display the one of the plurality of user interfaces on the screen.
    Type: Application
    Filed: February 22, 2013
    Publication date: October 24, 2013
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: HSIEH-FU TSAI
  • Method of Generalizing 3-Dimensional Building Models Having Level of Detail+
    Publication number: 20130211791
    Abstract: Building models having level of detail is generalized. Every single building model is generalized at first. Then, neighboring building models are processed to obtain their geometric relationship. Some of the neighboring building models are combined under specific criteria to further reduce data amount. Thus, the present invention provides smooth building model display and keeps main characteristics of the building models.
    Type: Application
    Filed: July 13, 2012
    Publication date: August 15, 2013
    Applicant: NATIONAL CENTRAL UNIVERSITY
    Inventors: Fu-an Tsai, Wan-Jung Lin, Liang-Chien Chen
  • LED LIGHT STRING
    Publication number: 20130182439
    Abstract: A design of light string comprises a bulb socket, a pair of conductive wires, and LED electrically disposed onto the bulb socket. The LED is incorporated with a pair of legs which are alternatively in contact with the pair of conductive wires, and then are sandwiched between a pair of first and second casings which jointly configures the light bulb. This configuration simplifies the assembling of the conductive wires and LED such that no need of solder or glue or contacts.
    Type: Application
    Filed: March 19, 2012
    Publication date: July 18, 2013
    Inventor: Chang-Fu TSAI
  • SOCKET HAVING SYMMETRICALLY ARRANGED FIRST AND SECOND CASINGS WITH INTERLOCKING ARRANGEMENTS TO DEFINE A LED SEAT
    Publication number: 20130183875
    Abstract: An socket for light string is provided to include a pair of symmetrically arranged first and second casings mated together. Each of the first and second casings is featured with a side opening, and a first and second end channels, interlocking arrangements provided at internal wall thereof so as to securely interlock the first and second casings to configure the socket with a LED seat formed by the openings to host an LED, and passages for securely receiving conductive wires configured by the first and second channels. A partition is provided under the LED seat so as to insulatively isolated the conductive wires. Inner surfaces of the channels are provided with teeth to firmly hold the conductive wires. The socket is preferable for the use of configuring a light string.
    Type: Application
    Filed: March 19, 2012
    Publication date: July 18, 2013
    Inventor: Chang Fu TSAI
  • Socket having symmetrically arranged first and second casings with interlocking arrangements to define a LED seat
    Patent number: 8485830
    Abstract: An socket for light string is provided to include a pair of symmetrically arranged first and second casings mated together. Each of the first and second casings is featured with a side opening, and a first and second end channels, interlocking arrangements provided at internal wall thereof so as to securely interlock the first and second casings to configure the socket with a LED seat formed by the openings to host an LED, and passages for securely receiving conductive wires configured by the first and second channels. A partition is provided under the LED seat so as to insulatively isolated the conductive wires. Inner surfaces of the channels are provided with teeth to firmly hold the conductive wires. The socket is preferable for the use of configuring a light string.
    Type: Grant
    Filed: March 19, 2012
    Date of Patent: July 16, 2013
    Inventor: Chang Fu Tsai
  • Video switching system and method
    Patent number: 8471891
    Abstract: A video switching system detects speaking information of at least one speaker in a video conference according to a reference time. One participant is regarded as one speaker if the one participant speaks longer than the reference time. The video switching system determines a main speaker of the at least one speaker according to the speaking information of the at least one speaker. The video switching system calculates an image switching frequency, and determines whether to switch to a video image of the main speaker according to the image switching frequency. The video switching system calculates a response time if determining to switch to the video image of the main speaker, and adjusts the reference time according to the image switching frequency and the response time.
    Type: Grant
    Filed: April 28, 2011
    Date of Patent: June 25, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Chih-Huang Wang, Hsieh-Fu Tsai
  • Electronic devices and methods
    Patent number: 8456222
    Abstract: The present invention relates to an electronic device, which comprises: a first module, comprising an I/O pad for being an interface between the electronic device and an external device, and receiving a first bias source; a second module, coupled to the first module, comprising a register, and receiving a second bias source; and a signal converter, coupled between the first module and the second module. Wherein when one of the first and second bias sources is stable and the other is unstable, the signal converter outputs a first predetermined bias value to the first or second modules receiving the unstable bias source.
    Type: Grant
    Filed: July 22, 2011
    Date of Patent: June 4, 2013
    Assignee: Realtek Semiconductor Corp.
    Inventors: Tay-Her Tsaur, Chih-Fu Tsai
  • Methods and Apparatus of Packaging Semiconductor Devices
    Publication number: 20130127052
    Abstract: Methods and apparatuses for wafer level packaging (WLP) semiconductor devices are disclosed. A redistribution layer (RDL) is formed on a first passivation layer in contact with a conductive pad over a surface of a die. The RDL layer is on top of a first region of the first passivation layer. A second passivation layer is formed on the RDL layer with an opening to expose the RDL layer, and over the first passivation layer. An under bump metallization (UBM) layer is formed over the second passivation layer in contact with the exposed RDL layer. A second region of the first passivation layer disjoint from the first region is determined by projecting an outer periphery of a solder ball or other connector onto the surface.
    Type: Application
    Filed: November 22, 2011
    Publication date: May 23, 2013
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chia-Wei Tu, Yian-Liang Kuo, Tsung-Fu Tsai, Ru-Ying Huang, Ming-Song Sheu, Hsien-Wei Chen
  • Bump-on-trace structures with wide and narrow portions
    Patent number: 8441127
    Abstract: A device includes a package component, and a metal trace on a surface of the package component. A first and a second dielectric mask cover a top surface and sidewalls of the metal trace, wherein a landing portion of the metal trace is located between the first and the second dielectric masks. The landing portion includes a first portion having a first width, and a second portion connected to an end of the first portion. The second portion has a second width greater than the first width, wherein the first and the second widths are measured in a direction perpendicular to a lengthwise direction of the metal trace.
    Type: Grant
    Filed: June 29, 2011
    Date of Patent: May 14, 2013
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Fu-Tsai Hou, Liang-Chen Lin
  • Drive with heat dissipation and energy-saving function
    Patent number: 8427091
    Abstract: A drive with heat dissipation and energy-saving function for supplying power to drive a motor. The drive includes a driving circuit having a rectification section. The rectification section serves to receive AC current generated when the motor abruptly accelerates/decelerates and convert the AC current into DC current and output the DC current. The drive further includes a cooling module electrically connected to an output end of the rectification section. The cooling module is drivable by the DC current output from the rectification section to conduct out and dissipate heat.
    Type: Grant
    Filed: March 9, 2011
    Date of Patent: April 23, 2013
    Assignee: Hiwin Mikrosystem Corp.
    Inventors: Chi-Yuan Cheng, Ming Fu Tsai
  • Packaging Structures of Integrated Circuits
    Publication number: 20130087925
    Abstract: A chip includes a dummy connector disposed at a top surface of the chip. A seal ring encircles a region directly underlying the dummy connector, with the region overlapping the dummy connector.
    Type: Application
    Filed: October 5, 2011
    Publication date: April 11, 2013
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tsung-Fu Tsai, Chia-Wei Tu, Yian-Liang Kuo, Ru-Ying Huang
  • DISPLAY CONTROL APPARATUS AND DISPLAY CONTROL METHOD
    Publication number: 20130088428
    Abstract: A display control apparatus and a display control method are disclosed. The display control apparatus comprises a recognition circuit and a mapping circuit. The recognition circuit recognizes a head position and a control point position of an operator. The mapping circuit dynamically adjusts the operating boundary according to the head position, the control point position and a display boundary, and calculates the cursor position on a display according to the control point position, the operating boundary and the display boundary, wherein the cursor position remains on a imagine line passing through the head position and the control point position.
    Type: Application
    Filed: December 27, 2011
    Publication date: April 11, 2013
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Wen-Hung Ting, Chia-Chang Li, Chieh-Fu Tsai, Chien-Chun Kuo, Po-Lung Chen
  • METAL BUMP STRUCTURE
    Publication number: 20130026621
    Abstract: A semiconductor device comprises a substrate comprising a major surface and a plurality of metal bumps on the major surface. Each of the plurality of metal bumps comprises a metal via on the major surface and a metal pillar on the metal via having an overlay offset between the metal pillar and metal via. A first metal bump of the metal bumps has a first overlay offset and a second metal bump of the metal bumps farther than the first metal bump to a centroid of the substrate has a second overlay offset greater than the first overlay offset.
    Type: Application
    Filed: July 28, 2011
    Publication date: January 31, 2013
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Tsung-Fu TSAI, Min-Feng KU, Yian-Liang KUO