Abstract: In one example, a method includes receiving a first differential signal including a first voltage signal and a second voltage signal, wherein the first differential signal includes a first common mode voltage; receiving a second common mode voltage. The method further includes determining, by a circuit, a second differential signal including a third voltage signal and a fourth voltage signal, wherein a difference between the third voltage signal and the fourth voltage signal is based on a difference between the first voltage signal and the second voltage signal, wherein the second differential signal includes the second common mode voltage. The method further includes outputting, substantially continuously, the second differential signal.

Abstract: An embodiment is a circuit. The circuit includes active circuitry, a first capacitor, a first fuse, a second capacitor, and a second fuse. The active circuitry has a first power node and a second power node. The first capacitor is coupled to the first fuse serially to form a first segment. The second capacitor is coupled to the second fuse serially to form a second segment. The first segment and the second segment are coupled together in parallel and between the first power node and the second power node.

Abstract: A portable electronic device including a housing, a button assembly, a locking unit, a processing unit and a sensing unit is provided. The button assembly is disposed at an opening of the housing and includes a button, an elastomer and a switch. The button is movably disposed at the opening and configured to trigger the switch when an external force is applied. The elastomer is disposed between the button and the housing and forms a waterproof seal between the button and the housing. The locking unit is enabled to keep the button on a fixed position against the elastomer when the processing unit determines that a detection signal generated by the sensing unit is over a threshold. The locking unit is disabled when the processing unit determines that the detection signal is not over the threshold. A protection method for a portable electronic device is also provided.

Abstract: An electrostatic discharge (ESD) protection device is disclosed, which includes a substrate of a positive dopant type; a p-well defined in the substrate; a depletion inducing structure of a negative dopant type having a gap defined in a bottom portion thereof disposed in the p-well, and a n-channel device disposed in a planar encircled region defined by the depletion inducing structure. The well region is in connection with the substrate through the depletion inducing structure. Upon an ESD stress, the depletion inducing structure induces an expanded depletion region in the substrate under the well region, thus providing a substrate trigger mechanism that reduces the triggering voltage of the ESD protection device.

Abstract: A service controller of a computing device can store console messages so that an external management device can retrieve the console messages after a malfunction or crash of the computing device. For example, the service controller can be configured to redirect serial output (e.g., console messages, system log messages, system error message, etc.) to a network interface controller for transmission over a network connection. The service controller can be configured to store the console messages in non-volatile memory of the service controller. The service controller can receive a request for the stored console messages and transmit the stored console messages to an external device.

Abstract: A color filter array for an image sensing device is disclosed. The color filter array includes a plurality of pixels and a control unit. The plurality of pixels is utilized for generating a plurality of pixel data of an image. The control unit is utilized for controlling the plurality of pixels. In addition, each of the plurality of pixels is divided into a plurality of sub-pixels corresponding to the same color. When outputting the plurality of pixel data, each of the plurality of pixels accumulates pixel value of at least one of the plurality of sub-pixels in each of the plurality of pixels as the pixel data outputted by each of the plurality of pixels.

Abstract: A method and structure of improving the robustness of an electrostatic discharge (ESD) protection device is disclosed. One aspect of the instant disclosure provides a semiconductor structure that comprises: a first well structure; a second well structure arranged adjacent to the isolation structure in the substrate, a diffusion region respectively disposed in the first and the second well structures; an isolation structure arranged between the well structures and laterally separating the diffusion regions; and a partition structure arranged in the isolation structure. The partition structure affects a steeper slope on a lateral surface of the isolation structure bordering at least one of the diffusion regions, thereby modifying a ballasting characteristic of the isolation structure.

Abstract: A method includes forming an electrical connector over a substrate of a wafer, and molding a polymer layer, with at least a portion of the electrical connector molded in the polymer layer. A first sawing step is performed to form a trench in the polymer layer. After the first sawing step, a second sawing step is performed to saw the wafer into a plurality of dies.

Abstract: A differential two-stage amplifier is provided. The differential two-stage amplifier includes an input circuit, a bias circuit, a common mode feedback circuit, a first stage amplifier, a second stage amplifier and a current compensation circuit. The input circuit receives an input current. The bias circuit provides a bias current. The first stage amplifier is coupled to the input circuit and the second stage amplifier. The common mode feedback circuit is coupled to the second stage amplifier and adjusts a common mode feedback current according to a common mode voltage, wherein the input current is made up of the bias current and the common mode feedback current. The current compensation circuit provides a compensation current, wherein when a temperature of the differential two-stage amplifier is greater than a predetermined temperature, the compensation current is input to the input circuit.

Abstract: An auto-color-correction method for an image capturing device includes calculating a plurality color temperatures of a plurality of pixels in an image; calculating a number of pixels of the plurality of pixels located in a first color temperature range as a first number and a number of pixels of the plurality of pixels located in a second color temperature range as a second number; generating a color temperature weight according to the first number and the second number; and generating at least one correction coefficient according to the color temperature weight, at least one first coefficient corresponding to the first color temperature range and at least one second coefficient corresponding to the second color temperature range.

Abstract: In some implementations, network interface controller (NIC) configuration information can be obtained from a NIC prior to booting up an operating system. For example, a Basic Input Output System (BIOS) can obtain the NIC configuration information from the NIC during the execution of a system check (e.g., Power-On Self-Test). A system controller can receive the NIC configuration information from the BIOS. The system controller can store the NIC configuration information in memory associated with the system controller. A management system can request the NIC configuration information from the system controller using an out-of-band communication channel. For example, the management system can send the request for NIC configuration information to the system controller prior to powering on a server using a dedicated network interface of the system controller.

Abstract: In some implementations, an IP address can be configured for a computing device using an out-of-band communication channel. For example, a system administrator can configure a system controller (e.g., baseband management controller) with an IP address using an out-of-band communication channel. In some implementations, the system controller can be configured with the IP address when the computing device is powered down. The system controller can store the IP address in memory associated with the system controller. In some implementations, an operating system of the computing device can be configured with an agent (e.g., process, application, utility) that will request the IP address from the system controller and configure the computing device to use the IP address. For example, the operating system agent can use various operating system commands to configure the IP address for the computing device based on the IP address received from the system controller.

Abstract: Methods and apparatuses for wafer level packaging (WLP) semiconductor devices are disclosed. A redistribution layer (RDL) is formed on a first passivation layer in contact with a conductive pad over a surface of a die. The RDL layer is on top of a first region of the first passivation layer. A second passivation layer is formed on the RDL layer with an opening to expose the RDL layer, and over the first passivation layer. An under bump metallization (UBM) layer is formed over the second passivation layer in contact with the exposed RDL layer. A second region of the first passivation layer disjoint from the first region is determined by projecting an outer periphery of a solder ball or other connector onto the surface.

Abstract: The present invention discloses a network apparatus and enabling method thereof. During the procedure of voltage biasing or host booting, an enabling signal generated in this network apparatus is provided for enabling the internal application circuit at first. At the time of data connection between the network apparatus and a corresponding host apparatus, the host apparatus is able to enable or disable the application circuit of the network apparatus via a predetermined pin.

Abstract: A method includes forming an electrical connector over a substrate of a wafer, and molding a polymer layer, with at least a portion of the electrical connector molded in the polymer layer. A first sawing step is performed to form a trench in the polymer layer. After the first sawing step, a second sawing step is performed to saw the wafer into a plurality of dies.

Abstract: A die has a first surface, a second surface opposite the first surface, and sidewalls includes a first portion and a second portion, wherein the first portion is closer to the first surface than the second portion. A fillet contacts the first portion of sidewalls of the die and encircles the die. A work piece is bonded to the die through solder bumps, with the second surface facing the work piece. A first underfill is filled a gap between the die and the work piece, wherein the first underfill contacts the fillet, and wherein the first underfill and the fillet are formed of different materials.

Abstract: In one example, a method includes receiving a first differential signal including a first voltage signal and a second voltage signal, wherein the first differential signal includes a first common mode voltage; receiving a second common mode voltage. The method further includes determining, by a circuit, a second differential signal including a third voltage signal and a fourth voltage signal, wherein a difference between the third voltage signal and the fourth voltage signal is based on a difference between the first voltage signal and the second voltage signal, wherein the second differential signal includes the second common mode voltage. The method further includes outputting, substantially continuously, the second differential signal.

Abstract: A device includes a first package component, and a second package component underlying, and bonded to, the first package component. A molding material is disposed under the first package component and molded to the first and the second package components, wherein the molding material and the first package component form an interface. An isolation region includes a first edge, wherein the first edge of the isolation region contacts a first edge of the first package component and a first edge of the molding material. The isolation has a bottom lower than the interface.

Abstract: Methods and apparatuses for wafer level packaging (WLP) semiconductor devices are disclosed. A redistribution layer (RDL) is formed on a first passivation layer in contact with a conductive pad over a surface of a die. The RDL layer is on top of a first region of the first passivation layer. A second passivation layer is formed on the RDL layer with an opening to expose the RDL layer, and over the first passivation layer. An under bump metallization (UBM) layer is formed over the second passivation layer in contact with the exposed RDL layer. A second region of the first passivation layer disjoint from the first region is determined by projecting an outer periphery of a solder ball or other connector onto the surface.

Abstract: Disclosed are a three-way connector and a light string using the connector. The three-way connector includes first and second three-branched casing members that have joint surfaces respectively comprising mateable recesses and projections and receiving three electrical wires embedded therebetween to form a three-branched connection having a connection point where soldering is applied. Ultrasonic is then applied to fuse and bond the two casing members together as a electrical-wire-included three-branched block thereby constituting a three-way connector. The three-way connector can be used in combination with two-way sockets, electrical wires, and LED luminous elements, in series connection or in parallel connection, to form various configurations of the LED light string.