Patents by Inventor Fu Tsai

Fu Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Preventing device power on after unrecoverable error
    Patent number: 9110805
    Abstract: In some implementations, a system controller of a computing device can be configured to receive a power-on signal and prevent the computing device from providing power to components of the computing device. In some implementations, upon receiving a power-on signal, the system controller can retrieve fault data from a power supply unit. The fault data can be analyzed to determine whether the power supply unit detected an unrecoverable failure. When an unrecoverable failure is detected, the system controller can prevent the power supply unit from providing power to other components of the computing device. In some implementations, an unrecoverable failure can be detected when the fault data indicates that an overcurrent, an overvoltage, or an over-temperature fault has occurred.
    Type: Grant
    Filed: October 27, 2014
    Date of Patent: August 18, 2015
    Assignee: Quanta Computer Inc.
    Inventor: Chin-Fu Tsai
  • Capacitor with Fuse Protection
    Publication number: 20150214150
    Abstract: An embodiment is a circuit. The circuit includes active circuitry, a first capacitor, a first fuse, a second capacitor, and a second fuse. The active circuitry has a first power node and a second power node. The first capacitor is coupled to the first fuse serially to form a first segment. The second capacitor is coupled to the second fuse serially to form a second segment. The first segment and the second segment are coupled together in parallel and between the first power node and the second power node.
    Type: Application
    Filed: July 17, 2014
    Publication date: July 30, 2015
    Inventors: Shih-Cheng Chang, Liang-Chen Lin, Fu-Tsai Hou, Tung-Chin Yeh, Shih-Kai Lin, Gia-Her Lu, Jyun-Lin Wu, Hsien-Pin Hu
  • Three-Way Connector And Light String Using Same
    Publication number: 20150214682
    Abstract: Disclosed are a three-way connector and a light string using the connector. The three-way connector includes first and second three-branched casing members that have joint surfaces respectively comprising mateable recesses and projections and receiving three electrical wires embedded therebetween to form a three-branched connection having a connection point where soldering is applied. Ultrasonic is then applied to fuse and bond the two casing members together as a electrical-wire-included three-branched block thereby constituting a three-way connector. The three-way connector can be used in combination with two-way sockets, electrical wires, and LED luminous elements, in series connection or in parallel connection, to form various configurations of the LED light string.
    Type: Application
    Filed: January 25, 2014
    Publication date: July 30, 2015
    Inventor: Chang-Fu TSAI
  • Display control apparatus and display control method
    Patent number: 9063567
    Abstract: A display control apparatus and a display control method are disclosed. The display control apparatus comprises a recognition circuit and a mapping circuit. The recognition circuit recognizes a head position and a control point position of an operator. The mapping circuit dynamically adjusts the operating boundary according to the head position, the control point position and a display boundary, and calculates the cursor position on a display according to the control point position, the operating boundary and the display boundary, wherein the cursor position remains on a imagine line passing through the head position and the control point position.
    Type: Grant
    Filed: December 27, 2011
    Date of Patent: June 23, 2015
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Wen-Hung Ting, Chia-Chang Li, Chieh-Fu Tsai, Chien-Chun Kuo, Po-Lung Chen
  • Protecting flip-chip package using pre-applied fillet
    Patent number: 9064881
    Abstract: A die has a first surface, a second surface opposite the first surface, and sidewalls includes a first portion and a second portion, wherein the first portion is closer to the first surface than the second portion. A fillet contacts the first portion of sidewalls of the die and encircles the die. A work piece is bonded to the die through solder bumps, with the second surface facing the work piece. A first underfill is filled a gap between the die and the work piece, wherein the first underfill contacts the fillet, and wherein the first underfill and the fillet are formed of different materials.
    Type: Grant
    Filed: November 11, 2010
    Date of Patent: June 23, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tsung-Fu Tsai, Yian-Liang Kuo, Ming-Song Sheu, Yu-Ling Tsai, Chen-Shien Chen, Han-Ping Pu
  • Semiconductor device having under-bump metallization (UBM) structure and method of forming the same
    Patent number: 9059158
    Abstract: A semiconductor device comprises a semiconductor substrate, an under-bump metallization (UBM) structure overlying the semiconductor substrate, and a solder bump overlying and electrically connected to the UBM structure. The UBM structure comprises a first metallization layer comprising a first metal, a second metallization layer comprising a second metal different from the first metal, and a first intermetallic compound (IMC) layer between the first metallization layer and the second metallization layer, the first IMC layer comprising the first metal and the second metal.
    Type: Grant
    Filed: July 18, 2014
    Date of Patent: June 16, 2015
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Tsung-Fu Tsai, Yian-Liang Kuo, Chih-Horng Chang
  • Automatic-Focusing Imaging Capture Device and Imaging Capture Method
    Publication number: 20150163394
    Abstract: An automatic-focusing imaging capture device includes a first imaging capture module for generating a clue imaging information according to an object and a second imaging capture module for determining whether or not to re-focus for generating an imaging information corresponding to the object according to the clue imaging information; wherein a first frame rate of the first imaging capture module is higher than a second frame rate of the second imaging capture module, and the clue imaging information includes an object-distance information and a depth-of-field information.
    Type: Application
    Filed: April 13, 2014
    Publication date: June 11, 2015
    Applicant: NOVATEK Microelectronics Corp.
    Inventors: Shen-Fu Tsai, Wei Hsu, Min-Hui Chu, Chin-Hui Huang, Wei-Lung Liu
  • Isolation rings for packages and the method of forming the same
    Patent number: 9048333
    Abstract: A device includes a first package component, and a second package component underlying, and bonded to, the first package component. A molding material is disposed under the first package component and molded to the first and the second package components, wherein the molding material and the first package component form an interface. An isolation region includes a first edge, wherein the first edge of the isolation region contacts a first edge of the first package component and a first edge of the molding material. The isolation has a bottom lower than the interface.
    Type: Grant
    Filed: February 25, 2014
    Date of Patent: June 2, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Horng Chang, Tin-Hao Kuo, Tsung-Fu Tsai, Min-Feng Ku
  • Automatic Color Correction Method and Color Correction Module thereof
    Publication number: 20150130964
    Abstract: An auto-color-correction method for an image capturing device includes calculating a plurality color temperatures of a plurality of pixels in an image; calculating a number of pixels of the plurality of pixels located in a first color temperature range as a first number and a number of pixels of the plurality of pixels located in a second color temperature range as a second number; generating a color temperature weight according to the first number and the second number; and generating at least one correction coefficient according to the color temperature weight, at least one first coefficient corresponding to the first color temperature range and at least one second coefficient corresponding to the second color temperature range.
    Type: Application
    Filed: March 20, 2014
    Publication date: May 14, 2015
    Applicant: NOVATEK Microelectronics Corp.
    Inventors: Ming-Teng Huang, Wei Hsu, Shen-Fu Tsai
  • Methods and circuits for power switching
    Patent number: 9030044
    Abstract: The present invention relates to a method and a circuit for power switching. The method comprises the steps of: providing a operation circuit; receiving a command from a Host and setting up a power mode of the operation circuit; supplying a first rated consuming power source and then a second rated consuming power source to the operation circuit via the power switching circuit according to power mode; detecting the transferring process form the first rated consuming power source to second rated consuming power source; and preventing over current according to detecting result.
    Type: Grant
    Filed: July 25, 2011
    Date of Patent: May 12, 2015
    Assignee: Realtek Semiconductor Corp.
    Inventors: Chih-Fu Tsai, Kuo-Sheng Chung
  • IMAGE SENSOR AND IMAGE CAPTURING SYSTEM
    Publication number: 20150098005
    Abstract: An image sensor and an image capturing system are provided. The image sensor includes a pixel array, and the pixel array includes a plurality of image sensing arrays and a focus sensing pixel group. Each of the image sensing arrays is covered by a plurality of color filter units, and the focus sensing pixel group is not covered by the color filter units. The focus sensing pixel group includes a plurality of first focus sensing pixel units, and the first focus sensing pixel units are arranged according to a first arrangement pattern. An area ratio of the focus sensing pixel group and the pixel array is smaller than one-ninth, or the focus sensing pixel group is, with respect to the whole pixel array, non-uniformly disposed in the pixel array. The image capturing system of the present invention can enhance a focus function.
    Type: Application
    Filed: November 21, 2013
    Publication date: April 9, 2015
    Applicant: Novatek Microelectronics Corp.
    Inventors: Shen-Fu Tsai, Wei Hsu
  • Method for processing image data
    Patent number: 9001237
    Abstract: A method for processing image data is described. The method includes the steps: (a) fully writing image data into first buffer area; (b) vertically reading the image data in first buffer area and horizontally writing image data into second buffer area; (c) while completely reading a first portion of first buffer area, allocating the complete read first portion of first buffer area to second buffer area to be served as a writing section; (d) vertically reading the image data in a second portion of first buffer area and writing the image data into second buffer area; and (e) vertically reading the image data of second buffer area and horizontally writing the image data into first buffer area, and after completely reading a portion of second buffer area, allocating the read portion of second buffer area to first buffer area.
    Type: Grant
    Filed: October 3, 2013
    Date of Patent: April 7, 2015
    Assignee: Genesys Logic, Inc.
    Inventor: Wen-fu Tsai
  • Packaging devices, methods of manufacture thereof, and packaging methods
    Patent number: 8994155
    Abstract: Packaging devices, methods of manufacture thereof, and packaging methods for semiconductor devices are disclosed. In one embodiment, a packaging device includes a substrate including an integrated circuit die mounting region. An underfill material flow prevention feature is disposed around the integrated circuit die mounting region.
    Type: Grant
    Filed: October 19, 2012
    Date of Patent: March 31, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tsung-Fu Tsai, Yu-Chang Lin, Ying Ching Shih, Wei-Min Wu, Yian-Liang Kuo, Chia-Wei Tu
  • Optoelectronic device and method for manufacturing the same
    Patent number: 8946736
    Abstract: An optoelectronic device comprising, a substrate and a first transition stack formed on the substrate comprising a first transition layer formed on the substrate having a hollow component formed inside the first transition layer, a second transition layer formed on the first transition layer, and a reflector rod formed inside the second transition layer.
    Type: Grant
    Filed: December 31, 2012
    Date of Patent: February 3, 2015
    Assignee: Epistar Corporation
    Inventors: Wei-Chih Peng, Ta-Cheng Hsu, Yu-Jiun Shen, Ching-Fu Tsai
  • METHODS AND GATEWAYS FOR PROCESSING DNS REQUEST
    Publication number: 20140379916
    Abstract: Methods and systems for processing Domain Name Service (DNS) request in a gateway with a plurality of WAN network interfaces. After receiving a first DNS request via one of network interfaces of the gateway, the gateway selects at least one DNS server and at least one access network and then transmits a plurality of new DNS requests to the selected at least one DNS server through the selected at least one access network and via one of network interfaces of the gateway.
    Type: Application
    Filed: November 5, 2012
    Publication date: December 25, 2014
    Inventors: Ho Ming Chan, Chi Pan Yip, Min-Fu Tsai, Alex Wing Hong Chan, Kit Wai Chau
  • Structure of tree-shaped lighting decoration
    Patent number: 8905771
    Abstract: A structure of tree-shaped lighting decoration includes an extension cable assembly, which is a modularized assembly adapted to carry a regular voltage supplied from an electric main and has an end forming a cylindrical socket and an opposite end forming a cylindrical plug, a tree-segment tube having an end section forming a retention tubular section that has a reduced portion for positioning and retaining the cylindrical socket, an ancillary component including a conical body that forms therein a stepped bore that has a side opening. The stepped bore of the ancillary component and the cylindrical plug are respectively provided with mated dimple and bump for engaging each other. The ancillary component receiving the cylindrical plug therein is fit into an opposite end of the tree-segment tube to form a tree segment. Alternatively, the extension cable assembly can be used as a stand-alone device.
    Type: Grant
    Filed: April 28, 2013
    Date of Patent: December 9, 2014
    Inventor: Chang Fu Tsai
  • SEMICONDUCTOR DEVICE HAVING UNDER-BUMP METALLIZATION (UBM) STRUCTURE AND METHOD OF FORMING THE SAME
    Publication number: 20140327136
    Abstract: A semiconductor device comprises a semiconductor substrate, an under-bump metallization (UBM) structure overlying the semiconductor substrate, and a solder bump overlying and electrically connected to the UBM structure. The UBM structure comprises a first metallization layer comprising a first metal, a second metallization layer comprising a second metal different from the first metal, and a first intermetallic compound (IMC) layer between the first metallization layer and the second metallization layer, the first IMC layer comprising the first metal and the second metal.
    Type: Application
    Filed: July 18, 2014
    Publication date: November 6, 2014
    Inventors: Tsung-Fu TSAI, Yian-Liang KUO, Chih-Horng CHANG
  • STRUCTURE OF TREE-SHAPED LIGHTING DECORATION
    Publication number: 20140321104
    Abstract: A structure of tree-shaped lighting decoration includes an extension cable assembly, which is a modularized assembly adapted to carry a regular voltage supplied from an electric main and has an end forming a cylindrical socket and an opposite end forming a cylindrical plug, a tree-segment tube having an end section forming a retention tubular section that has a reduced portion for positioning and retaining the cylindrical socket, an ancillary component including a conical body that forms therein a stepped bore that has a side opening. The stepped bore of the ancillary component and the cylindrical plug are respectively provided with mated dimple and bump for engaging each other. The ancillary component receiving the cylindrical plug therein is fit into an opposite end of the tree-segment tube to form a tree segment. Alternatively, the extension cable assembly can be used as a stand-alone device.
    Type: Application
    Filed: April 28, 2013
    Publication date: October 30, 2014
    Inventor: Chang Fu TSAI
  • Electronic apparatus having stand-by mode and operation method thereof
    Patent number: 8856558
    Abstract: An electronic apparatus has a stand-by mode. The electronic apparatus includes a first circuit, a second circuit and a third circuit. The first circuit has an interface and transfers data to an external device. The second circuit has a processor and sets a first power supplying mode of the first circuit. The third circuit sets a second circuit power supplying mode of the second circuit and sets a second power supply mode of the first circuit when the second circuit is disabled. The processor selects a first circuit power supplying mode from power supplying modes of the first circuit as the second power supplying mode before the second circuit is disabled.
    Type: Grant
    Filed: June 24, 2011
    Date of Patent: October 7, 2014
    Assignee: Realtek Semiconductor Corp.
    Inventors: Chih-Fu Tsai, Jia-Ching Shen
  • Post-passivation interconnect structure and methods for forming the same
    Patent number: 8846548
    Abstract: A method includes forming a polymer layer over a passivation layer, wherein the passivation layer further comprises a portion over a metal pad. The polymer layer is patterned to form an opening in the polymer layer, wherein exposed surfaces of the polymer layer have a first roughness. A surface treatment is performed to increase a roughness of the polymer layer to a second roughness greater than the first roughness. A metallic feature is formed over the exposed surface of the polymer layer.
    Type: Grant
    Filed: January 9, 2013
    Date of Patent: September 30, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chia-Wei Tu, Yian-Liang Kuo, Wei-Lun Hsieh, Tsung-Fu Tsai