Abstract: A semiconductor device having a structure in which an insulating resin film or sheet is stuck on the principal surface of a semiconductor chip which is formed with circuits and in which the inner lead portions of a lead frame are arranged on the principal surface of the semiconductor chip through the insulating sheet, is provided in order that the semiconductor chip having the highest possible density of integration may be received placed in a standardized package. The present invention particularly features the shape of the lead frame, according to which the inner lead portions lying within a sealing member are substantially entirely arrayed over the semiconductor chip itself.

Abstract: In a tabless lead frame wherein a space for laying inner leads is sufficiently secured when a lengthened and enlarged semiconductor pellet is placed or set in a resin-molding package, through holes are provided in leads for the purpose of increasing the occupation area ratio of a resin portion. Furthermore, each of the leads corresponding to the lower surface of the pellet is branched into a plurality of portions in the widthwise direction thereof in order to reduce a stress. Further, in an insulating sheet which is interposed between the leads and the pellet, the dimension of the shorter lateral sides thereof is set smaller than that of the shorter lateral sides of the pellet in order to prevent cracks from occurring at the end part of the insulating sheet.

Abstract: In surface packaging of thin resin packages such as resin molded memory ICs or the like, cracks of the package occur frequently at a solder reflow step where thermal impact is applied to the package because the resin has absorbed moisture before packaging. To solve this problem, the devices are packaged moisture-tight at an assembly step of the resin molded devices where the resin is still dry, and are taken out from the bags immediately before the execution of surface packaging.

Abstract: The present invention relates to a technique in which the pellet fixing parts of a lead frame of the tabless type or the type having no die pads are molded in or coated with a resin beforehand in order to enhance the reliability of a resin-encapsulated IC having become important with enlargement in the size of the chip of a memory IC or the like and reduction in the size of a resin package, and a resin package structure in which the technique of the lead frame having no die pads is applied to flat packaging so as to lessen reflow cracks.

Abstract: A nickel-alloy layer is formed on a lead frame made of a material which consists chiefly of copper as a base material, a pellet is then mounted, and a resin is applied thereto to form a package. Then, a copper layer or an alloy layer of copper and 0.05 to 0.2% by weight of zinc is formed on said nickel-containing alloy layer of the external lead portions. A solder layer is then formed on the copper layer or on the zinc-copper alloy layer that is formed on the external lead portions. With the thus formed semiconductor device, the resin exhibits increased adhesiveness relative to the tab and lead frame in the package. Therefore, peeling is prevented from occurring on the interface between the resin and the tab or lead frame. Further, no brittle intermetallic compound is formed by the heating in the metal layer such as the solder layer on the external lead portions. Accordingly, the metal layer is effectively prevented from peeling off.

Abstract: A semiconductor device comprising a square package body, a plurality of leads which jut out from each of four sides of the package body, a beveled portion which is formed in at least one corner of the package body, and leads which jut out from the beveled portion.

Abstract: A semiconductor device comprising a package base whose material is glass epoxy or the like, a plurality of leads which are formed in a manner to extend from the front surface to the rear surface of the package base, a semiconductor element which is fastened to the package base and which is electrically connected to the leads, and a resin which seals, at least, the semiconductor element and electrical connection parts between the element and the leads.

Abstract: This invention relates to a lead frame which is applied to a resin-molded semiconductor device. According to the lead frame of this invention, a quadrangular tab for supporting a semiconductor pellet is supported by four tab leads which extend along diagonal lines of the tab.