Abstract: A system for recommending multimedia data includes a storage device and a processor. The storage device includes a first storage unit and a second storage unit. The first storage unit is configured to store multimedia data segments. The second storage unit is connected to at least one client device through network, and configured to store operation data generated by the interaction between the at least one client device and the system. The processor coupled to the storage device is configured to analyze the multimedia data segments in the first storage unit in order to generate relevance links between the multimedia data segments, analyze the operation data in the second storage unit, and to generate, based on the relevance links and the operation data, a corresponding recommended list, wherein the recommended list records the multimedia data segments.

Abstract: A substrate structure includes a substrate body, a bottom circuit layer, a first bottom protection structure and a second bottom protection structure. The substrate body has a top surface and a bottom surface opposite to the top surface. The bottom circuit layer is disposed adjacent to the bottom surface of the substrate body, and includes a plurality of pads. The first bottom protection structure is disposed on the bottom surface of the substrate body, and covers a portion of the bottom circuit layer. The second bottom protection structure is disposed on the bottom surface of the substrate body, and covers a portion of the bottom circuit layer. A second thickness of the second bottom protection structure is greater than a first thickness of the first bottom protection structure.

Abstract: A semiconductor device package is provided that includes a substrate, a first support structure disposed on the substrate and a first antenna. The first support structure includes a first surface spaced apart from the substrate by a first distance. The first antenna is disposed above the first surface of the first support structure.

Abstract: A lead frame includes a die paddle, a first lead, a second lead, an extending portion and at least one supporting portion. The first lead includes a first main portion and a first I/O portion opposite to the first main portion. The second lead includes a second main portion and a second I/O portion opposite to the second main portion. The first lead and the second lead surround the die paddle. The extending portion extends from the first main portion of the first lead. The supporting portion is connected to the extending portion.

Abstract: Present disclosure provides a lead frame, including a die paddle and a plurality of leads surrounding the die paddle. Each of the leads including a finger portion proximal to the die paddle and a lead portion distal from the die paddle. The finger portion includes a main body and at least one support structure. The respective support structures on adjacent leads are mutually isolated, and a distance between the support structure and the die paddle is smaller than a distance between the lead portion and the die paddle. A semiconductor package structure including the lead frame described herein and a semiconductor package assembly including the semiconductor package structure described herein are also provided.

Abstract: A semiconductor device package includes a first surface and a second surface opposite to the first surface. The semiconductor device package further includes a first supporting structure disposed on the first surface of the substrate and a second supporting structure disposed on the first surface of the substrate. The first supporting structure has a first surface spaced apart from the first surface of the substrate by a first distance. The second supporting structure has a first surface spaced apart from the first surface of the substrate by a second distance. The second distance is different from the first distance. The semiconductor device package further includes a first antenna disposed above the first surface of the substrate. The first antenna is supported by the first surface of the first supporting structure and the first surface of the second supporting structure.

Abstract: Pathogenic blood vessels are blood vessels that are not involved in the vascularization of normal organs but are in the pathogenic tissues such as the new blood vessels that drive vision diseases or the blood vessels in tumors that tumors depend on to survive. The current disclosure provides an advancement over typical anti-angiogenic strategies that target the generation of new blood vessels by providing compositions and methods that can selectively target and kill existing pathogenic blood vessels. The conventional antiangiogenic drugs or factors inhibit angiogenesis (the growth of new blood vessels), but cannot effectively kill existing pathogenic blood vessels. Agents, including small molecule compounds and antibodies, have been identified that bind to and activate PLXDC1 and PLXDC2 proteins, leading to effective killing of the endothelial cells in pathogenic blood vessels in vision diseases and in tumors that express these proteins.

Abstract: The disclosure provides compounds, and compositions, including pharmaceutical compositions, kits that include the compounds, and methods of using (or administering) and making the compounds. The disclosure further provides compounds or compositions thereof for use in a method of modulating PLXDC1 (TEM7) and/or PLXDC2 or killing pathogenic blood vessles. The disclosure further provides compounds or compositions thereof for use in a method of treating a disease, disorder, or condition that is mediated, at least in part, by PEDF receptors or by angiogenesis.

Abstract: A semiconductor device package includes a substrate, a support structure and a first antenna. The substrate has a first surface and a second surface opposite to the first surface. The support structure is disposed on the first surface of the substrate. The first antenna is disposed on the support structure. The first antenna has a first surface facing the substrate, a second surface opposite to the first surface and a lateral surface extending between the first surface and a second surface of the first antenna. The lateral surface of the first antenna is exposed to the external of the semiconductor device package. The first antenna includes a dielectric layer and an antenna pattern disposed within the dielectric layer and penetrating the dielectric layer.

Abstract: A semiconductor device package is provided that includes a substrate, a first support structure disposed on the substrate and a first antenna. The first support structure includes a first surface spaced apart from the substrate by a first distance. The first antenna is disposed above the first surface of the first support structure. The first antenna has a first surface, a second surface opposite the first surface and a third surface extending from the first surface to the second surface, wherein the first surface and the second surface of the first antenna are exposed.

Abstract: A semiconductor package structure includes a first conductive structure, a second conductive structure, a first semiconductor component, a second semiconductor component and a first encapsulant. The first semiconductor component is disposed on the first conductive structure. The first conductive structure includes a first redistribution layer. The second semiconductor component is disposed on the second conductive structure. The second conductive structure includes a second redistribution layer, and the first conductive structure is electrically connected to the second conductive structure. The first encapsulant covers the first semiconductor component and the first conductive structure. A lateral surface of the first conductive structure and a lateral surface of the first encapsulant are non-coplanar.

Abstract: A semiconductor device package is provided that includes a substrate, a first support structure disposed on the substrate and a first antenna. The first support structure includes a first surface spaced apart from the substrate by a first distance. The first antenna is disposed above the first surface of the first support structure.

Abstract: A package substrate includes a first dielectric layer, a first patterned conductive layer and a first set of alignment marks. The first patterned conductive layer is disposed on the first dielectric layer. The first set of alignment marks is disposed on the first dielectric layer and adjacent to a first edge of the first dielectric layer. The first set of alignment marks includes a plurality of alignment marks. Distances between the alignment marks of the first set of alignment marks and the first edge are different from each other.

Abstract: A system for recommending multimedia data includes a storage device and a processor. The storage device includes a first storage unit and a second storage unit. The first storage unit is configured to store multimedia data segments. The second storage unit is connected to at least one client device through network, and configured to store operation data generated by the interaction between the at least one client device and the system. The processor coupled to the storage device is configured to analyze the multimedia data segments in the first storage unit in order to generate relevance links between the multimedia data segments, analyze the operation data in the second storage unit, and to generate, based on the relevance links and the operation data, a corresponding recommended list, wherein the recommended list records the multimedia data segments.

Abstract: The present disclosure relates to a data search method and a data search system thereof. The data search method includes steps of: receiving a first learning content data, wherein the first learning content data includes multiple first learning sections; analysing the first learning content data by a may of Natural Language Processing to search multiple first keyword strings corresponding to each of the first learning content data; receiving a search message; analysing the search message by the may of Natural Language Processing to generate a search string; comparing the search string with the first keyword strings; and generating a search list according to the first learning section, which corresponding to the first keyword string that matches the search string.

Abstract: The present disclosure relates to a data analysis method and a data analysis system thereof. The data analysis method includes steps of: receiving a first learning content data, and adding multiple first segmentation marks to the first learning content data to divide multiple first learning sections on the first learning content data. The first learning sections are arranged according to a time axis. Searching a first keyword string corresponding to each first learning section from the first learning sections. Receiving a analysis command, and analyzing the analysis command with the first keyword string of each of the first learning content data to obtain multiple first similarities, corresponding to the analysis command and each of the first learning sections. Finally, searching for the first learning section with the highest similarity.

Abstract: An on-board diagnostic connector terminal is provided, including a plurality of first pins, a plurality of second pins and a substrate. Each first pin includes a first section and a second section. The first section connects to the second section. The first section includes a first connection end, and the second section includes a first soldering end. Each second pin includes a second connection end and a second soldering end. The first pins and the second pins are disposed on the substrate. The first soldering ends and the second soldering ends are arranged on a first straight line. At least one first connection end and the second connection end corresponding thereto are arranged linearly in a first direction. The first direction is perpendicular to the first straight line.

Abstract: A substrate structure includes a substrate body, a bottom circuit layer, a first bottom protection structure and a second bottom protection structure. The substrate body has a top surface and a bottom surface opposite to the top surface. The bottom circuit layer is disposed adjacent to the bottom surface of the substrate body, and includes a plurality of pads. The first bottom protection structure is disposed on the bottom surface of the substrate body, and covers a portion of the bottom circuit layer. The second bottom protection structure is disposed on the bottom surface of the substrate body, and covers a portion of the bottom circuit layer. A second thickness of the second bottom protection structure is greater than a first thickness of the first bottom protection structure.

Abstract: An on-board diagnostic connector terminal is provided, including a plurality of first pins, a plurality of second pins and a substrate. Each first pin includes a first section and a second section. The first section connects to the second section. The first section includes a first connection end, and the second section includes a first soldering end. Each second pin includes a second connection end and a second soldering end. The first pins and the second pins are disposed on the substrate. The first soldering ends and the second soldering ends are arranged on a first straight line. At least one first connection end and the second connection end corresponding thereto are arranged linearly in a first direction. The first direction is perpendicular to the first straight line.

Abstract: A semiconductor package structure includes a first conductive structure, a second conductive structure, a first semiconductor component, a second semiconductor component and a first encapsulant. The first semiconductor component is disposed on the first conductive structure. The first conductive structure includes a first redistribution layer. The second semiconductor component is disposed on the second conductive structure. The second conductive structure includes a second redistribution layer, and the first conductive structure is electrically connected to the second conductive structure. The first encapsulant covers the first semiconductor component and the first conductive structure. A lateral surface of the first conductive structure and a lateral surface of the first encapsulant are non-coplanar.