Abstract: The present invention provides a method for generating hydroxyl radicals and removing organic pollutants in water by utilizing an organic membrane. The inventive method generates hydroxyl radicals by adopting a nitrocellulose membrane as a photocatalytic material, placing the nitrocellulose membrane in water, illuminating with the sun or a sunlamp having a wavelength above 280 nm as a light source, and causing the nitrocellulose membrane to undergo a photochemical reaction at the membrane surface, and the generation rate of hydroxyl radicals can be achieved by adjusting the surface area of the membrane and a light intensity. The generated hydroxyl radicals can remove phenol, bisphenol A, thiamphenicol and other typical organic pollutants in water very well.

Abstract: A display is provided. The display includes a metal back plate, a plastic frame, a backlight optical module and a liquid-crystal module. The metal back plate includes a plurality of metal wedging portions and a first side. The plastic frame is combined with the metal back plate by injection molding. The plastic frame includes a plurality of plastic wedging portions. The plastic wedging portions wedge the metal wedging portions. The plastic frame defines a recess on the first side of the metal back plate. The backlight optical module is disposed in the recess. The liquid-crystal module covers the backlight optical module and is connected to the plastic frame.

Abstract: A display is provided. The display includes a metal back plate, a plastic frame, a backlight optical module and a liquid-crystal module. The metal back plate includes a plurality of metal wedging portions and a first side. The plastic frame is combined with the metal back plate by injection molding. The plastic frame includes a plurality of plastic wedging portions. The plastic wedging portions wedge the metal wedging portions. The plastic frame defines a recess on the first side of the metal back plate. The backlight optical module is disposed in the recess. The liquid-crystal module covers the backlight optical module and is connected to the plastic frame.

Abstract: A hands-free electronic device is provided, including a housing, a first elastic element and a second elastic element. The housing includes a first side and a second side opposite thereto. The first elastic element includes a first section, a second section and a third section. The first section covers the first side. The second section is connected to the first section, and the second section includes a first concave surface. An end of the third section is connected to the second section, and the other end of the third section is a free end. The second elastic element is disposed in the holding space, wherein a first end of the second elastic element is affixed to the second side, and a second end of the second elastic element is connected to the first elastic element.

Abstract: A data transmission system includes a device and a base. The base includes a near field communication (NFC) module and a processing module configured to determine whether a wireless network exits. The NFC module includes a determining unit configured to determine whether the NFC module writes a predetermined tag after the processing module determines the wireless network exits and configured to determine whether the predetermined tag is an authorization code, a sending unit configured to send a service set identifier (SSID) and a password to the device after the predetermined tag is the authorization code, and a control unit configured to switch an input mode of the base to a wireless network mode after the SSID and the password are sent to the device. The device is configured to be connected to the wireless network after receiving the SSID and the password. A communication method is also provided.

Abstract: A hands-free electronic device is provided, including a housing, a first elastic element and a second elastic element. The housing includes a first side and a second side opposite thereto. The first elastic element includes a first section, a second section and a third section. The first section covers the first side. The second section is connected to the first section, and the second section includes a first concave surface. An end of the third section is connected to the second section, and the other end of the third section is a free end. The second elastic element is disposed in the holding space, wherein a first end of the second elastic element is affixed to the second side, and a second end of the second elastic element is connected to the first elastic element.

Abstract: The present invention provides a method for generating hydroxyl radical and removing organic pollutants in water by utilizing an organic membrane. The inventive method generates hydroxyl radical by adopting a nitrocellulose membrane as a photocatalytic material, placing the nitrocellulose membrane in water, illuminating with the sun or a sunlamp having a wavelength above 280 nm as a light source, and causing the nitrocellulose membrane to undergo a photochemical reaction at the membrane surface, and the generation rate of hydroxyl radical can be achieved by adjusting the surface area of the membrane and a light intensity. The generated hydroxyl radical can remove phenol, bisphenol A, thiamphenicol and other typical organic pollutants in water very well.

Abstract: A semiconductor package structure includes a substrate, a semiconductor chip, and a solder material. The substrate includes an insulating layer, a conductive circuit layer, and a conductive bump. The conductive circuit layer is recessed from a top surface of the insulating layer. The conductive circuit layer includes a pad, and a side surface of the pad extends along a side surface of the insulating layer. The conductive bump is disposed on the pad. A side surface of the conductive bump, a top surface of the pad and the side surface of the insulating layer together define an accommodating space. A solder material electrically connects the conductive bump and the semiconductor chip. A portion of the solder material is disposed in the accommodating space.

Abstract: A smart electric meter is provided. The smart electric meter includes a body, an antenna holder, an antenna structure and a supporting member. The antenna holder is disposed on the body, wherein the antenna holder is annular. The antenna structure is disposed on the antenna holder, wherein the antenna structure is moveable along a circumferential direction of the antenna holder. The supporting member is connected to the antenna structure, wherein the supporting member is moveably disposed on the antenna holder, and the supporting member moves the antenna structure along the circumferential direction of the antenna holder.

Abstract: A multi-function cup having a detachable cup mouth includes a cup body having a cup mouth. The cup mouth is provided with a sealing cover device. The sealing cover device includes a cup cover, an engaging hoop, an engaging ring, and a buckle. The engaging hoop is attached to an inner wall of the engaging ring. The engaging ring has a notch. The buckle is connected with the engaging ring. Two sides of the buckle are connected with the engaging ring at two sides of the notch. The cup mouth is provided with a flange extending upward. The cup cover is mated with the flange. The buckle is buckled with the engaging ring to reduce the engaging ring for the engaging hoop to fasten the flange of the cup mouth. Because the cup is made of silicone, it is easy and convenient to place articles into the multi-function cup.

Abstract: A smart meter capable of performing wireless transmission is used to show some power information, in which the smart meter includes an inner cylindrical case, a ring layer, an inner-layer antenna, and an outer-layer antenna. The interior of the inner cylindrical case is hollow. The ring layer surrounds the inner cylindrical case. The inner-layer antenna is attached to the ring layer and slides on the ring layer. The outer-layer antenna is also attached to the ring layer and overlaps as well as contacts with the inner-layer antenna. The inner-layer antenna and the outer-layer antenna are driven to adjust a total length of them in order to receive signals of different frequency bands.

Abstract: A semiconductor package structure includes a substrate, a semiconductor chip, and a solder material. The substrate includes an insulating layer, a conductive circuit layer, and a conductive bump. The conductive circuit layer is recessed from a top surface of the insulating layer. The conductive circuit layer includes a pad, and a side surface of the pad extends along a side surface of the insulating layer. The conductive bump is disposed on the pad. A side surface of the conductive bump, a top surface of the pad and the side surface of the insulating layer together define an accommodating space. A solder material electrically connects the conductive bump and the semiconductor chip. A portion of the solder material is disposed in the accommodating space.

Abstract: A data transmission system includes a device and a base. The base includes a near field communication (NFC) module and a processing module configured to determine whether a wireless network exits. The NFC module includes a determining unit configured to determine whether the NFC module writes a predetermined tag after the processing module determines the wireless network exits and configured to determine whether the predetermined tag is an authorization code, a sending unit configured to send a service set identifier (SSID) and a password to the device after the predetermined tag is the authorization code, and a control unit configured to switch an input mode of the base to a wireless network mode after the SSID and the password are sent to the device. The device is configured to be connected to the wireless network after receiving the SSID and the password. A communication method is also provided.

Abstract: The present disclosure relates to a semiconductor package structure including a semiconductor substrate, a semiconductor chip and a conductive material. The semiconductor substrate includes an insulating layer, a conductive circuit layer and a conductive bump. The conductive circuit layer is recessed from the top surface of the insulating layer, and includes at least one pad. The conductive bump is disposed on the at least one pad. A side surface of the conductive bump, a top surface of the at least one pad and a side surface of the insulating layer together define an accommodating space. The conductive material is electrically connected the conductive bump and the semiconductor chip, and a portion of the conductive material is disposed in the accommodating space.

Abstract: The present disclosure relates to a semiconductor package structure including a semiconductor substrate, a semiconductor chip and a conductive material. The semiconductor substrate includes an insulating layer, a conductive circuit layer and a conductive bump. The conductive circuit layer is recessed from the top surface of the insulating layer, and includes at least one pad. The conductive bump is disposed on the at least one pad. A side surface of the conductive bump, a top surface of the at least one pad and a side surface of the insulating layer together define an accommodating space. The conductive material is electrically connected the conductive bump and the semiconductor chip, and a portion of the conductive material is disposed in the accommodating space.

Abstract: A smart meter capable of performing wireless transmission is used to show some power information, in which the smart meter includes an inner cylindrical case, a ring layer, an inner-layer antenna, and an outer-layer antenna. The interior of the inner cylindrical case is hollow. The ring layer surrounds the inner cylindrical case. The inner-layer antenna is attached to the ring layer and slides on the ring layer. The outer-layer antenna is also attached to the ring layer and overlaps as well as contacts with the inner-layer antenna. The inner-layer antenna and the outer-layer antenna are driven to adjust a total length of them in order to receive signals of different frequency bands.

Abstract: The present disclosure relates to a semiconductor substrate and a method for making the same. The semiconductor substrate includes an insulation layer, a first circuit layer, a second circuit layer, a plurality of conductive vias and a plurality of bumps. The first circuit layer is embedded in a first surface of the insulation layer, and exposed from the first surface of the insulation layer. The second circuit layer is located on a second surface of the insulation layer and electrically connected to the first circuit layer through the conductive vias. The bumps are directly located on part of the first circuit layer, where the lattice of the bumps is the same as that of the first circuit layer.

Abstract: A radio-frequency device for a wireless communication device includes an antenna disposition area; a plurality of linearly polarized antennas for transmitting and receiving a plurality of radio signals, wherein the plurality of linearly polarized antennas are substantially disposed in the antenna disposition area in a manner such that polarization directions of the plurality of linearly polarized antennas are orthogonal to each other; and a grounding resonant element coupled to a grounding terminal of one of the plurality of linearly polarized antennas for enhancing isolations of the plurality of linearly polarized antennas.

Abstract: The present disclosure relates to a semiconductor substrate and a method for making the same. The semiconductor substrate includes an insulation layer, a first circuit layer, a second circuit layer, a plurality of conductive vias and a plurality of bumps. The first circuit layer is embedded in a first surface of the insulation layer, and exposed from the first surface of the insulation layer. The second circuit layer is located on a second surface of the insulation layer and electrically connected to the first circuit layer through the conductive vias. The bumps are directly located on part of the first circuit layer, where the lattice of the bumps is the same as that of the first circuit layer.

Abstract: A smart electric meter is provided. The smart electric meter includes a body, an antenna holder, an antenna structure and a supporting member. The antenna holder is disposed on the body, wherein the antenna holder is annular. The antenna structure is disposed on the antenna holder, wherein the antenna structure is moveable along a circumferential direction of the antenna holder. The supporting member is connected to the antenna structure, wherein the supporting member is moveably disposed on the antenna holder, and the supporting member moves the antenna structure along the circumferential direction of the antenna holder.