Patents by Inventor Guo Cheng

Guo Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080060194
    Abstract: A method for fabricating a passive circuit in a circuit substrate is provided. The circuit substrate comprising a first metallic layer, a second metallic layer, and a dielectric layer is provided firstly, and the dielectric layer is disposed between the first metallic layer and the second metallic layer. Thereafter, a strip shaped through hole through the circuit substrate is formed. Afterward, a third metallic layer is formed on a part of a wall of the strip shaped through hole, and the third metallic layer is electrically connected to the first metallic layer and/or the second metallic layer. The third metallic layer functions as the passive circuit.
    Type: Application
    Filed: July 30, 2007
    Publication date: March 13, 2008
    Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventor: Guo-Cheng Liao
  • Publication number: 20080053690
    Abstract: A manufacturing method and structure for substrate with vertically embedded capacitors includes the steps of providing a plurality of conductive layers having a first dielectric layer and a leading wire layer formed on the first dielectric layer, providing a plurality of composite layers having a second dielectric layer and a patterned electrode layer formed on the second dielectric layer, laminating the conductive layers and the composite layers to form a block which defines a plurality of substrates with vertically embedded capacitors and a plurality of sawing streets between the substrates, and sawing the block along the sawing streets to singularize the substrates.
    Type: Application
    Filed: May 30, 2007
    Publication date: March 6, 2008
    Inventor: Guo-Cheng Liao
  • Publication number: 20070235870
    Abstract: A common assembly substrate for carrying a die and applying the mechanisms are provided, wherein the common assembly substrate comprises a plurality of bonding fingers formed on one side of the substrate. A bonding wire is used to electrically connect the die with one of the bonding fingers, wherein at least two of the bonding fingers are located in the direction of the bonding wire.
    Type: Application
    Filed: December 6, 2006
    Publication date: October 11, 2007
    Applicant: ADVANCED SEMICONDUCTOR ENGINEERING INC.
    Inventor: Guo-Cheng Liao
  • Publication number: 20030092424
    Abstract: The present invention relates to a transmission method of wireless virtual channels and in particular to the data transmission between wireless host device and child devices. Both of the child device and the host device store a number of sets of family ID and security ID. The child device is the emitter and the host device is the receiver. The child device sends out a set of family ID and security ID by using at least one key or activation unit to the host device that receives and identifies the family ID and security ID. Insertion of the family ID and the security ID to each string of wireless data transmitted between the child device and the host device serves as the certification purpose so that one or multiple data transmission channels can be virtually created.
    Type: Application
    Filed: November 14, 2001
    Publication date: May 15, 2003
    Inventors: John Kuo, Mark Chao, Guo Cheng Shie
  • Patent number: 5099408
    Abstract: A system is provided for controlling a PWM inverter having three main circuit arms in which free-wheel diodes are connected in parallel to positive and negative side switching elements. The inverter takes three phase alternating current from an intermediate portion of the arms on the basis of a voltage supply of a direct current and an ON and OFF operation of the switching elements. The control system includes a circuit for detecting a zero-crossing point of the three phase alternating current. A wave generating circuit generates a PWM wave at every main circuit arm, which changes the level thereof corresponding to ON and OFF operation of the switching elements and is inverted to each other in the positive and negative sides. An on-delay circuit delays a level change timing from ON to OFF of the PWM wave for a short circuit preventing duration.
    Type: Grant
    Filed: April 27, 1990
    Date of Patent: March 24, 1992
    Assignee: Kasuga Denki Kabushiki Kaisha
    Inventors: Guo Cheng Chen, Yukio Kawa