Patents by Inventor Hang Lin

Hang Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10975889
    Abstract: A fan module and an electronic device are provided. The fan module includes a hub and a plurality of blades. The blades are mounted around the hub, and each of the blades has a first end that is connected to a periphery of the hub and a second end that is relatively away from the hub. A first axial direction distance in the axial direction is provided between a first point of the first end that is relatively away from the top surface and the top surface. A second axial direction distance in the axial direction is provided between a second point of the first end that is near the top surface and the top surface. A ratio of the second axial direction distance to the first axial direction distance is 0.4 to 0.5.
    Type: Grant
    Filed: April 30, 2019
    Date of Patent: April 13, 2021
    Assignee: Coretronic Corporation
    Inventors: Shih-Hang Lin, Chih-Cheng Chou
  • Patent number: 10964594
    Abstract: Methods of packaging semiconductor devices and structures thereof are disclosed. In one embodiment, a method of packaging a semiconductor device includes providing a carrier wafer, providing a plurality of dies, and forming a die cave material over the carrier wafer. A plurality of die caves is formed in the die cave material. At least one of the plurality of dies is placed within each of the plurality of die caves in the die cave material. A plurality of packages is formed, each of the plurality of packages being formed over a respective at least one of the plurality of dies.
    Type: Grant
    Filed: December 18, 2018
    Date of Patent: March 30, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company.
    Inventors: Jing-Cheng Lin, Jui-Pin Hung, Yi-Hang Lin, Tsan-Hua Tung
  • Patent number: 10900023
    Abstract: Disclosed herein are various bioreactor devices and systems for growing cellular material, and related methods of growing cellular material. In some cases, a system can include a well plate having a plurality of wells and a bioreactor situated in each well of the well plate. In some cases, a bioreactor can include an inner body which divides the bioreactor into several distinct chambers and facilitates the growth of a multi-tissue sample in the bioreactor. In some cases, a system can include a mechanical actuator situated to mechanically stress tissues grown in a bioreactor.
    Type: Grant
    Filed: August 22, 2014
    Date of Patent: January 26, 2021
    Assignee: University of Pittsburgh—Of the Commonwealth System of Higher Education
    Inventors: Rocky S. Tuan, Hang Lin, Thomas P. Lozito, Peter Alexander, Douglas A. Nelson, Jr., Riccardo Gottardi
  • Patent number: 10719138
    Abstract: An interactive electronic apparatus and an interactive method thereof are provided. The interactive electronic apparatus includes a main device and a casing. The main device is installed in a containing space of the casing. After the main device establishes a connection with the casing, the casing sends at least one of a first distance between the casing and an object to be sensed by a first distance sensor and a second distance between a bottom portion of the casing and a plane detected by a second distance sensor to the main device. The main device determines an interactive state of interaction with the interactive electronic apparatus based on at least one of a movement information sensed by a gravity sensor, the first distance and the second distance, and sends an interactive signal corresponding to the interactive state.
    Type: Grant
    Filed: April 23, 2019
    Date of Patent: July 21, 2020
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Cheng-Yuan Wei, Kai-Yi Chen, Wen-Yi Chiu, Hsiu-Hang Lin, Sheng-Chieh Tang, Kun-Hsuan Chang
  • Patent number: 10660026
    Abstract: Embodiments of the present invention provide a method for establishing an association between a STA and an AP, and the method includes: sending, by the STA, an association request frame to the AP, where the association request frame includes a service type element, and the service type element is used for indicating a sensor service type, an offloading service type, or a hybrid service type to which the STA belongs, where the sensor service type includes a first sensor service or a second sensor service, and the offloading service type includes a first offloading service or a second offloading service; and receiving, by the STA, an association response frame sent by the AP, where the association response frame is generated by the AP after determining, according to the service type element, a service type to which the STA belongs.
    Type: Grant
    Filed: October 10, 2017
    Date of Patent: May 19, 2020
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Tianyu Wu, Changle Li, Hang Lin
  • Publication number: 20200128958
    Abstract: The disclosure provides a smart liquor cabinet and a management method for the liquor cabinet. In the management method, a voice command is received and an intent of the voice command is determined. If the intent of the voice command is related to a remaining space of the liquor cabinet, then the remaining space with no liquor in the liquor cabinet is determined. If the intent of the voice command is related to an inventory situation of the liquor cabinet, then the inventory situation of stored liquor in the liquor cabinet is determined. The response of the intent is outputted. The response is related to the remaining space or the inventory situation. In this way, the liquor and space in the liquor cabinet may be counted easily and quickly.
    Type: Application
    Filed: May 24, 2019
    Publication date: April 30, 2020
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Yu-Chung Lo, Kai-Yi Chen, Li-Yuan Hsu, Yi-Wen Wang, Hsiu-Hang Lin
  • Patent number: 10628639
    Abstract: A method of cable sensing data collection applicable to an electronic apparatus having a counter array is provided. The electronic apparatus is for detecting a cable including a plurality of sensors and a plurality of RFID tags, where each of the RFID tags is used to receive cable sensing data of the cable obtained by the sensors. The method includes: scanning each of the RFID tags to retrieve the cable sensing data, where the cable sensing data includes a tag identifier of the RFID tag; converting the tag identifier to a plurality of array addresses through a plurality of hash functions; and transmitting the cable sensing data to a cloud platform according to whether a plurality of elements of the array addresses in the counter array having a zero or not. In addition, an electronic and a chip using the method are also provided.
    Type: Grant
    Filed: December 4, 2018
    Date of Patent: April 21, 2020
    Assignee: Chung Yuan Christian University
    Inventors: Yu-Kuen Lai, Tzu-Hang Lin, Chung-Hsiang Cheng, Ku-Yeh Shih
  • Patent number: 10621897
    Abstract: A display device and a display method are provided. The display device comprises a housing, a translucent module, a projecting unit and an object detection sensor. The housing comprises a containing space. The translucent module is disposed on the surface of the housing. The projecting unit is disposed in the containing space, and coupled to a controller. The projecting unit is configured to project projection light to the translucent module. The object detection sensor is disposed on the display device and coupled to the controller. When the object detection sensor senses that a moving object exists in a first preset distance range away from the housing, the object detection sensor outputs an object sensing signal to the controller. The controller controls the projecting unit and the translucent module based on the object sensing signal, so as to project a projection picture.
    Type: Grant
    Filed: May 24, 2018
    Date of Patent: April 14, 2020
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Hsiu-Hang Lin, Pin-Yu Chou, Kai-Yi Chen, Kun-Hsuan Chang, Hsin-Chieh Cheng, Yu-Hao Tseng, Chia-Shin Weng, Dai-Yun Tsai
  • Publication number: 20200103984
    Abstract: An interactive electronic apparatus and an interactive method thereof are provided. The interactive electronic apparatus includes a main device and a casing. The main device is installed in a containing space of the casing. After the main device establishes a connection with the casing, the casing sends at least one of a first distance between the casing and an object to be sensed by a first distance sensor and a second distance between a bottom portion of the casing and a plane detected by a second distance sensor to the main device. The main device determines an interactive state of interaction with the interactive electronic apparatus based on at least one of a movement information sensed by a gravity sensor, the first distance and the second distance, and sends an interactive signal corresponding to the interactive state.
    Type: Application
    Filed: April 23, 2019
    Publication date: April 2, 2020
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Cheng-Yuan Wei, Kai-Yi Chen, Wen-Yi Chiu, Hsiu-Hang Lin, Sheng-Chieh Tang, Kun-Hsuan Chang
  • Publication number: 20200003231
    Abstract: The disclosure provides a fan module and an electronic device. The fan module includes a hub and a plurality of blades. The blades are mounted around the hub, and each of the blades has a first end is connected to a periphery of the hub and a second end that is relatively away from the hub. A first axial direction distance in the axial direction is provided between a first point of the first end that is relative away from the top surface and the top surface. A second axial direction distance in the axial direction is provided between a second point of the first end that is near the top surface and the top surface. A ratio of the second axial direction distance to the first axial direction distance is 0.4 to 0.5.
    Type: Application
    Filed: April 30, 2019
    Publication date: January 2, 2020
    Applicant: Coretronic Corporation
    Inventors: Shih-Hang Lin, Chih-Cheng Chou
  • Publication number: 20190307922
    Abstract: A method is provided for producing a live cartilaginous material useful for implantation into a patient. A method of treating a patient comprising implanting a cartilaginous material prepared according to the provided method in an anatomical site in a patient also is provided.
    Type: Application
    Filed: April 9, 2019
    Publication date: October 10, 2019
    Inventors: Hang Lin, Rocky Sung Chi Tuan, Yuanheng Yang
  • Publication number: 20190276784
    Abstract: Disclosed herein are various bioreactor devices that mimic the mammalian joint. The bioreactor device can include a series of bioreactor chambers that contain different components of the joint, such as bone, cartilage, synovium, nerve and ligament. At least two different nutrient fluid circulation systems connect subsets of the bioreactor chambers to differentially supply nutrient fluids at concentrations optimized for the tissue that the fluid nourishes. For example, relatively hypoxic fluid can be supplied to synovium and cartilage to mimic oxygenation in the joint compartment, but normoxic fluid can be supplied to the bone and other components that have an arterial supply that provides higher oxygen concentrations. One or more or all of the bioreactor chambers can be supplied with separate inlets through which perturbation agents (such as drugs or other agents) can be introduced to model the effect of the perturbations on different components of the system.
    Type: Application
    Filed: November 16, 2018
    Publication date: September 12, 2019
    Applicant: University of Pittsburgh - Of the Commonwealth System of Higher Education
    Inventors: Hang Lin, Peter Alexander, Riccardo Lucca Gottardi, Rocky Sung Chi Tuan
  • Publication number: 20190248486
    Abstract: A flight device including a device main body and a plurality of lift force providing modules is provided. The lift force providing modules are connected to the device main body. Each of the lift force providing modules includes two propellers, and each of the propellers rotates to lift the device main body. Two propellers of each of the lift force providing modules may rotate around the same rotation axis. The flight device has an enhanced lift force and good efficiency in lifting, and the flight device has a reduced device volume and improved flight reliability.
    Type: Application
    Filed: January 30, 2019
    Publication date: August 15, 2019
    Applicant: Coretronic Intelligent Robotics Corporation
    Inventors: Ying-Chieh Chen, Shih-Hang Lin, Chi-Tong Hsieh
  • Publication number: 20190161178
    Abstract: An unmanned aerial vehicle includes a body, a plurality of cantilevers and a plurality of driving components. Each cantilever has a first end and a second end. Each first end is opposite to the corresponding second end. The first ends are connected to the body. The driving components are respectively connected to the second ends of the cantilevers. Each driving component includes a motor and a plurality of paddles. The motor has a shaft. The propeller is connected to the shaft and includes a balance disc and a plurality of paddles. The balance disc is connected to the motor. The paddles are connected to the balance disc. The balance disc has a plurality of counterweight holes. The counterweight holes are used to be disposed with the at least one counterweight block. A propeller is also provided.
    Type: Application
    Filed: November 30, 2018
    Publication date: May 30, 2019
    Inventors: SHIH-HANG LIN, YING-CHIEH CHEN
  • Publication number: 20190122929
    Abstract: Methods of packaging semiconductor devices and structures thereof are disclosed. In one embodiment, a method of packaging a semiconductor device includes providing a carrier wafer, providing a plurality of dies, and forming a die cave material over the carrier wafer. A plurality of die caves is formed in the die cave material. At least one of the plurality of dies is placed within each of the plurality of die caves in the die cave material. A plurality of packages is formed, each of the plurality of packages being formed over a respective at least one of the plurality of dies.
    Type: Application
    Filed: December 18, 2018
    Publication date: April 25, 2019
    Inventors: Jing-Cheng Lin, Jui-Pin Hung, Yi-Hang Lin, Tsan-Hua Tung
  • Patent number: 10163711
    Abstract: Methods of packaging semiconductor devices and structures thereof are disclosed. In one embodiment, a method of packaging a semiconductor device includes providing a carrier wafer, providing a plurality of dies, and forming a die cave material over the carrier wafer. A plurality of die caves is formed in the die cave material. At least one of the plurality of dies is placed within each of the plurality of die caves in the die cave material. A plurality of packages is formed, each of the plurality of packages being formed over a respective at least one of the plurality of dies.
    Type: Grant
    Filed: June 5, 2017
    Date of Patent: December 25, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company
    Inventors: Jing-Cheng Lin, Jui-Pin Hung, Yi-Hang Lin, Tsan-Hua Tung
  • Patent number: 10163875
    Abstract: A method for forming a chip package structure is provided. The method includes forming a chip on an adhesive layer. The chip has a front surface and a back surface opposite to the front surface. The back surface is in direct contact with the adhesive layer. A first maximum length of the adhesive layer is less than a second maximum length of the chip. The method includes forming a molding compound layer surrounding the chip and the adhesive layer. A first bottom surface of the adhesive layer is substantially coplanar with a second bottom surface of the molding compound layer. The method includes forming a redistribution structure over the chip and the molding compound layer.
    Type: Grant
    Filed: March 8, 2018
    Date of Patent: December 25, 2018
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Li-Hui Cheng, Po-Hao Tsai, Jing-Cheng Lin, Yi-Hang Lin
  • Publication number: 20180357942
    Abstract: A display device and a display method are provided. The display device comprises a housing, a translucent module, a projecting unit and an object detection sensor. The housing comprises a containing space. The translucent module is disposed on the surface of the housing. The projecting unit is disposed in the containing space, and coupled to a controller. The projecting unit is configured to project projection light to the translucent module. The object detection sensor is disposed on the display device and coupled to the controller. When the object detection sensor senses that a moving object exists in a first preset distance range away from the housing, the object detection sensor outputs an object sensing signal to the controller. The controller controls the projecting unit and the translucent module based on the object sensing signal, so as to project a projection picture.
    Type: Application
    Filed: May 24, 2018
    Publication date: December 13, 2018
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Hsiu-Hang Lin, Pin-Yu Chou, Kai-Yi Chen, Kun-Hsuan Chang, Hsin-Chieh Cheng, Yu-Hao Tseng, Chia-Shin Weng, Dai-Yun Tsai
  • Publication number: 20180308825
    Abstract: A method for forming a chip package structure is provided. The method includes forming a chip on an adhesive layer. The chip has a front surface and a back surface opposite to the front surface. The back surface is in direct contact with the adhesive layer. A first maximum length of the adhesive layer is less than a second maximum length of the chip. The method includes forming a molding compound layer surrounding the chip and the adhesive layer. A first bottom surface of the adhesive layer is substantially coplanar with a second bottom surface of the molding compound layer. The method includes forming a redistribution structure over the chip and the molding compound layer.
    Type: Application
    Filed: March 8, 2018
    Publication date: October 25, 2018
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Li-Hui CHENG, Po-Hao TSAI, Jing-Cheng LIN, Yi-Hang LIN
  • Publication number: 20180287366
    Abstract: EMarker and associated cable and method. The cable includes a CC (configuration channel) wire, the eMarker includes an active trigger circuit and a protection circuit coupled to the active trigger circuit and the CC wire. When a second port connects a first port via the cable, if a predefined event happens, the active trigger circuit triggers the protection circuit to change an electric characteristic of the CC wire, such that the first port detects a detachment of the second port.
    Type: Application
    Filed: January 11, 2018
    Publication date: October 4, 2018
    Applicant: VIA Technologies, Inc.
    Inventors: Cheng-Chun YEH, Wei-Hang LIN, Yu-Lung LIN, Feng-Kuan SU