Abstract: Methods of packaging semiconductor devices and structures thereof are disclosed. In one embodiment, a method of packaging a semiconductor device includes providing a carrier wafer, providing a plurality of dies, and forming a die cave material over the carrier wafer. A plurality of die caves is formed in the die cave material. At least one of the plurality of dies is placed within each of the plurality of die caves in the die cave material. A plurality of packages is formed, each of the plurality of packages being formed over a respective at least one of the plurality of dies.

Abstract: A jacket for a handheld electronic device includes: a housing adapted to couple with a handheld electronic device; a fan mounted in the housing; and a control unit electrically connecting with the fan and adapted to electrically connect with the handheld electronic device, with the control unit capable of controlling the fan according to a control command outputted by the handheld electronic device.

Abstract: An embodiment of the invention provides a chip package which includes: a carrier substrate; a semiconductor substrate having an upper surface and a lower surface, disposed overlying the carrier substrate; a device region or sensing region located on the upper surface of the semiconductor substrate; a conducting pad located on the upper surface of the semiconductor substrate; a conducting layer electrically connected to the conducting pad and extending from the upper surface of the semiconductor substrate to a sidewall of the semiconductor substrate; and an insulating layer located between the conducting layer and the semiconductor substrate.

Abstract: The present disclosure proposes a reminder generating method and a mobile electronic device using the same method. In one of the exemplary embodiments, the mobile electronic device would include a display and a processor coupled to the display and is configured for displaying a first user interface of an application on a display of the mobile electronic device, converting a data source into a data stream by using the first application, receiving a keyword extracted from the data stream, analyzing the keyword to generate within the first user interface a second user interface which includes at least a first information based on the keyword, and storing the first information after the first information has been confirmed and established by the user.

Abstract: Methods of packaging semiconductor devices and structures thereof are disclosed. In one embodiment, a method of packaging a semiconductor device includes providing a carrier wafer, providing a plurality of dies, and forming a die cave material over the carrier wafer. A plurality of die caves is formed in the die cave material. At least one of the plurality of dies is placed within each of the plurality of die caves in the die cave material. A plurality of packages is formed, each of the plurality of packages being formed over a respective at least one of the plurality of dies.

Abstract: An assembled electronic apparatus and a control method thereof are provided. The assembled electronic apparatus includes a first body and a second body. A second processor shares a partial content of a sensing record generated by a sensing module through a second information sharing module. The first body and the second body are connected with each other through the first connector and the second connector. After being connected with each other, a message is transmitted by one of the first processor and the second processor to another one of the first processor and the second processor, so that a function is executed by the another one of the first processor and the second processor through the corresponding first processor or the corresponding second processor according to the message. The first processor shares a content of the sensing record generated by the sensing module through a first information sharing module.

Abstract: An embodiment of the invention provides a chip package which includes: a carrier substrate; a semiconductor substrate having an upper surface and a lower surface, disposed overlying the carrier substrate; a device region or sensing region located on the upper surface of the semiconductor substrate; a conducting pad located on the upper surface of the semiconductor substrate; a conducting layer electrically connected to the conducting pad and extending from the upper surface of the semiconductor substrate to a sidewall of the semiconductor substrate; and an insulating layer located between the conducting layer and the semiconductor substrate.

Abstract: Embodiments of the present invention provide a method for establishing an association between a STA and an AP, and the method includes: sending, by the STA, an association request frame to the AP, where the association request frame includes a service type element, and the service type element is used for indicating a sensor service type, an offloading service type, or a hybrid service type to which the STA belongs, where the sensor service type includes a first sensor service or a second sensor service, and the offloading service type includes a first offloading service or a second offloading service; and receiving, by the STA, an association response frame sent by the AP, where the association response frame is generated by the AP after determining, according to the service type element, a service type to which the STA belongs.

Abstract: A protective cover for a hand-held electronic device includes a base having an inner face and an outer face opposite to the inner face. The base further includes at least one air guiding hole extending from the inner face through the outer face. A positioning member is provided along a periphery of the base. The positioning member and the base together define a receiving space. A cooling module is mounted in the receiving space. The cooling module includes a cooling fan and a flow guiding portion. The cooling fan and the flow guiding portion are fixed to the inner face of the base. The cooling fan includes an air outlet adjoining the flow guiding portion. The flow guiding portion includes a flow guiding face having at least one non-parallel face at a non-parallel angle to the inner face.

Abstract: An axial flow fan is provided. The axial flow fan includes an impeller and a fan frame. The impeller has a maximum outer diameter. The fan frame includes a first body and a second body. The first body includes a plurality of connecting elements and a base. The connecting elements are connected to the base. The second body is a hollow body, and used for disposing around the impeller. The second body includes a flow passage having a minimum inner diameter. The minimum inner diameter of the flow passage is not larger than the maximum outer diameter of the impeller. Therefore, the size of the second body does not restrict the maximum outer diameter of the impeller, and the shape of the impeller and the shape of the fan frame can be designed flexibly according to the practical demand.

Abstract: An embodiment integrated circuit structure includes a substrate, a metal pad over the substrate, a post-passivation interconnect (PPI) structure over the substrate and electronically connected to the metal pad, a thin oxide film layer directly over a top surface of the PPI structure, and a polymer layer over the thin oxide film layer and PPI structure.

Abstract: A method for operating an electronic device, in which the electronic device includes a drag sensor, a display unit and a processing unit electrically connected with the drag sensor and the display unit. The method includes: (a) sensing a drag track by utilizing the drag sensor; (b) calculating a drag length of the drag track by utilizing the processing unit; and (c) when the drag length is within a preset range, displaying at least one datum of a first level on the display unit, or otherwise displaying at least one datum of a second level on the display unit.

Abstract: A method for searching data and a method for planning itinerary are provided. At least one contact is selected from a contact list so as to set a point of interest (POI) list associated with the at least one contact as a specific data source. A POI category is decided. A preset search range is obtained based on a reference location so as to search the specific data source for obtaining a search result conformed to the POI category and the preset search range, and the search result is displayed.

Abstract: An embodiment of the invention provides a chip package which includes: a carrier substrate; a semiconductor substrate having an upper surface and a lower surface, disposed overlying the carrier substrate; a device region or sensing region located on the upper surface of the semiconductor substrate; a conducting pad located on the upper surface of the semiconductor substrate; a conducting layer electrically connected to the conducting pad and extending from the upper surface of the semiconductor substrate to a sidewall of the semiconductor substrate; and an insulating layer located between the conducting layer and the semiconductor substrate.

Abstract: A molding machine includes a machine table, a mold unit and a pair of positioning units. The mold unit includes first and second molds mounted on the machine table and movable between a mold-closing position and a mold-opening position. The first and second molds abut against each other in the mold-closing position. Each of the positioning units includes a first positioner connected to the first mold, and a second positioner connected to the second mold. When the first and second molds are in the mold-closing position, the first and second positioners are operable to move to a locked state, where the first positioner is held by the second positioner to restrain the first and second molds from deforming away from each other.

Abstract: Provided are activated collagen scaffold materials as well as their special fused active restoration factors useful for promoting tissue repair, such as bone damage repair or nerve injury repair.

Abstract: Provided are activated collagen scaffold materials as well as their special fused active restoration factors useful for promoting tissue repair, such as bone damage repair or nerve injury repair.

Abstract: A cooling fan having a radial-air-gap motor is disclosed. The cooling fan includes a fan frame, an impeller and a stator assembly. The fan frame has a shaft-coupling portion. The impeller has a hub, a shaft and a plurality of blades. The blades are arranged on an outer periphery of the hub. At least one magnetic element is arranged on an inner periphery of the hub. There is a height between a bottom face of the shaft-coupling portion and a top face of the hub. There is a maximum thickness between the bottommost and uppermost faces of the magnetic plate unit. A ratio of the maximum thickness to the height is between 0.1 and 0.6. A method for determining the dimensional proportion of the motor is also disclosed. The method selects a ratio of a maximum thickness to a height as 0.1 to 0.6.

Abstract: An embodiment integrated circuit structure includes a substrate, a metal pad over the substrate, a post-passivation interconnect (PPI) structure over the substrate and electronically connected to the metal pad, a thin oxide film layer directly over a top surface of the PPI structure, and a polymer layer over the thin oxide film layer and PPI structure.

Abstract: An electronic apparatus with a touch input system is provided. When a complete touch signal is detected, a sliding angle and a sliding track of the complete touch signal are calculated. A menu operation interface with arc-shaped arrangement is displayed in a touch display screen when the sliding angle of the complete touch signal exceeds a predetermined angle. And when an incomplete touch signal is detected, a sliding angle and a sliding track of the incomplete touching signal are calculated for displaying a part of the menu operation interface with arc-shaped arrangement in the touch display screen.