Abstract: The invention provides a facial image adjustment system and a facial image adjustment method. The facial image adjustment method comprises following steps: obtaining a image file; storing at least one known facial image and at least one adjustment parameter set corresponding to the at least one known facial image; and adjusting a first initial facial image corresponding to the at least one known facial image according to the at least one adjustment parameter set of the at least one known facial image in respond to recognize the image file comprising the first initial facial image corresponding to the at least one known facial image, so as to output a post-production facial image.

Abstract: An aerial vehicle and a propeller thereof are provided. The propeller includes a hub and at least one blade. The hub is rotatable about a shaft, and the blade is mounted to the hub. The blade extends from the hub to a tip along a first direction and has a leading edge and a tailing edge opposite to the leading edge. The blade has a section along a second direction in an arbitrary position along the first direction. The second direction is perpendicular to the first direction. A section of the blade in a first position along the first direction has a first peak value of chord length, and a section of the blade in a second position along the first direction has a second peak value of chord length. The second position is between the first position and the tip.

Abstract: Embodiments of the present invention provide a method for establishing an association between a STA and an AP, and the method includes: sending, by the STA, an association request frame to the AP, where the association request frame includes a service type element, and the service type element is used for indicating a sensor service type, an offloading service type, or a hybrid service type to which the STA belongs, where the sensor service type includes a first sensor service or a second sensor service, and the offloading service type includes a first offloading service or a second offloading service; and receiving, by the STA, an association response frame sent by the AP, where the association response frame is generated by the AP after determining, according to the service type element, a service type to which the STA belongs.

Abstract: A chip package structure is provided. The chip package structure includes a redistribution structure. The chip package structure includes a first chip over the redistribution structure. The first chip has a front surface and a back surface opposite to the front surface, and the front surface faces the redistribution structure. The chip package structure includes an adhesive layer on the back surface. The adhesive layer is in direct contact with the back surface, and a first maximum length of the adhesive layer is less than a second maximum length of the first chip. The chip package structure includes a molding compound layer over the redistribution structure and surrounding the first chip and the adhesive layer. A first top surface of the adhesive layer is substantially coplanar with a second top surface of the molding compound layer.

Abstract: An axial flow fan is provided. The axial flow fan includes an impeller and a fan frame. The impeller has a maximum outer diameter. The fan frame includes a first body and a second body. The first body includes a plurality of connecting elements and a base. The connecting elements are connected to the base. The second body is a hollow body, and used for disposing around the impeller. The second body includes a flow passage having a minimum inner diameter. The minimum inner diameter of the flow passage is not larger than the maximum outer diameter of the impeller. Therefore, the size of the second body does not restrict the maximum outer diameter of the impeller, and the shape of the impeller and the shape of the fan frame can be designed flexibly according to the practical demand.

Abstract: A cooling system for a hand-held electronic device includes a casing including a compartment, at least one air inlet in communication with the compartment, and at least one air outlet in communication with the compartment. A wind driving assembly is mounted in the compartment and includes a frame, a package, and a thermally conductive cover. The thermally conductive cover engages with the frame and the package. An impeller is rotatably arranged in the frame having an outlet hole adjacent to the at least one air outlet. The package receives at least one electronic element that generates heat during operation. The thermally conductive cover includes an inlet hole in communication with an interior of the frame. An air channel is formed between the thermally conductive cover and an interior wall face of the casing. The at least one air inlet intercommunicates with the inlet hole via the air channel.

Abstract: Embodiments of the present invention provide a method for establishing an association between a STA and an AP, and the method includes: sending, by the STA, an association request frame to the AP, where the association request frame includes a service type element, and the service type element is used for indicating a sensor service type, an offloading service type, or a hybrid service type to which the STA belongs, where the sensor service type includes a first sensor service or a second sensor service, and the offloading service type includes a first offloading service or a second offloading service; and receiving, by the STA, an association response frame sent by the AP, where the association response frame is generated by the AP after determining, according to the service type element, a service type to which the STA belongs.

Abstract: Methods of packaging semiconductor devices and structures thereof are disclosed. In one embodiment, a method of packaging a semiconductor device includes providing a carrier wafer, providing a plurality of dies, and forming a die cave material over the carrier wafer. A plurality of die caves is formed in the die cave material. At least one of the plurality of dies is placed within each of the plurality of die caves in the die cave material. A plurality of packages is formed, each of the plurality of packages being formed over a respective at least one of the plurality of dies.

Abstract: A centrifugal fan includes a fan frame, a stator assembly and an impeller. The fan frame has a base plate portion, a cover plate portion and a lateral wall portion. The cover plate portion includes first and second faces. The cover plate portion includes an air inlet, and the lateral wall portion includes an air outlet. The impeller has a radial rotational range. The cover plate portion includes an air-guiding section and an enlarged guiding section. The air-guiding section is aligned with the radial rotational range, and the enlarged guiding section is aligned with an area outside the radial rotational range. A part of the second face is spaced from a bottom of the base plate portion by a first minimal axial distance, and another part of the second face is spaced from the bottom by a second minimal axial distance smaller than the first minimal axial distance.

Abstract: An assembled electronic apparatus and a control method thereof are provided. The assembled electronic apparatus includes a first body and a second body. A second processor shares a partial content of a sensing record generated by a sensing module through a second information sharing module. The first body and the second body are connected with each other through the first connector and the second connector. After being connected with each other, a message is transmitted by one of the first processor and the second processor to another one of the first processor and the second processor, so that a function is executed by the another one of the first processor and the second processor through the corresponding first processor or the corresponding second processor according to the message. The first processor shares a content of the sensing record generated by the sensing module through a first information sharing module.

Abstract: Methods of packaging semiconductor devices and structures thereof are disclosed. In one embodiment, a method of packaging a semiconductor device includes providing a carrier wafer, providing a plurality of dies, and forming a die cave material over the carrier wafer. A plurality of die caves is formed in the die cave material. At least one of the plurality of dies is placed within each of the plurality of die caves in the die cave material. A plurality of packages is formed, each of the plurality of packages being formed over a respective at least one of the plurality of dies.

Abstract: The invention provides a facial image adjustment system and a facial image adjustment method. The facial image adjustment method comprises following steps: obtaining a image file; storing at least one known facial image and at least one adjustment parameter set corresponding to the at least one known facial image; and adjusting a first initial facial image corresponding to the at least one known facial image according to the at least one adjustment parameter set of the at least one known facial image in respond to recognize the image file comprising the first initial facial image corresponding to the at least one known facial image, so as to output a post-production facial image.

Abstract: Methods of packaging semiconductor devices and structures thereof are disclosed. In one embodiment, a method of packaging a semiconductor device includes providing a carrier wafer, providing a plurality of dies, and forming a die cave material over the carrier wafer. A plurality of die caves is formed in the die cave material. At least one of the plurality of dies is placed within each of the plurality of die caves in the die cave material. A plurality of packages is formed, each of the plurality of packages being formed over a respective at least one of the plurality of dies.

Abstract: The present disclosure proposes a reminder generating method and a mobile electronic device using the same method. In one of the exemplary embodiments, the mobile electronic device would include a display and a processor coupled to the display and is configured for displaying a first user interface of an application on a display of the mobile electronic device, converting a data source into a data stream by using the first application, receiving a keyword extracted from the data stream, analyzing the keyword to generate within the first user interface a second user interface which includes at least a first information based on the keyword, and storing the first information after the first information has been confirmed and established by the user.

Abstract: A programmable cable and a programming method thereof are provided. The method includes: receiving a power signal and register setting data respectively through a first setting pin and a second setting pin from a downstream facing port; and accessing a register of a connector of the programmable cable according to the register setting data so as to write the register setting data into a non-volatile memory.

Abstract: Methods of packaging semiconductor devices and structures thereof are disclosed. In one embodiment, a method of packaging a semiconductor device includes providing a carrier wafer, providing a plurality of dies, and forming a die cave material over the carrier wafer. A plurality of die caves is formed in the die cave material. At least one of the plurality of dies is placed within each of the plurality of die caves in the die cave material. A plurality of packages is formed, each of the plurality of packages being formed over a respective at least one of the plurality of dies.

Abstract: Disclosed herein are various bioreactor devices and systems for growing cellular material, and related methods of growing cellular material. In some cases, a system can include a well plate having a plurality of wells and a bioreactor situated in each well of the well plate. In some cases, a bioreactor can include an inner body which divides the bioreactor into several distinct chambers and facilitates the growth of a multi-tissue sample in the bioreactor. In some cases, a system can include a mechanical actuator situated to mechanically stress tissues grown in a bioreactor.

Abstract: Provided are activated collagen scaffold materials as well as their special fused active restoration factors useful for promoting tissue repair, such as bone damage repair or nerve injury repair. The special fused active restoration factors are fusion proteins comprising a collagen-binding domain (CBD) at N-/C-terminus of cytokines, wherein the collagen-binding domain is a polypeptide consisting of 7-27 amino acid residues with a conservative sequence shown in SEQ ID NO:4 at N-terminus.

Abstract: Provided are activated collagen scaffold materials as well as their special fused active restoration factors useful for promoting tissue repair, such as bone damage repair or nerve injury repair. The special fused active restoration factors are fusion proteins comprising a collagen-binding domain (CBD) at N-/C-terminus of cytokines, wherein the collagen-binding domain is a polypeptide consisting of 7-27 amino acid residues with a conservative sequence shown in SEQ ID NO:12 at N-terminus.

Abstract: Described herein are methods of fabricating human cell-based engineered musculoskeletal tissues (hCEMTs) using three dimensional fabrication technology that involves injectable materials with in situ polymerization/solidification capability and/or solid free-form fabrication. Also described is the usage of hCEMTs for tissue repair and drug testing.