Abstract: A cooling system for a hand-held electronic device includes a casing including a compartment, at least one air inlet in communication with the compartment, and at least one air outlet in communication with the compartment. A wind driving assembly is mounted in the compartment and includes a frame, a package, and a thermally conductive cover. The thermally conductive cover engages with the frame and the package. An impeller is rotatably arranged in the frame having an outlet hole adjacent to the at least one air outlet. The package receives at least one electronic element that generates heat during operation. The thermally conductive cover includes an inlet hole in communication with an interior of the frame. An air channel is formed between the thermally conductive cover and an interior wall face of the casing. The at least one air inlet intercommunicates with the inlet hole via the air channel.

Abstract: Provided are activated collagen scaffold materials as well as their special fused active restoration factors useful for promoting tissue repair, such as bone damage repair or nerve injury repair. The special fused active restoration factors are fusion proteins comprising a collagen-binding domain (CBD) at N-/C-terminus of cytokines, wherein the collagen-binding domain is a polypeptide consisting of 7-27 amino acid residues with a conservative sequence shown in SEQ ID NO:1 at N-terminus.

Abstract: A method for switching applications in a user interface and an electronic apparatus using the same are disclosed herein. The method includes the following steps. Firstly, execute a first application after being unlocked, and detect a sliding operation. Next, determine whether the sliding operation matches a first direction or a second direction. If yes, correspondingly displaying an icon page of a second application. Afterwards, determine whether the sliding operation matching the first direction or the second direction is detected again in a predetermined time. If no, executing the second application.

Abstract: A centrifugal fan includes a fan frame, a stator assembly and an impeller. The fan frame has a base plate portion, a cover plate portion and a lateral wall portion. The cover plate portion includes first and second faces. The cover plate portion includes an air inlet, and the lateral wall portion includes an air outlet. The impeller has a radial rotational range. The cover plate portion includes an air-guiding section and an enlarged guiding section. The air-guiding section is aligned with the radial rotational range, and the enlarged guiding section is aligned with an area outside the radial rotational range. A part of the second face is spaced from a bottom of the base plate portion by a first minimal axial distance, and another part of the second face is spaced from the bottom by a second minimal axial distance smaller than the first minimal axial distance.

Abstract: An advection fan includes a fan frame, an impeller and a cover plate. The fan frame has a bottom plate and a lateral wall. A shaft seat is arranged on the bottom plate. The lateral wall surrounds the shaft seat and has an inner peripheral face. The lateral wall includes first and second air-guiding portions. An air inlet and an air outlet are formed between the first and second air-guiding portions. The first air-guiding portion includes a first guiding face intersecting the inner peripheral face by a first included angle, which is smaller than 180 degrees. The second air-guiding portion includes a second guiding face. A distance between the first and second guiding faces is gradually reduced from the air inlet towards the center of the fan frame. The impeller is rotatably coupled with the shaft seat. The cover plate is coupled with the lateral wall.

Abstract: An embodiment of the invention provides a chip package which includes: a carrier substrate; a semiconductor substrate having an upper surface and a lower surface, disposed overlying the carrier substrate; a device region or sensing region located on the upper surface of the semiconductor substrate; a conducting pad located on the upper surface of the semiconductor substrate; a conducting layer electrically connected to the conducting pad and extending from the upper surface of the semiconductor substrate to a sidewall of the semiconductor substrate; and an insulating layer located between the conducting layer and the semiconductor substrate.

Abstract: An embodiment of the invention provides a chip package which includes: a carrier substrate; a semiconductor substrate having an upper surface and a lower surface, disposed overlying the carrier substrate; a device region or sensing region located on the upper surface of the semiconductor substrate; a conducting pad located on the upper surface of the semiconductor substrate; a conducting layer electrically connected to the conducting pad and extending from the upper surface of the semiconductor substrate to a sidewall of the semiconductor substrate; and an insulating layer located between the conducting layer and the semiconductor substrate.

Abstract: Methods of packaging semiconductor devices and structures thereof are disclosed. In one embodiment, a method of packaging a semiconductor device includes providing a carrier wafer, providing a plurality of dies, and forming a die cave material over the carrier wafer. A plurality of die caves is formed in the die cave material. At least one of the plurality of dies is placed within each of the plurality of die caves in the die cave material. A plurality of packages is formed, each of the plurality of packages being formed over a respective at least one of the plurality of dies.

Abstract: An electronic apparatus with a touch input system is provided. When a complete touch signal is detected, a sliding angle and a sliding track of the complete touch signal are calculated. A menu operation interface with arc-shaped arrangement is displayed in a touch display screen when the sliding angle of the complete touch signal exceeds a predetermined angle. And when an incomplete touch signal is detected, a sliding angle and a sliding track of the incomplete touching signal are calculated for displaying a part of the menu operation interface with arc-shaped arrangement in the touch display screen.

Abstract: A molding machine includes two holding arms mounted on a base unit, connected respectively to two molds, and operable to move the molds between a mold closing state and a mold opened state. The molding machine further includes an adjusting seat mounted on the base unit and movable relative to a threaded shaft that is rotated by a power supply, a swing arm connected pivotally to the adjusting seat, a linkage unit having opposite end parts that are connected pivotally and respectively to a pivot portion of the swing arm and one of the holding arms, and another linkage unit having opposite end parts that are connected pivotally and respectively to another pivot portion of the swing arm and the other one of the holding arms. The swing arm is swingable through the movement of the adjusting seat so as to swing the holding arms by virtue of the linkage units.

Abstract: An embodiment of the invention provides a chip package which includes: a carrier substrate; a semiconductor substrate having an upper surface and a lower surface, disposed overlying the carrier substrate; a device region or sensing region located on the upper surface of the semiconductor substrate; a conducting pad located on the upper surface of the semiconductor substrate; a conducting layer electrically connected to the conducting pad and extending from the upper surface of the semiconductor substrate to a sidewall of the semiconductor substrate; and an insulating layer located between the conducting layer and the semiconductor substrate.

Abstract: A molding machine includes two holding arms mounted on a base unit, connected respectively to two molds, and operable to move the molds between a mold closing state and a mold opened state. The molding machine further includes an adjusting seat mounted on the base unit and movable relative to a threaded shaft that is rotated by a power supply, a swing arm connected pivotally to the adjusting seat, a linkage unit having opposite end parts that are connected pivotally and respectively to a pivot portion of the swing arm and one of the holding arms, and another linkage unit having opposite end parts that are connected pivotally and respectively to another pivot portion of the swing arm and the other one of the holding arms. The swing arm is swingable through the movement of the adjusting seat so as to swing the holding arms by virtue of the linkage units.

Abstract: An electric hollow molding machine includes left and right molds, two operating arms connected respectively to the molds, a drive shaft unit driven by a power source to rotate, a movable seat including two first mounting sections to mount pivotally one operating arm to the movable seat, a threaded rod rotated by the drive shaft unit, a sleeve moved leftward or rightward by the threaded rod, first and second transmission seats movable along with the sleeve, at least one connecting shaft having one end connected to the second transmission seat, and a second mounting section connected to another end of the connecting shaft to mount pivotally the other operating arm to the connecting shaft. When the movable seat and the second transmission seat move telescopically relative to each other, the operating arms move the molds toward or away from each other to a mold closing or opening position.

Abstract: Molding machines and methods of performing molding processes are described. One embodiment includes a base, a carriage disposed movably on the base, a first mold secured immovably to the carriage, a second mold disposed slidably on the carriage, a driving unit for moving the second mold on the carriage and toward and away from the first mold, a push shaft inserted telescopically into a pressure cylinder and pushing the second mold against the first mold, a synchronous transmission unit for moving said carriage synchronously with the second mold so that the first mold is moved to said second mold, and a pressure booster including a booster tube, and a telescopic booster rod extendable into the booster tube to transfer pressure in the booster tube to the pressure cylinder so as to boost the pressure inside the pressure cylinder.

Abstract: Provided are activated collagen scaffold materials as well as their special fused active restoration factors useful for promoting tissue repair, such as bone damage repair or nerve injury repair. The special fused active restoration factors are fusion proteins comprising a collagen-binding domain (CBD) at N-/C-terminus of cytokines, wherein the collagen-binding domain is a polypeptide consisting of 7-27 amino acid residues with a conservative sequence shown in SEQ IN NO:1 at N-terminus.

Abstract: A method of encoding and decoding image data by applying an image capturing device includes generating a difference coding group, applying an modified Hadamard transform (MHT) on the difference coding group to generate a corresponding low-frequency parameter and a plurality of corresponding high-frequency parameters, adjusting the low-frequency parameter, adjusting the high-frequency parameters by a quantification factor, decoding the low-frequency parameter, decoding the high-frequency parameters by the quantification factor, and applying an inverse modified Hadamard transform (IMHT) on the low-frequency parameter and the high-frequency parameters to decode the difference coding group.

Abstract: Molding machines and methods of performing molding processes are described. One embodiment includes a base, a carriage disposed movably on the base, a first mold secured immovably to the carriage, a second mold disposed slidably on the carriage, a driving unit for moving the second mold on the carriage and toward and away from the first mold, a push shaft inserted telescopically into a pressure cylinder and pushing the second mold against the first mold, a synchronous transmission unit for moving said carriage synchronously with the second mold so that the first mold is moved to said second mold, and a pressure booster including a booster tube, and a telescopic booster rod extendable into the booster tube to transfer pressure in the booster tube to the pressure cylinder so as to boost the pressure inside the pressure cylinder.

Abstract: A method of encoding and decoding image data by applying an image capturing device includes generating a difference coding group, applying an modified Hadamard transform (MHT) on the difference coding group to generate a corresponding low-frequency parameter and a plurality of corresponding high-frequency parameters, adjusting the low-frequency parameter, adjusting the high-frequency parameters by a quantification factor, decoding the low-frequency parameter, decoding the high-frequency parameters by the quantification factor, and applying an inverse modified Hadamard transform (IMHT) on the low-frequency parameter and the high-frequency parameters to decode the difference coding group.