Patents by Inventor Hans Hsu

Hans Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240154943
    Abstract: Apparatus, systems, and methods a crypto chat social software system can use the user's biological information to ensure the security of the account through a secure encryption method, which is not easy to be cracked, so that the user can fully control the security of his account. Encryption on each data generated by the user's application of social chat software is performed to ensure that only the users themselves can view the application's data and digital assets. The server storage can be decentralized in that al data stored and backed up are encrypted information. Accordingly, users' private data and digital assets cannot be stolen and abused. At the same time, the user's data will not be affected, the user still owns, and only the user owns their private data and digital assets.
    Type: Application
    Filed: November 4, 2022
    Publication date: May 9, 2024
    Inventors: Ye Zhao, Shihao Li, Han Qin, Zhen Sun, Hao Hsu, Jiayang Qin
  • Publication number: 20240147405
    Abstract: A controlling method for a wireless communication device is provided. The controlling method for the wireless communication device includes: attaching a first Universal Subscriber Identity Module (USIM) to a Long-Term Evolution (LTE) network; determining whether a second USIM is camped on the LTE network; detecting whether a paging collision is happened, if the second USIM is camped on the LTE network; generating a requested International Mobile Subscriber Identity (IMSI) offset for the second USIM, if the paging collision is happened, wherein the requested IMSI offset is 1 or min(T, nB)?1, T is a default paging period and nB is a number of paging occurrences within the default paging period; transmitting an attach request with the requested IMSI offset to the LTE network for the second USIM; receiving a negotiated IMSI offset from the LTE network; and attaching the second USIM to the LTE network with the negotiated IMSI offset.
    Type: Application
    Filed: November 1, 2023
    Publication date: May 2, 2024
    Inventors: Kuan-Yu LIN, Ya-ling Hsu, Wan-Ting Huang, Yi-Han CHUNG, Yi-Cheng CHEN
  • Publication number: 20240132085
    Abstract: Devices, systems, and methods for redundant braking systems and architectures are described. An example method for controlling a vehicle includes receiving, by a braking system, a first set of commands generated by a primary brake controller and a primary vehicle control unit (VCU) comprising multiple processors, receiving a second set of commands generated by the primary VCU and a secondary brake controller, receiving a third set of commands generated by a secondary VCU and the primary brake controller, receiving a fourth set of commands generated by the secondary VCU and the secondary brake controller, and selecting, based on an arbitration logic, exactly one of the first, second, third, and fourth sets of commands to operate the braking system, wherein the primary VCU and the secondary VCU are configured in a master/slave architecture.
    Type: Application
    Filed: December 20, 2023
    Publication date: April 25, 2024
    Inventors: Yu-Ju HSU, Xiaoling HAN
  • Publication number: 20240137592
    Abstract: An information processing method of the present disclosure includes: via one or more computer processors, receiving data relating to live sales performed by a livestreamer via live video streaming; inputting the data into a machine learning model; and based on a result generated by the machine learning model, obtaining promotional information that is useful for the livestreamer to perform the live sales.
    Type: Application
    Filed: October 10, 2023
    Publication date: April 25, 2024
    Inventors: Yung-Chi HSU, Chia-Han CHANG, Chen-Hai TENG
  • Patent number: 11967652
    Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 ?m. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.
    Type: Grant
    Filed: February 16, 2023
    Date of Patent: April 23, 2024
    Assignee: TONG HSING ELECTRONIC INDUSTRIES, LTD.
    Inventors: Fu-Chou Liu, Jui-Hung Hsu, Yu-Chiang Peng, Chien-Chen Lee, Ya-Han Chang, Li-Chun Hung
  • Patent number: 11957844
    Abstract: The present invention provides for an improved method of determining a water out condition in a humidified gases supply apparatus. The method includes a two step process including a primary determination of a water out condition and a secondary determination of a water out condition. This primary determination is made during observation of the normal operation of the apparatus. During the secondary determination the method takes temporary control over the humidifying part of the apparatus. The secondary determination confirms or contradicts the primary determination.
    Type: Grant
    Filed: April 27, 2023
    Date of Patent: April 16, 2024
    Assignee: Fisher & Paykel Healthcare Limited
    Inventors: Dean Antony Barker, Jack Che-Wei Hsu, Jae Chul Han
  • Patent number: 11961707
    Abstract: The present disclosure describes a system and a method for providing a mixed gas to an ion implantation tool. The system includes a water supply, an electrical source, a gas generator. The gas generator is configured to generate a first gas from the water supply and the electrical source. The system also includes a first flow controller configured to control a first flow rate of the first gas, a gas container to provide a second gas, a second flow controller configured to control a second flow rate of the second gas, and a gas pipe configured to mix the first and second gases into a mixed gas. The mixed gas can be delivered to, for example, an ion source head of the ion implantation tool.
    Type: Grant
    Filed: December 12, 2022
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Hsing-Piao Hsu, Nai-Han Cheng, Ping-Chih Ou
  • Publication number: 20240120277
    Abstract: A chip structure is provided. The chip structure includes a substrate, a redistribution layer over the substrate, a bonding pad over the redistribution layer, a shielding pad over the redistribution layer and surrounding the bonding pad, an insulating layer over the redistribution layer and the shielding pad, and a bump over the bonding pad and the insulating layer. The insulating layer includes a first part and a second part surrounded by the first part, the first part has first thickness, the second part has a second thickness, and the first thickness and the second thickness are different.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 11, 2024
    Inventors: Hong-Seng SHUE, Sheng-Han TSAI, Kuo-Chin CHANG, Mirng-Ji LII, Kuo-Ching HSU
  • Patent number: 11953400
    Abstract: A pressure sensing unit is provided. The pressure sensing unit includes a membrane and a pressure sensing pad group. The membrane has a first surface and a second surface. The pressure sensing pad group includes a first pressure sensing pad, a second pressure sensing pad, and a ground pad that are spaced apart from one another. The ground pad and one among the first pressure sensing pad and the second pressure sensing pad are located at the first surface of the membrane, another one among the first pressure sensing pad and the second pressure sensing pad is located at the second surface of the membrane, and an orthographic projection of the ground pad projected onto a reference plane is located between orthographic projections of the first pressure sensing pad and the second pressure sensing pad that are projected onto the reference plane. Therefore, a signal-to-noise ratio can be increased and an erroneous detection can be prevented.
    Type: Grant
    Filed: May 2, 2023
    Date of Patent: April 9, 2024
    Assignee: PIXART IMAGING INC.
    Inventors: Che-Chia Hsu, Yu-Han Chen, Chi-Chieh Liao
  • Patent number: 11955439
    Abstract: A semiconductor package includes a semiconductor die, a redistribution structure and connective terminals. The redistribution structure is disposed on the semiconductor die and includes a first metallization tier disposed in between a pair of dielectric layers. The first metallization tier includes routing conductive traces electrically connected to the semiconductor die and a shielding plate electrically insulated from the semiconductor die. The connective terminals include dummy connective terminals and active connective terminals. The dummy connective terminals are disposed on the redistribution structure and are electrically connected to the shielding plate. The active connective terminals are disposed on the redistribution structure and are electrically connected to the routing conductive traces. Vertical projections of the dummy connective terminals fall on the shielding plate.
    Type: Grant
    Filed: January 17, 2023
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Cheng Wu, Chien-Chia Chiu, Cheng-Hsien Hsieh, Li-Han Hsu, Meng-Tsan Lee, Tsung-Shu Lin
  • Patent number: 11956972
    Abstract: A semiconductor memory device includes a substrate having a memory area and a logic circuit area thereon, a first interlayer dielectric layer on the substrate, and a second interlayer dielectric layer on the substrate. An embedded memory cell structure is disposed within the memory area between the first interlayer dielectric layer and the second interlayer dielectric layer. The second interlayer dielectric layer includes a first portion covering the embedded memory cell structure within the memory area and a second portion covering the logic circuit area. A top surface of the first portion is coplanar with a top surface of the second portion.
    Type: Grant
    Filed: April 13, 2021
    Date of Patent: April 9, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Si-Han Tsai, Ching-Hua Hsu, Chen-Yi Weng, Po-Kai Hsu
  • Patent number: 11944486
    Abstract: An analysis method and an electronic apparatus for breast image are provided. The method includes the following steps. One or more breast ultrasound images are obtained. The breast ultrasound images are used for forming a three-dimensional (3D) breast model. A volume of interest (VOI) in the breast ultrasound image is obtained by applying a detection model on the 3D breast model. The VOI is compared with a tissue segmentation result. The VOI is determined as a false positive according to a compared result between the VOI and the tissue segmentation result. The compared result includes that the VOI is located at a glandular tissue based on the tissue segmentation result. In response to the VOI being located in the glandular tissue of the tissue segmentation result, the VOI is compared with the lactiferous duct in the 3D breast model.
    Type: Grant
    Filed: July 19, 2021
    Date of Patent: April 2, 2024
    Assignee: TAIHAO MEDICAL INC.
    Inventors: Jen-Feng Hsu, Hong-Hao Chen, Rong-Tai Chen, Hsin-Hung Lai, Wei-Han Teng
  • Patent number: 11940388
    Abstract: Example methods are provided to improve placement of an adaptor (210,220) to a mobile computing device (100) to measure a test strip (221) coupled to the adaptor (220) with a camera (104) and a screen (108) on a face of the mobile computing device (100). The method may include displaying a light area on a first portion of the screen (108). The first portion may be adjacent to the camera (104). The light area and the camera (104) may be aligned with a key area of the test strip (221) so that the camera (104) is configured to capture an image of the key area. The method may further include providing first guiding information for a user to place the adaptor (210,220) to the mobile computing device (100) according to a position of the light area on the screen (108).
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: March 26, 2024
    Assignee: IXENSOR CO., LTD.
    Inventors: Yenyu Chen, An Cheng Chang, Tai I Chen, Su Tung Yang, Chih Jung Hsu, Chun Cheng Lin, Min Han Wang, Shih Hao Chiu
  • Publication number: 20240099154
    Abstract: A magnetoresistive random access memory (MRAM) device includes a first array region and a second array region on a substrate, a first magnetic tunneling junction (MTJ) on the first array region, a first top electrode on the first MTJ, a second MTJ on the second array region, and a second top electrode on the second MTJ. Preferably, the first top electrode and the second top electrode include different nitrogen to titanium (N/Ti) ratios.
    Type: Application
    Filed: November 21, 2023
    Publication date: March 21, 2024
    Applicant: UNITED MICROELECTRONICS CORP
    Inventors: Hui-Lin Wang, Si-Han Tsai, Dong-Ming Wu, Chen-Yi Weng, Ching-Hua Hsu, Ju-Chun Fan, Yi-Yu Lin, Che-Wei Chang, Po-Kai Hsu, Jing-Yin Jhang
  • Patent number: 11931187
    Abstract: A method for predicting clinical severity of a neurological disorder includes steps of: a) identifying, according to a magnetic resonance imaging (MRI) image of a brain, brain image regions each of which contains a respective portion of diffusion index values of a diffusion index, which results from image processing performed on the MRI image; b) for one of the brain image regions, calculating a characteristic parameter based on the respective portion of the diffusion index values; and c) calculating a severity score that represents the clinical severity of the neurological disorder of the brain based on the characteristic parameter of the one of the brain image regions via a prediction model associated with the neurological disorder.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: March 19, 2024
    Assignees: Chang Gung Medical Foundation Chang Gung Memorial Hospital at Keelung, Chang Gung Memorial Hospital, Linkou, Chang Gung University
    Inventors: Jiun-Jie Wang, Yi-Hsin Weng, Shu-Hang Ng, Jur-Shan Cheng, Yi-Ming Wu, Yao-Liang Chen, Wey-Yil Lin, Chin-Song Lu, Wen-Chuin Hsu, Chia-Ling Chen, Yi-Chun Chen, Sung-Han Lin, Chih-Chien Tsai
  • Publication number: 20240088054
    Abstract: A carrier structure is provided with a plurality of package substrates connected via connecting sections, and a functional element and a groove are formed on the connecting section, such that the groove is located between the package substrate and the functional element. Therefore, when a cladding layer covering a chip is formed on the package substrate, the groove can accommodate a glue material overflowing from the cladding layer to prevent the glue material from contaminating the functional element.
    Type: Application
    Filed: December 8, 2022
    Publication date: March 14, 2024
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Shu-Ting LAI, Chiu-Lien LI, Che-Min SU, Chun-Huan HUNG, Mu-Hung HSIEH, Cheng-Han YAO, Fajanilan Darcyjo Directo, Cheng-Liang HSU
  • Patent number: 11929314
    Abstract: In some implementations, one or more semiconductor processing tools may form a metal cap on a metal gate. The one or more semiconductor processing tools may form one or more dielectric layers on the metal cap. The one or more semiconductor processing tools may form a recess to the metal cap within the one or more dielectric layers. The one or more semiconductor processing tools may perform a bottom-up deposition of metal material on the metal cap to form a metal plug within the recess and directly on the metal cap.
    Type: Grant
    Filed: March 12, 2021
    Date of Patent: March 12, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Hsien Huang, Peng-Fu Hsu, Yu-Syuan Cai, Min-Hsiu Hung, Chen-Yuan Kao, Ken-Yu Chang, Chun-I Tsai, Chia-Han Lai, Chih-Wei Chang, Ming-Hsing Tsai
  • Publication number: 20240078170
    Abstract: A setting method of in-memory computing simulator includes: performing a plurality of test combinations by an in-memory computing device and recording a plurality of first estimation indices corresponding to the plurality of test combinations respectively, wherein each of the plurality of test combinations includes one of a plurality of neural network models and one of a plurality of datasets, executing a simulator according to the plurality of test combinations by a processing device and recording a plurality of second estimation indices corresponding to the plurality of test combinations respectively, wherein the simulator has a plurality of adjustable settings; calculating a correlation sum according to the plurality of first estimation indices and the plurality of second estimation indices by the processing device, and performing an optimal algorithm to search an optimal parameter in the setting space constructed by the plurality of settings so that the correlation sum is maximal.
    Type: Application
    Filed: November 21, 2022
    Publication date: March 7, 2024
    Inventors: Ke-Han Li, Chih-Fan Hsu, Yu-Sheng Lin, Wei-Chao CHEN
  • Publication number: 20240079758
    Abstract: An electronic device includes a metal back cover, a metal frame, and a first, second, third, and fourth radiators. The metal frame includes a discrete part and two connection parts. The connection parts are located by two sides of the discrete part, separated from the discrete part, and connected to the metal back cover. A U-shaped slot is formed between the discrete part and the metal back cover and between the discrete part and the connection parts. The first radiator is separated from the discrete part and includes a feed end. The second, third, and fourth radiators are connected to the discrete part and the metal back cover. The third radiator is located between the first and second radiators. The first radiator is located between the third and fourth radiators. The discrete part and the first, second, third, and fourth radiators form an antenna module together.
    Type: Application
    Filed: August 2, 2023
    Publication date: March 7, 2024
    Applicant: PEGATRON CORPORATION
    Inventors: Chien-Yi Wu, Chao-Hsu Wu, Chih-Wei Liao, Hau Yuen Tan, Shih-Keng Huang, Wen-Hgin Chuang, Lin-Hsu Chiang, Chang-Hua Wu, Han-Wei Wang, Chun-Jung Hu
  • Patent number: D1025864
    Type: Grant
    Filed: October 27, 2021
    Date of Patent: May 7, 2024
    Assignee: Foxtron Vehicle Technologies Co., Ltd.
    Inventors: Tse-Min Cheng, Lu-Han Lee, Chia-Hao Hsu