Abstract: A communication apparatus and a bracket device thereof are provided. The bracket device includes a base, a rotary shaft, a connecting member, and an elastic member. The base includes a bottom portion, a connecting portion, and a base engaging portion. The rotary shaft is rotatably disposed in the connecting portion and includes a base wall and a connecting section. The connecting member connects to the rotary shaft. The elastic member includes a body and an elastic member engaging portion. The body connects to the base wall of the rotary shaft, and the elastic member engaging portion is positioned at the body. In an engagement state, the elastic member engaging portion is engaged to the base engaging portion.

Abstract: Various heatsink arrangements, and methods for implementing and using such are discussed.

Abstract: An illumination system, including a light source module, a phosphor wheel, a light recycling element, and a light uniformizing element, is provided. The light source module emits an excitation light beam. The phosphor wheel includes a phosphor region. At a second timing, the other part of the excitation light beam transmitted to the phosphor region forms an unconverted light beam and is transmitted to the light recycling element, and is reflected by the light recycling element to form a recycled light beam. A part of the recycled light beam is converted into a second converted light beam. A first converted light beam and the second converted light beam are transmitted to the light uniformizing element through a same path, so that the illumination system outputs second light in the illumination light beam. A projection apparatus is also provided.

Abstract: An illumination system includes an excitation light source module, a light splitting and combining module, a filter module, and a wavelength conversion module. The excitation light source module provides an excitation beam. The light splitting and combining module is disposed on a transmission path of the excitation beam. The excitation beam includes a first and a second excitation beam which are different from each other in polarization state or wavelength range. The filter module is disposed on the transmission path of the excitation beam. The filter module includes a light passing area configured to allow the excitation beam to pass there-through and a light filtering area. The wavelength conversion module is disposed on the transmission path of the excitation beam reflected by the light filtering area and configured to convert the reflected excitation beam into a conversion beam. A projection apparatus including the above illumination system is also provided.

Abstract: An electronic device includes a display, a timer and computing hardware configured to execute a software product. Execution of the software product results in generating and rendering a graphical user interface on the display with four or more user-selectable graphical objects. Selection of a first user-selectable graphical object at a first spatial position on the graphical user interface and a movement of the selected first user-selectable graphical object along a path towards a second user-selectable graphical object at a second spatial position is detected and a position of the first user-selectable graphical object is exchanged with the position of the second user-selectable graphical object. If, during a predetermined time period, a selection of a third user-selectable graphical object and a movement of the third user-selectable graphical object towards a fourth user-selectable graphical object is detected, the positions of the third and fourth objects is exchanged.

Abstract: A network device includes a processor circuit and transceiver circuits. The transceiver circuits are connected to a wireless access point via a base channel based on a control of the processor circuit. The wireless access point is connected to a first device. The processor circuit determines whether a tunneled direct link setup link (TDLS) throughput of the base channel is higher than or equal to a threshold value; if the TDLS throughput is higher than or equal to the threshold value, performs an auto channel selection algorithm to determine whether to establish an off channel; and if the off channel is established, performs one of a dual-band concurrent mode and a multi-channel concurrent mode according to a number of antennas corresponding to the transceiver circuits, in order to control at least one of the transceiver circuits to be connected to the first device via the off channel.

Abstract: An optical connector device is provided. The optical connector device includes a semiconductor package including a receptacle and a lid. The optical connector device also included an adapter attached to the lid of the semiconductor package, and a connector removably attached to the adapter. The adapter includes a convex part adapted to fit into an adapter opening of the lid, an adapter recess adapted to accommodate at least a portion of the connector, and a first retainer in the adapter recess to removably attach the connector to the adapter at a predetermined position. The connector includes an optical fiber array corresponding to the receptacle and extending in a vertical direction with respect to a plane of the semiconductor package, a second retainer used in conjunction with the first retainer, and a biasing member to bias a portion of the connector toward the semiconductor package.

Abstract: An illumination system includes a first light source, a wavelength conversion device, a first light-splitting element, a light-filtering device, and a light-homogenizing element. The first light source provides a first light beam. The wavelength conversion device includes a single wavelength conversion material configured to convert the first light beam into a conversion light beam. The first light-splitting element is disposed on transmission paths of the first light beam and the conversion light beam. The light-filtering device is disposed on the transmission paths of the first light beam and the conversion light beam. The light-homogenizing element is disposed on the transmission paths of the first light beam and the conversion light beam. When the first light beam is transmitted to the light-homogenizing element, the first light beam is not incident on the wavelength conversion device. A projection apparatus including the illumination system is also provided.

Abstract: A semiconductor package includes a semiconductor die, a redistribution structure and connective terminals. The redistribution structure is disposed on the semiconductor die and includes a first metallization tier disposed in between a pair of dielectric layers. The first metallization tier includes routing conductive traces electrically connected to the semiconductor die and a shielding plate electrically insulated from the semiconductor die. The connective terminals include dummy connective terminals and active connective terminals. The dummy connective terminals are disposed on the redistribution structure and are electrically connected to the shielding plate. The active connective terminals are disposed on the redistribution structure and are electrically connected to the routing conductive traces. Vertical projections of the dummy connective terminals fall on the shielding plate.

Abstract: Described herein are techniques related one or more systems, apparatuses, methods, etc. for integrating a near field communications (NFC) coil antenna in a portable device. For example, the NFC antenna is integrated under a metal chassis of the portable device. The metal chassis and a conductive coating—that is integrated underneath the full metal chassis—are designed to include one or more slots to provide high impedance to Eddy current induced in the conductive coating.

Abstract: An illumination system including an excitation light source array, a multi-region dichroic device, a color sequence generator, and a wavelength converter is provided. The excitation light source array emits excitation light beams. The multi-region dichroic device has first dichroic regions and non-dichroic regions that are alternately arranged in stripe shapes. The first dichroic regions are respectively disposed on transmission paths of the excitation light beams. The excitation light beams from the excitation light source array are transmitted to the color sequence generator through the first dichroic regions of the multi-region dichroic device, and at least one second dichroic region of the color sequence generator respectively reflects the excitation light beams to the non-dichroic regions of the multi-region dichroic device. The excitation light beams from the color sequence generator are transmitted to the wavelength converter through the non-dichroic regions of the multi-region dichroic device.

Abstract: The semiconductor device includes a semiconductor fin, and a gate stack over the semiconductor fin. The gate stack includes a gate dielectric layer over a channel region of the semiconductor fin, a work function material layer over the gate dielectric layer, wherein the work function material layer includes dopants, and a gate electrode layer over the work function material layer. The gate dielectric layer is free of the dopants.

Abstract: A semiconductor package includes a semiconductor die, a redistribution structure and connective terminals. The redistribution structure is disposed on the semiconductor die and includes a first metallization tier disposed in between a pair of dielectric layers. The first metallization tier includes routing conductive traces electrically connected to the semiconductor die and a shielding plate electrically insulated from the semiconductor die. The connective terminals include dummy connective terminals and active connective terminals. The dummy connective terminals are disposed on the redistribution structure and are electrically connected to the shielding plate. The active connective terminals are disposed on the redistribution structure and are electrically connected to the routing conductive traces. Vertical projections of the dummy connective terminals fall on the shielding plate.

Abstract: Techniques for focusing the energy radiated by a wireless power transmitting unit are described. An example power transmitting unit includes a transmit coil configured to generate a magnetic field to wirelessly power a device within an active wireless charging area. The power transmitting unit also includes a power generating circuitry to deliver current to the transmit coil to generate the magnetic field. The power transmitting unit also includes a ferrite structure disposed below the transmit coil, the ferrite structure comprising a flat sheet and a projection of ferrite material projecting above the flat sheet.

Abstract: There is disclosed in one example a computing apparatus, including: an active computing element; a first magnetic attractor mechanically coupled to the active computing element; and a cold plate disposed to conduct heat away from the active computing element, the cold plate including a second magnetic attractor disposed to magnetically couple with the first magnetic attractor.

Abstract: A semiconductor package includes a circuit substrate, a die, a frame structure, a heat sink lid and conductive balls. The die is disposed on a front surface of the circuit substrate and electrically connected with the circuit substrate. The die includes two first dies disposed side by side and separate from each other with a gap between two facing sidewalls of the two first dies. The frame structure is disposed on the front surface of the circuit substrate and surrounding the die. The heat sink lid is disposed on the die and the frame structure. The head sink lid has a slit that penetrates through the heat sink lid in a thickness direction and exposes the gap between the two facing sidewalls of the two first dies. The conductive balls are disposed on the opposite surface of the circuit substrate and electrically connected with the die through the circuit substrate.

Abstract: A method includes etching a semiconductor substrate to form trenches extending into the semiconductor substrate, and depositing a first dielectric layer into the trenches. The first dielectric layer fills lower portions of the trenches. A Ultra-Violet (UV) treatment is performed on the first dielectric layer in an oxygen-containing process gas. The method further includes depositing a second dielectric layer into the trenches. The second dielectric layer fills upper portions of the trenches. A thermal treatment is performed on the second dielectric layer in an additional oxygen-containing process gas. After the thermal treatment, an anneal is performed on the first dielectric layer and the second dielectric layer.

Abstract: The disclosure relates to a linear actuator including a base, a linear motor, a load cell and a rotary motor. The linear motor is disposed on the base and includes a fixed coil module and a movable magnetic backplane. The fixed coil module is fixed on the base, and the movable magnetic backplane is configured to slide relative to the fixed coil module along a first direction. The rotary motor is rotated around a central axis in parallel with the first direction. The load cell has two opposite sides parallel to the first direction, respectively. The movable magnetic backplane of the linear motor and the rotary motor are connected to the two opposite sides of the load cell, respectively. The load cell is subjected to a force applied thereto by the rotary motor and parallel to the first direction, and configured to convert the force into an electrical signal.

Abstract: A rack assembly has two support frames and at least one shelf that are secured to the support frames by connecting assemblies. Each connecting assembly comprises a well secured to a medial surface of each vertical tube of the support frame, and a hook that extends from each end of each shelf, with each hook having an opening extending therethrough. The connecting assembly also includes a connector that is seated inside each well, each connector having a top plate that has an elongated opening, the connector also having a body that is sized and configured to fit inside a well, the body defining two wings with a space between the wings, and wherein each wing has a bump positioned in the center of the inner surface of each wing that faces the space. Each hook is inserted through the elongated opening of a corresponding connector with the bump on each wing fitted inside the opening of the hook to retain the hook inside the body of the connector.

Abstract: A method for forming a package structure and method for forming the same are provided. The method includes forming a package layer over a substrate, and forming a first dielectric layer over the package layer. The method further includes forming a first alignment mark and a second alignment mark over the first dielectric layer. The method includes forming a second dielectric layer over the first dielectric layer and removing a portion of the second dielectric layer to form a first trench to expose the first alignment mark, and to form a first opening to expose the second alignment.