Patents by Inventor Hans Wang

Hans Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240084148
    Abstract: The present application provides a method of preparing lithium-friendly colloid paint. The method comprises functionalizing a carbon nanotube material to obtain a plurality of carbon nanotubes with functional groups; dispersing the of carbon nanotube material with functional groups in a solution containing nitrogen molecules to from the dispersion liquid to obtain a carbon nanotube precursor; heat-treating the carbon nanotube precursors to obtain a plurality of nitrogen-doped carbon nanotubes; dispersing the plurality of nitrogen-doped carbon nanotubes in an organic solvent, and adding a dispersant obtain a nitrogen-doped carbon nanotube solution precursor; and providing a polymer material colloid and a lithium salt, and uniformly mixing the nitrogen-doped carbon nanotube solution precursor, the lithium salt and the polymer material colloid.
    Type: Application
    Filed: September 8, 2023
    Publication date: March 14, 2024
    Inventors: WEI-CHAO CHEN, PIN-HAN WANG, HONG-ZHENG LAI, TSENG-LUNG CHANG
  • Publication number: 20240080976
    Abstract: An electronic device may be provided with a liquid crystal polymer (LCP) printed circuit having conductive trace and a hole. A conductive flange may be soldered to the conductive trace and may extend into the hole. The end of the conductive flange may laterally surround a central opening within the hole. A conductive contact may be inserted into the central opening. Solder may be deposited over the conductive flange and in the central opening. The solder may couple the conductive contact to the conductive flange and thus the conductive trace. This may ensure a robust mechanical and electrical connection between the conductive contact and the conductive trace on the printed circuit despite the printed circuit being formed from LCP, which may not support copper-plated through vias for coupling to the conductive contact.
    Type: Application
    Filed: August 30, 2023
    Publication date: March 7, 2024
    Inventors: Peter A. Dvorak, Eric W. Bates, Ana Papio Toda, Yiren Wang, Hao Xu, Yuan Tao, Han Wang, Jack R Lanzi, Ronald Lam
  • Publication number: 20240079779
    Abstract: An electronic device may be provided with a sensor module and an antenna having an antenna arm, ground structures, and a tuner. The tuner may be mounted to a printed circuit overlapping the sensor module. A spring may be mounted to the printed circuit and may couple the tuner to a conductive chassis of the sensor module. The sensor module may include optical sensors that gather sensor data through a display and may form ground paths from the tuner to the ground structures. Conductive interconnect structures such as springs may exert biasing forces in different directions to couple the ground paths to different layers of the ground structures. This may serve to couple the antenna to the ground structures as close as possible to the tuner, thereby maximizing antenna performance, despite the presence of the sensor module.
    Type: Application
    Filed: August 30, 2023
    Publication date: March 7, 2024
    Inventors: Yuan Tao, Yiren Wang, Ana Papio Toda, Jingni Zhong, Han Wang, Hao Xu, Hongfei Hu, Mattia Pascolini, Eric W. Bates, Peter A. Dvorak, Allegra Shum
  • Publication number: 20240079790
    Abstract: An electronic device may be provided with peripheral conductive housing structures having a segment that forms a resonating element for an antenna. A speaker may be mounted to a mid-chassis of the electronic device. A printed circuit may be mounted to the speaker and may have a ground trace for the antenna. A conductive spring may extend through the printed circuit and the speaker to couple the ground trace to the mid-chassis. A conductive contact pad may be welded to an aluminum layer such as an aluminum layer used to form the mid-chassis. A conductive spring such as the conductive spring coupled to the ground traces may press against the contact pad. The contact pad may include gold or nickel-plated stainless steel. The contact pad may provide a strong electrical connection between the conductive spring and the aluminum layer.
    Type: Application
    Filed: August 30, 2023
    Publication date: March 7, 2024
    Inventors: Peter A Dvorak, Eric W Bates, McKinley McQuaide, Ronald Lam, Ana Papio Toda, Yiren Wang, Hao Xu, Han Wang, Yuan Tao, Jack R Lanzi, Jingni Zhong
  • Publication number: 20240079761
    Abstract: An electronic device may be provided with a flexible printed circuit and a rigid printed circuit mounted to the flexible printed circuit using a board-to-board (B2B) connector. The flexible printed circuit may include signal conductors coupled to one or more antennas on the rigid printed circuit through the B2B connector. A given one of the signal conductors may include a phase shifter segment on the flexible printed circuit and/or a thick impedance matching segment on the rigid printed circuit that help to form a smooth impedance transition from the flexible printed circuit to the rigid printed circuit and the antenna(s). The B2B connector may include signal contacts interleaved with a ground contacts. The B2B connector may include ground bars laterally surrounding the signal and ground contacts to maximize the strength of mechanical coupling between the flexible printed circuit and the rigid printed circuit.
    Type: Application
    Filed: August 30, 2023
    Publication date: March 7, 2024
    Inventors: Jingni Zhong, Ming Chen, Han Wang, Alden T Rush, Behnam Ghassemiparvin, Bhaskara R Rupakula, Yiren Wang, Yuan Tao, Hao Xu, Jennifer M Edwards, Hongfei Hu, Mattia Pascolini
  • Publication number: 20240079766
    Abstract: An electronic device may be provided with peripheral conductive housing structures having a first segment and a second segment. First and second antenna feeds may be coupled between the first segment and the ground structures. The first feed may convey signals in a first band and the second feed may convey signals in a second band. The first segment may be near-field coupled to a slot between the second segment and the ground structures. A first tuner may be coupled between the second segment and the ground structures and may adjust a resonance of the first segment in the first and second bands. A second tuner coupled to the first feed may perform impedance matching in the first band and aperture tuning in the second band. A third tuner coupled to the second feed may perform impedance matching in the second band and aperture tuning in the first band.
    Type: Application
    Filed: August 30, 2023
    Publication date: March 7, 2024
    Inventors: Yuancheng Xu, Enrique Ayala Vazquez, Nikolaj P Kammersgaard, Yiren Wang, Yuan Tao, Han Wang, Haozhan Tian, Hao Xu, Hongfei Hu, Mattia Pascolini
  • Publication number: 20240079786
    Abstract: An electronic device may be provided with peripheral conductive housing structures, a first antenna, and a second antenna. A gap may divide the housing structures into a first segment forming an arm of the first antenna and a second segment forming an arm of the second antenna. A first feed terminal may be coupled to the first segment and a second feed terminal may be coupled to the second segment. Switchable components may be coupled in parallel between the first and second feed terminals across the gap. The switchable components may be adjusted to tune the frequency response of the first and/or second antenna. The switchable components may have a first state in which only the first feed terminal feeds the first antenna and may have a second state in which both the first and second feed terminals feed the first antenna.
    Type: Application
    Filed: August 30, 2023
    Publication date: March 7, 2024
    Inventors: Han Wang, Aobo Li, Victor C Lee, Yuancheng Xu, Ahmed Ali Abdelhaliem Nafe, Enrique Ayala Vazquez, Yiren Wang, Yuan Tao, Christopher Q Ma, Zhiheng Zhou, Sherry Cao, Dale T Morgan, Timothy L Stickles, Hao Xu, Hongfei Hu, Mattia Pascolini
  • Publication number: 20240079778
    Abstract: An electronic device may be provided with an antenna having a resonating element formed from a segment of peripheral conductive housing structures. A speaker may be aligned with first openings in the segment. A vent may be aligned with second openings in the segment. A connector may protrude through the segment. A trace combiner for the antenna may be patterned onto the speaker and may be coupled to the segment. Tuners for the antenna may be disposed on first and second flexible printed circuits that extend along opposing sides of the connector. The tuners may be controlled through the speaker. The second flexible printed circuit may extend along the vent. The vent may have a vent cowling with a cut-out region next to the tuner on the second flexible printed circuit.
    Type: Application
    Filed: August 30, 2023
    Publication date: March 7, 2024
    Inventors: Enrique Ayala Vazquez, Ming-Ju Tsai, Yiren Wang, Yuan Tao, Hao Xu, Sidharath Jain, Haozhan Tian, Yuancheng Xu, Eric W. Bates, Peter A. Dvorak, Harlan S. Dannenberg, Rees S. Parker, Obinna O. Onyemepu, Victor C. Lee, Han Wang, Hongfei Hu
  • Publication number: 20240079781
    Abstract: An electronic device may be provided with an antenna resonating element on a first substrate that is mounted to a second substrate. A signal conductor may be coupled to a feed terminal on the antenna resonating element. The signal conductor may include impedance matching structures for the antenna. The impedance matching structures may include an open transmission line stub, a grounded transmission line stub, and a phase shifting segment. The impedance matching structures may configure the antenna to exhibit a wide bandwidth in an ultra-wideband (UWB) frequency band. If desired, the signal conductor may have a phase-shifting segment configured to match a non-50 Ohm impedance of a radio-frequency front end coupled to the signal conductor.
    Type: Application
    Filed: August 30, 2023
    Publication date: March 7, 2024
    Inventors: Han Wang, Jingni Zhong, Alden T. Rush, Ming Chen, Yiren Wang, Yuan Tao, Hao Xu, Hongfei Hu, Mattia Pascolini
  • Publication number: 20240079784
    Abstract: An electronic device may be provided with an antenna having a resonating element and a light source module mounted to a flexible printed circuit and a metal cowling. The module may emit light through a rear housing wall. The printed circuit may be interposed between the metal cowling and a conductive support plate in the rear housing wall. The printed circuit may include a ground trace coupled to the resonating element. A dimpled pad may couple the ground trace to the support plate. Compressive foam may be used to exert a force against the flexible printed circuit that presses the dimpled pad against the conductive support plate. The ground trace and the dimpled pad may form a return path to ground for the resonating element. The dimpled pad may occupy less height within the device than other structures such as metal springs.
    Type: Application
    Filed: August 30, 2023
    Publication date: March 7, 2024
    Inventors: Han Wang, Victor C. Lee, Jingni Zhong, Ming Chen, Bhaskara R. Rupakula, Yiren Wang, Yuan Tao, Christopher Q. Ma, Zhiheng Zhou, Sherry Cao, Kevin M. Froese, Hao Xu, Hongfei Hu, Mattia Pascolini
  • Publication number: 20240079785
    Abstract: An electronic device may be provided with an antenna having a resonating element formed from a segment of peripheral conductive housing structures. A speaker may be aligned with first openings in the segment. A vent may be aligned with second openings in the segment. A connector may protrude through the segment. A trace combiner for the antenna may be patterned onto the speaker and may be coupled to the segment. Tuners for the antenna may be disposed on first and second flexible printed circuits that extend along opposing sides of the connector. The tuners may be controlled through the speaker. The second flexible printed circuit may extend along the vent. The vent may have a vent cowling with a cut-out region next to the tuner on the second flexible printed circuit.
    Type: Application
    Filed: August 30, 2023
    Publication date: March 7, 2024
    Inventors: Yiren Wang, Yuan Tao, Hao Xu, Yuancheng Xu, Enrique Ayala Vazquez, Nikolaj P. Kammersgaard, Eric W. Bates, Peter A. Dvorak, Victor C. Lee, Han Wang
  • Publication number: 20240079777
    Abstract: An electronic device may be provided with an antenna having a resonating element formed from a segment of peripheral conductive housing structures. A speaker may be aligned with first openings in the segment. A vent may be aligned with second openings in the segment. A connector may protrude through the segment. A trace combiner for the antenna may be patterned onto the speaker and may be coupled to the segment. Tuners for the antenna may be disposed on first and second flexible printed circuits that extend along opposing sides of the connector. The tuners may be controlled through the speaker. The second flexible printed circuit may extend along the vent. The vent may have a vent cowling with a cut-out region next to the tuner on the second flexible printed circuit.
    Type: Application
    Filed: August 30, 2023
    Publication date: March 7, 2024
    Inventors: Yiren Wang, Yuan Tao, Hao Xu, Hongfei Hu, Enrique Ayala Vazquez, Ming-Ju Tsai, Sidharath Jain, Haozhan Tian, Yuancheng Xu, Harlan S Dannenberg, Eric W Bates, Peter A Dvorak, Nicole E Cazares, Obinna O Onyemepu, Victor C Lee, Han Wang
  • Publication number: 20240079782
    Abstract: An electronic device may be provided with a housing and an antenna. The antenna may be on a first substrate mounted to a second substrate. The housing may include a dielectric cover, a conductive plate on the dielectric cover, and a mid-chassis. The second substrate may be mounted to the mid-chassis. The antenna may include a conductive patch extending from a segment of a conductive ring on the first substrate. The conductive plate may have an opening aligned with the conductive patch. The first substrate may be separated from the dielectric cover by an air gap. A conductive gasket may couple the conductive ring to the conductive plate and may laterally surround the air gap and the opening. The antenna may convey ultra-wideband (UWB) signals through the air gap, the opening, and the dielectric cover layer.
    Type: Application
    Filed: August 30, 2023
    Publication date: March 7, 2024
    Inventors: Alden T. Rush, Han Wang, Jingni Zhong, Ming Chen, Yiren Wang, Yuan Tao, Hao Xu, Hongfei Hu, Mattia Pascolini
  • Publication number: 20240080062
    Abstract: An apparatus includes a low-noise amplifier having an input and an output, a first switch coupled between the input of the low-noise amplifier and the output of the low-noise amplifier, and a transformer including a first inductor and a second inductor, wherein the first inductor is coupled to the output of the low-noise amplifier. The apparatus also includes a power amplifier having an input and an output, and a switching circuit coupled between the output of the power amplifier and the second inductor.
    Type: Application
    Filed: September 7, 2022
    Publication date: March 7, 2024
    Inventors: Cheng-Han WANG, Yi ZENG, Takahide NISHIO, Chan Hong PARK, Emanuele LOPELLI, Liang ZHAO
  • Patent number: 11921101
    Abstract: Disclosed are calibration techniques that can be implemented by a device that conducts biological tests. In certain embodiments, the device for testing a biological specimen includes a receiving mechanism to receive a carrier, a camera module arranged to capture imagery of the carrier, and a processor. Some examples of the processor can detect a calibration mode trigger. In calibration mode, the processor can divide the captured imagery into segments and selectively perform one or more calibration procedures for each segment. Then, the processor records a calibration result for each segment.
    Type: Grant
    Filed: January 25, 2022
    Date of Patent: March 5, 2024
    Assignee: Bonraybio Co., Ltd.
    Inventors: Cheng-Teng Hsu, Chih-Pin Chang, Kuang-Li Huang, Yu-Chiao Chi, Chia-Wei Chang, Chiung-Han Wang
  • Publication number: 20240066512
    Abstract: A method of utilizing humic acid to prepare layered humic acid/manganese oxide composite catalyst and its application, the method includes the steps of: adding sodium hypochlorite, manganese salt and humic acid to a water source, stirring and mixing; then introducing into a filter device having a filter material of manganese and a support medium, and generating a layered humic acid/manganese oxide composite catalyst on a surface of the filter material while directing a continuous water flow of the water source into the filter device with a short empty bed contact time for a short time. The catalyst can be used to effectively remove manganese to maintain an effluent with a Mn2+ concentration of not more than 20 ?g/L and to effectively remove heavy metals such as iron, manganese, arsenic, thallium, molybdenum or lead from the water source under neutral, acidic or alkaline conditions with a removal rate of 95% more.
    Type: Application
    Filed: August 31, 2023
    Publication date: February 29, 2024
    Inventors: Panpan WANG, Han WANG, Jun MA, Shiyi QIU, Junda YI
  • Patent number: 11916155
    Abstract: An optoelectronic package and a method for producing the optoelectronic package are provided. The optoelectronic package includes a carrier, a photonic device, a first encapsulant and a second encapsulant. The photonic device is disposed on the carrier. The first encapsulant covers the carrier and is disposed around the photonic device. The second encapsulant covers the first encapsulant and the photonic device. The first encapsulant has a topmost position and a bottommost position, and the topmost position is not higher than a surface of the photonic device.
    Type: Grant
    Filed: May 21, 2021
    Date of Patent: February 27, 2024
    Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: Chien-Hsiu Huang, Bo-Jhih Chen, Kuo-Ming Chiu, Meng-Sung Chou, Wei-Te Cheng, Kai-Chieh Liang, Yun-Ta Chen, Yu-Han Wang
  • Patent number: 11910382
    Abstract: A method of transmitting a Physical Uplink Control Channel (PUCCH) for a user equipment (UE) is provided. The method includes receiving a first Radio Resource Control (RRC) configuration including a first PUCCH resource configuration and a second PUCCH resource configuration, receiving a first Downlink Control Information (DCI) format that schedules a first Physical Downlink Shared Channel (PDSCH) and a second DCI format that schedules a second PDSCH, determining a first PUCCH for a first Hybrid Automatic Repeat reQuest (HARQ) acknowledgement (ACK) codebook corresponding to the first PDSCH according to the first PUCCH resource configuration, determining a second PUCCH for a second HARQ-ACK codebook corresponding to the second PDSCH according to the second PUCCH resource configuration, and transmitting the first PUCCH when the first PUCCH overlaps the second PUCCH in a time domain, the first HARQ-ACK codebook and the second HARQ-ACK codebook multiplexed in the first PUCCH.
    Type: Grant
    Filed: October 22, 2021
    Date of Patent: February 20, 2024
    Assignee: FG Innovation Company Limited
    Inventors: Hai-Han Wang, Wan-Chen Lin
  • Publication number: 20240052003
    Abstract: An aqueous formulation includes a PEDF-derived short peptide (PDSP) having the sequence of one of SEQ ID NO: 1, 2, 3, 5, 6, 8, or 9; histidine having a concentration of 1 mM-100 mM; and an antioxidant and optionally a non-ionic tonicity agent. The pH value is around 5-9. The antioxidant is nicotinamide, which is at a concentration of 50 mM-1000 mM. The non-ionic tonicity agent is sorbitol, which is at a concentration of 0 mM-500 mM. A concentration of the PDSP is 0.01%-1% w/v.
    Type: Application
    Filed: December 4, 2020
    Publication date: February 15, 2024
    Applicant: BRIM Biotechnology, Inc.
    Inventors: Frank Wen-Chi Lee, Wayne W.C. Liaw, Ping-Yen Huang, Hsiao-Han Wang
  • Patent number: 11901252
    Abstract: A semiconductor device package includes a first substrate, a second substrate, and a first electronic component between the first substrate and the second substrate. The first electronic component has a first surface facing the first substrate and a second surface facing the second substrate. The semiconductor device package also includes a first electrical contact disposed on the first surface of the first electronic component and electrically connecting the first surface of the first electronic component with the first substrate. The semiconductor device package also includes a second electrical contact disposed on the second surface of the first electronic component and electrically connecting the second surface of the first electronic component with the second substrate. A method of manufacturing a semiconductor device package is also disclosed.
    Type: Grant
    Filed: August 8, 2022
    Date of Patent: February 13, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Ming-Han Wang, Ian Hu