Patents by Inventor Hans Wang

Hans Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods and apparatuses for handling uplink (re)transmission in NR-U
    Patent number: 12021637
    Abstract: A base station (BS) that includes one or more non-transitory computer-readable media storing computer-executable one or more instructions, and at least one processor coupled to the one or more non-transitory computer-readable media is provided. The at least one processor is configured to execute the computer-executable instructions to cause the BS to transmit a dynamic grant to a user equipment (UE) for scheduling a first uplink (UL) resource and a second UL resource, and receive a first Medium Access Control (MAC) protocol data unit (PDU) from the UE via the second UL resource in a case that transmission of the first MAC PDU to the BS via the first UL resource has failed and the second UL resource is available for transmitting the first MAC PDU. The first UL resource starts before the second UL resource in time domain, and the second UL resource is indicated for a new transmission.
    Type: Grant
    Filed: November 21, 2022
    Date of Patent: June 25, 2024
    Assignee: FG Innovation Company Limited
    Inventors: Heng-Li Chin, Hai-Han Wang, Hsin-Hsi Tsai, Chia-Hung Wei
  • HEALABLE ACRYLIC POLYMERS
    Publication number: 20240199781
    Abstract: Poly(meth)acrylate formulations include acrylic copolymers having acrylic monomer units including xanthate, thiocarbonylthio, disulfide, or dithioester functionality. The acrylic copolymers can be blended with poly (meth)acrylate resins to provide a blended composition having a healable property. The xanthate, thiocarbonylthio, disulfide, or dithioester functionality can be activated by the addition of energy, such as heat, or radiation, to remove marring from the surface of a coating, film, or sheet.
    Type: Application
    Filed: April 28, 2022
    Publication date: June 20, 2024
    Applicant: Trinseo Europe GmbH
    Inventors: Krysten R. Minnici, Sangwoo Park, Jing-Han Wang
  • HALOGEN-FREE FLAME RETARDANT ACRYLIC POLYMERS FOR USE IN SHEET EXTRUSION AND MULTI INJECTION MOLDING PROCESSING
    Publication number: 20240199870
    Abstract: The invention relates to a flame retardant (meth)acrylate composition combining an impact-resistant (meth)acrylic polymer (such as Solarkote® resin from Trinseo) with specific levels of selected organic phosphinate and selected organic phosphorous flame retardants. The composition is halogen free, with superior flame performance, flowability and impact resistance. The composition of the invention is melt-processible and can be co-extruded with a thermoplastic substrate material to obtain a multilayer structure, having a tough, impact resistant cap layer(s). The obtained multilayer structure can be further thermoformed into useful profiles and structures, such as the exterior housing of EV charging stations and car wash stations, automotive applications, aerospace, and building and construction applications.
    Type: Application
    Filed: December 1, 2023
    Publication date: June 20, 2024
    Applicant: Trinseo Europe GmbH
    Inventors: Penzghan Fei, Jiaxin Jason Ge, Jing-Han Wang, Nils Kay, Sascha Holm, Koen Vangenechten
  • REDISTRIBUTION STRUCTURE FOR SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
    Publication number: 20240203949
    Abstract: A semiconductor device having a redistribution structure and a method of forming the same are provided. A semiconductor device includes a semiconductor structure, a redistribution structure over and electrically coupled the semiconductor structure, and a connector over and electrically coupled to the redistribution structure. The redistribution structure includes a base via and stacked vias electrically interposed between the base via and the connector. The stacked vias are laterally spaced apart from the base via.
    Type: Application
    Filed: February 28, 2024
    Publication date: June 20, 2024
    Inventors: Po-Han Wang, Yu-Hsiang Hu, Hung-Jui Kuo
  • Foamable acrylic composition
    Patent number: 12012510
    Abstract: The invention relates to foamed acrylic materials using both traditional chemical blowing agents as well as foamable microspheres. The acrylic foams have improved density reduction, optical properties, and insulation properties. The acrylic foams of the invention can be formed by traditional melt processing methods (extrusion, blow molding, etc.) as well as innovative foaming methods, such as foaming during or after polymerization. One novel method of the invention involves the use of expandable microspheres blended with monomers, the monomers then polymerized through bulk polymerization in cell cast, infusion, or compression molding processes. This method can be effectively used to produce composite foam structures, such as in combination with ELIUM® liquid resins from Arkema.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: June 18, 2024
    Assignee: ARKEMA FRANCE
    Inventors: Jing-Han Wang, Nathan J. Bachman, Brian M. Cromer
  • SEMICONDUCTOR PACKAGE AND METHOD
    Publication number: 20240194611
    Abstract: In an embodiment, a device includes: a molding compound; an integrated circuit die encapsulated in the molding compound; a through via adjacent the integrated circuit die; and a redistribution structure over the integrated circuit die, the molding compound, and the through via, the redistribution structure electrically connected to the integrated circuit die and the through via, the redistribution structure including: a first dielectric layer disposed over the molding compound; a first conductive via extending through the first dielectric layer; a second dielectric layer disposed over the first dielectric layer and the first conductive via; and a second conductive via extending through the second dielectric layer and into a portion of the first conductive via, an interface between the first conductive via and the second conductive via being non-planar.
    Type: Application
    Filed: February 26, 2024
    Publication date: June 13, 2024
    Inventors: Po-Han Wang, Hung-Jui Kuo, Yu-Hsiang Hu
  • Solvents and catalyst preparations for lithium-oxygen batteries
    Patent number: 12009509
    Abstract: An electrochemical device includes a lithium anode having a red poly(benzonitrile) coating covering at least a portion of the anode; a separator and an air cathode comprising reduced graphene oxide over gas diffusion layer; and an electrolyte comprising an ether solvent, benzonitrile, and a lithium salt.
    Type: Grant
    Filed: January 26, 2023
    Date of Patent: June 11, 2024
    Assignee: UCHICAGO ARGONNE, LLC
    Inventors: Hsien-Han Wang, Ritesh Jagatramka, Samuel Plunkett, Larry A. Curtiss, Khalil Amine
  • SEMICONDUCTOR DEVICE
    Publication number: 20240186257
    Abstract: According to one embodiment, a semiconductor device is provided. The semiconductor device includes a first semiconductor module, a redistribution layer (RDL) module and a second semiconductor module. The RDL module is disposed on the first semiconductor module. The RDL module includes a plurality of polymer layers and a plurality of vias. The polymer layers are stacked on the first semiconductor module. The vias are disposed within the polymer layers. The second semiconductor module is disposed on the RDL module. A height difference of a top surface of at least one of the polymer layers ranges from 0 um to 1 um; or an angle between a sidewall and a bottom surface of at least one of the vias ranges from 90° to 95°; or a glass transition temperature (Tg) of at least one of the polymer layers is larger than 260° C.
    Type: Application
    Filed: January 19, 2023
    Publication date: June 6, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Meng-Che TU, Po-Nan YEH, Miao-Ken HUNG, Po-Han WANG, Yu-Hsiang HU, Hung-Jui KUO
  • ULTRAHIGH TUNNELING ELECTRORESISTANCE IN FERROELECTRIC TUNNELING JUNCTION WITH GIANT BARRIER HEIGHT MODULATION BY MONOLAYER GRAPHENE CONTACT
    Publication number: 20240188303
    Abstract: An apparatus for novel high-speed low power non-volatile memory for the next generation electronic memory and computing technology is provided. The apparatus may include a ferroelectric tunnel junction (FTJ) that can switch between two or more conductance states in a reversible and non-volatile manner. A ferroelectric tunnel junction (FTJ) having two electrodes separated by a thin ferroelectric (FE) insulating layer has potential to replace existing volatile and non-volatile memory. Through the application of electrical pulses, the electrical resistance of an FTJ can be reversibly changed in a non-volatile manner by switching the ferroelectric polarization in the ferroelectric insulator layer.
    Type: Application
    Filed: June 22, 2022
    Publication date: June 6, 2024
    Applicant: UNIVERSITY OF SOUTHERN CALIFORNIA
    Inventors: Han Wang, Jiang-Bin Wu, Hung-Yu Chen
  • SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20240186201
    Abstract: A semiconductor device package includes a first substrate, a second substrate, and a first electronic component between the first substrate and the second substrate. The first electronic component has a first surface facing the first substrate and a second surface facing the second substrate. The semiconductor device package also includes a first electrical contact disposed on the first surface of the first electronic component and electrically connecting the first surface of the first electronic component with the first substrate. The semiconductor device package also includes a second electrical contact disposed on the second surface of the first electronic component and electrically connecting the second surface of the first electronic component with the second substrate. A method of manufacturing a semiconductor device package is also disclosed.
    Type: Application
    Filed: February 13, 2024
    Publication date: June 6, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Ming-Han WANG, Ian HU
  • Self-assembling antiviral prodrugs
    Patent number: 11998609
    Abstract: Disclosed are therapeutic self-assembling molecules including a peptide sequence conjugated to one or more antiviral therapeutics to form a peptide-based antiviral prodrug capable of self-assembly into supramolecular structures with varying morphology in aqueous solutions, which can be injected subcutaneously or intramuscularly for the long-acting treatment of chronic viral infections.
    Type: Grant
    Filed: November 7, 2022
    Date of Patent: June 4, 2024
    Assignee: The Johns Hopkins University
    Inventors: Honggang Cui, Charles Williams Flexner, Maya Monroe, Han Wang
  • Method and apparatus for uplink implementation
    Patent number: 12004139
    Abstract: A method performed by a user equipment (UE) for handling an uplink (UL) cancellation indication (CI) is provided. The method includes receiving a UL grant scheduling a Physical Uplink Shared Channel (PUSCH), a frequency resource for the PUSCH being allocated within an active UL Bandwidth Part (BWP) of the UE; receiving the UL CI, the UL CI indicating a UL resource in a reference UL resource, the reference UL resource being allocated within a carrier including at least the active UL BWP; and defining a starting symbol of the reference UL resource. The method further includes in a case that the UL CI is received after the UL grant, determining whether the UL resource overlaps the PUSCH, and in a case that the UL resource overlaps the PUSCH, cancelling the PUSCH.
    Type: Grant
    Filed: October 14, 2022
    Date of Patent: June 4, 2024
    Assignee: FG Innovation Company Limited
    Inventor: Hai-Han Wang
  • LOW THERMAL BUDGET DIELECTRIC FOR SEMICONDUCTOR DEVICES
    Publication number: 20240170323
    Abstract: The present disclosure describes a method of forming low thermal budget dielectrics in semiconductor devices.
    Type: Application
    Filed: January 30, 2024
    Publication date: May 23, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Mrunal Abhijith KHADERBAD, Ko-Feng Chen, Zheng-Yong Liang, Chen-Han Wang, De-Yang Chiou, Yu-Yun Peng, Keng-Chu Lin
  • Humidifier
    Patent number: 11988408
    Abstract: A humidifier has a base and a housing. The housing has a steam exhaust vent and a vaporizer. The vaporizer includes a heating element surrounded by a removable porous sleeve that protrudes downwardly into water within a reservoir of the base. The sleeve wicks the water including its minerals and impurities into contact with the heating element wherein energization of the heating element causes the wicked water to convert to steam that rises through the exhaust vent and from the housing during a humidification mode.
    Type: Grant
    Filed: March 29, 2022
    Date of Patent: May 21, 2024
    Inventors: Chi Hsiang Wang, Hao Han Wang
  • Ultra-wideband antenna having fed and unfed arms
    Patent number: 11990687
    Abstract: An electronic device may include an antenna disposed on a substrate. The antenna may include a ring of conductive traces, a fed arm, and an unfed arm. The fed arm and the unfed arm may extend from opposing segments of the ring. The ring may be coupled to ground by fences of conductive vias extending through the substrate. The first arm may have a first radiating edge. The second arm may have a second radiating edge. The first radiating edge may be separated from the second radiating edge by a gap. The first arm may indirectly feed the second arm via near-field electromagnetic coupling across the gap. The first and second arms may collectively radiate in an ultra-wideband (UWB) frequency band.
    Type: Grant
    Filed: July 18, 2022
    Date of Patent: May 21, 2024
    Assignee: Apple Inc.
    Inventors: Alden T Rush, Soroush Akbarzadeh, Hongfei Hu, Han Wang, Javier Gomez Tagle, Ming Chen, Carlo Di Nallo, Mattia Pascolini, Erdinc Irci, Ali Pourghorban Saghati
  • Method of filtering packets in network switch and related filter
    Patent number: 11991080
    Abstract: A method for packet filtering in a network switch includes: utilizing an access control list circuit to filter received packets, wherein the access control list circuit compares header information of the received packets with an access control list to filter the received packets, where the access control list has at least one entry, and rule information in the entry includes only a portion of an IP address; and utilizing a routing circuit to further filter packets that pass the access control list circuit, wherein the routing circuit compares header information of the packets that pass the access control list circuit with a routing table to filter the packets, wherein the routing table has at least one entry, and rule information in the entry includes an entire IP address.
    Type: Grant
    Filed: February 17, 2022
    Date of Patent: May 21, 2024
    Assignee: Realtek Semiconductor Corp.
    Inventors: Kai-Wen Cheng, Sz-Han Wang, Wen-Huang Yeh, Wei-Hong You
  • LIGHT-EMITTING PACKAGE AND LIGHT-EMITTING MODULE
    Publication number: 20240162396
    Abstract: A light-emitting package includes a light-transmitting carrier and a light-emitting element. The light-transmitting carrier has a carrying surface, and the light-transmitting carrier contains a base resin and a first phosphorescent powder. The light-emitting element is disposed on the carrying surface. A light-emitting module that contains a phosphorescent powder is also provided.
    Type: Application
    Filed: November 14, 2023
    Publication date: May 16, 2024
    Inventors: CHENG-HONG SU, CHIH-LI YU, CHENG-HAN WANG
  • PERFORMING MEASUREMENTS FOR A HANDOVER PROCEDURE IN A NON-TERRESTRIAL NETWORK
    Publication number: 20240163751
    Abstract: A method performed by a UE connected to a first cell associated with a first satellite is provided. The method receives a measurement configuration includes a first SMTC and a second SMTC. The first and second SMTCs have at least a first parameter that is common to both first and second SMTCs and a second parameter that is different in each SMTC. The method receives a signal to perform a measurement procedure for a second cell associated with a second satellite. The method performs the measurement procedure based on the received measurement configuration, where the first parameter includes a duration of time that indicates an SMTC window within which at least one of an SSB or a CSI-RS is detectable by the UE to perform the measurement procedure, and the second parameter includes an offset value.
    Type: Application
    Filed: December 21, 2023
    Publication date: May 16, 2024
    Inventors: CHIEN-CHUN CHENG, YUNG-LAN TSENG, HSIN-HSI TSAI, HAI-HAN WANG
  • BILAYER SEAL MATERIAL FOR AIR GAPS IN SEMICONDUCTOR DEVICES
    Publication number: 20240162083
    Abstract: The present disclosure relates to a method for forming a semiconductor device includes forming an opening between first and second sidewalls of respective first and second terminals. The first and second sidewalls oppose each other. The method further includes depositing a first dielectric material at a first deposition rate on top portions of the opening and depositing a second dielectric material at a second deposition rate on the first dielectric material and on the first and second sidewalls. The second dielectric material and the first and second sidewalls entrap a pocket of air. The method also includes performing a treatment process on the second dielectric material.
    Type: Application
    Filed: January 24, 2024
    Publication date: May 16, 2024
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shuen-Shin LIANG, Chen-Han WANG, Keng-Chu LIN, Tetsuji UENO, Ting-Ting CHEN
  • Electric motor
    Patent number: D1030668
    Type: Grant
    Filed: June 24, 2022
    Date of Patent: June 11, 2024
    Assignee: Meritor Electric Vehicles Germany GmbH
    Inventors: Cheng Shuai Lu, Han Wang Zhao, Hai Bin Li, Hui Lai Liu