Patents by Inventor Hao Ho

Hao Ho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100253378
    Abstract: A probe for high frequency signal transmission includes a metal pin, and a metal line spacedly arranged on and electrically insulated from the metal pin and electrically connected to grounding potential so as to maintain the characteristic impedance of the probe upon transmitting high frequency signal. The maximum diameter of the probe is substantially equal to or smaller than two times of the diameter of the metal pin. Under this circumstance, a big amount of probes can be installed in a probe card for probing a big amount of electronic devices, so that a wafer-level electronic test can be achieved efficiently and rapidly.
    Type: Application
    Filed: May 26, 2010
    Publication date: October 7, 2010
    Applicant: MPI CORPORATION
    Inventors: Wei-Cheng Ku, Chih-Hao Ho, Chia-Tai Chang, Ho-Hui Lin, Chien-Ho Lin
  • Patent number: 7791359
    Abstract: A probe for high frequency signal transmission includes a metal pin, and a metal line spacedly arranged on and electrically insulated from the metal pin and electrically connected to grounding potential so as to maintain the characteristic impedance of the probe upon transmitting high frequency signal. The maximum diameter of the probe is substantially equal to or smaller than two times of the diameter of the metal pin. Under this circumstance, a big amount of probes can be installed in a probe card for probing a big amount of electronic devices, so that a wafer-level electronic test can be achieved efficiently and rapidly.
    Type: Grant
    Filed: January 8, 2008
    Date of Patent: September 7, 2010
    Assignee: MPI Corporation
    Inventors: Wei-Cheng Ku, Chih-Hao Ho, Chia-Tai Chang, Ho-Hui Lin, Chien-Ho Lin
  • Patent number: 7782070
    Abstract: A probing device includes a rack that has an outer support member supporting a circuit layer and a center support member supporting a probe assembly. When the tester touching down the circuit layer of the probing device from the top side, the outer support member of the rack bears this touchdown stress. When the probes of the probe holder touching down the electronic components of an IC wafer under test, the center support member of the rack bears the reaction force from the IC wafer.
    Type: Grant
    Filed: June 4, 2008
    Date of Patent: August 24, 2010
    Assignee: MJC Probe Incorporated
    Inventors: Wei-Cheng Ku, Chih-Hao Ho, Ho-Hui Lin, Te-Chen Feng, Jun-Liang Lai, Jia-Chi Ho, Chih-Chung Chien, Chien-Huei Huang, Ai-Chuan Chang, Horng-Chuan Sun
  • Patent number: 7731500
    Abstract: The illustrative embodiment is a simulation system for practicing vascular-access procedures without using human subjects. The simulator comprises a data-processing system and a haptics device. The haptics device provides the physical interface at which an end effector, which is representative of a medical instrument (e.g., a needle, catheter, etc.), is manipulated with respect to a haptics-device base to simulate instrument insertion. The data-processing system, by exchanging signals with the haptics device, provides a three-dimensional simulation that includes the resistive forces that a medical practitioner would experience if the simulated procedure were an actual procedure that was being performed on a real anatomy (e.g., human arm, etc.). The simulator displays the ongoing simulation and assesses the performance of its user.
    Type: Grant
    Filed: July 8, 2004
    Date of Patent: June 8, 2010
    Assignee: Laerdal Medical Corporation
    Inventors: David Feygin, Gerald Higgins, Chih-Hao Ho, Marjorie Moreau, Ned Way
  • Patent number: 7683645
    Abstract: A high-frequency probe card includes a circuit board having signal circuits and grounding circuits, transmission lines each having a bi-wire structure including a first lead wire for transmitting high-frequency signal and a second lead wire connected to the grounding circuits, and signal probes. High-frequency test signal provided by a test machine to the signal circuits can be transmitted to the signal probes through the first lead wires. Since the grounding circuits and second lead wires are provided adjacent to the signal circuits and first lead wires respectively, the high-frequency signal can be efficiently transmitted and the characteristic impedance matching can be maintained during high-frequency signal transmission. The bi-wire structure of the transmission lines has a diameter equal to or less than 1 millimeter, thereby allowing installation of a big number of the transmission lines such that the high-frequency test for a big number of electronic elements can be realized.
    Type: Grant
    Filed: October 20, 2006
    Date of Patent: March 23, 2010
    Assignee: MPI Corporation
    Inventors: Wei-Cheng Ku, Hsin-Hung Lin, Chih-Hao Ho, Te-Chen Feng
  • Publication number: 20100047753
    Abstract: The illustrative embodiment is a simulation system for practicing vascular-access procedures without using human subjects. The simulator includes a data-processing system and a haptics interface device. The haptics device provides the physical interface at which an end effector (e.g., medical instrument, such as a needle, catheter, etc.) is manipulated to simulate needle insertion, etc. In accordance with the illustrative embodiment, the haptics device includes a receiver. The receiver receives the end effector when it's inserted by a user into the haptics device. Sensors that are associated with the receiver monitor the motion and position of the end effector, generate signals indicative thereof, and transmit the signals to the data processing system. The signals are processed to determine the effects of manipulation of the end effector.
    Type: Application
    Filed: October 27, 2009
    Publication date: February 25, 2010
    Applicant: LAERDAL DC, INC.
    Inventors: David Feygin, Chih-Hao Ho
  • Patent number: 7625211
    Abstract: The illustrative embodiment is a simulation system that provides realistic training and practice for vascular-access procedures without using human subjects. The simulator includes a data-processing system and a haptics interface device. The haptics device provides the physical interface for performing vascular-access procedures by manipulating a needle/catheter module to simulate needle insertion, etc. Some embodiments of the system include a palpation module, a skin-stretch module, or both. The palpation module provides an ability to practice palpation and occlusion techniques, while the skin-stretch module provides an ability to practice a skin-stretch technique.
    Type: Grant
    Filed: March 23, 2004
    Date of Patent: December 1, 2009
    Assignee: Laerdal DC
    Inventors: David Feygin, Chih-Hao Ho
  • Patent number: 7616479
    Abstract: A data writing method for flash memories suitable for a flash memory using a switching unit to control a bit line thereof is disclosed. The data writing method for flash memories includes applying a square wave signal to a word line of the flash memory and applying a descent wave signal to the switching unit for the bit line of the flash memory to receive a fixed drain voltage.
    Type: Grant
    Filed: August 15, 2007
    Date of Patent: November 10, 2009
    Assignee: Macronix International Co., Ltd.
    Inventors: Chih-Hao Ho, Cheng-Ming Yih
  • Patent number: 7595651
    Abstract: A cantilever-type probe card includes a circuit board, a grounding block electrically connected to a zero potential, signal probes, and at least one grounding probe connected to the grounding block. Each signal probe has a probing tip, a connection portion affixed to the circuit board, and a front arm defined between the connection portion and the probing tip. The front arm of each of the signal probes is suspended in the grounding block and spaced from the grounding block at a predetermined pitch.
    Type: Grant
    Filed: February 13, 2007
    Date of Patent: September 29, 2009
    Assignee: MPI Corporation
    Inventors: Wei-Cheng Ku, Chih-Hao Ho, Shu-Kan Lin
  • Publication number: 20090209978
    Abstract: Embodiments of systems, methods, and computer-readable media for real-time winding analysis for knot detection are disclosed. For example, one embodiment of the present invention includes a method having the steps of receiving a first wrapping signal indicating a first wrapping of the simulated thread around a second tool to create a first loop. The method further includes determining a first wrapping direction based at least in part on the first wrapping signal; receiving a first tightening signal indicating a pulling of a first end of the simulated thread through the first loop; determining a first half-hitch based at least in part on the first winding direction and the first tightening signal; and outputting the first half-hitch. In another embodiment, a computer-readable media includes code for a carrying out such a method.
    Type: Application
    Filed: February 14, 2008
    Publication date: August 20, 2009
    Inventors: Donald Douglas Nelson, Milan Ikits, Chih-Hao Ho, Kevin Kunkler
  • Publication number: 20090046516
    Abstract: A data writing method for flash memories suitable for a flash memory using a switching unit to control a bit line thereof is disclosed. The data writing method for flash memories includes applying a square wave signal to a word line of the flash memory and applying a descent wave signal to the switching unit for the bit line of the flash memory to receive a fixed drain voltage.
    Type: Application
    Filed: August 15, 2007
    Publication date: February 19, 2009
    Applicant: MACRONIX INTERNATIONAL CO., LTD.
    Inventors: Chih-Hao Ho, Cheng-Ming Yih
  • Publication number: 20090009198
    Abstract: A probing device includes a rack that has an outer support member supporting a circuit layer and a center support member supporting a probe assembly. When the tester touching down the circuit layer of the probing device from the top side, the outer support member of the rack bears this touchdown stress. When the probes of the probe holder touching down the electronic components of an IC wafer under test, the center support member of the rack bears the reaction force from the IC wafer.
    Type: Application
    Filed: June 4, 2008
    Publication date: January 8, 2009
    Applicant: MJC PROBE INCORPORATION
    Inventors: Wei-Cheng Ku, Chih-Hao Ho, Ho-Hui Lin, Te-Chen Feng, Jun-Liang Lai, Jia-Chi Ho, Chih-Chung Chien, Chien-Huei Huang, Ai-Chuan Chang, Horng-Chuan Sun
  • Publication number: 20080191726
    Abstract: A cantilever-type probe card includes a circuit board, a grounding block electrically connected to a zero potential, signal probes, and at least one grounding probe connected to the grounding block. Each signal probe has a probing tip, a connection portion affixed to the circuit board, and a front arm defined between the connection portion and the probing tip. The front arm of each of the signal probes is suspended in the grounding block and spaced from the grounding block at a predetermined pitch.
    Type: Application
    Filed: February 13, 2007
    Publication date: August 14, 2008
    Applicant: MJC PROBE INCORPORATION
    Inventors: Wei-Cheng Ku, Chih-Hao Ho, Shu-Kan Lin
  • Publication number: 20080164900
    Abstract: A probe for high frequency signal transmission includes a metal pin, and a metal line spacedly arranged on and electrically insulated from the metal pin and electrically connected to grounding potential so as to maintain the characteristic impedance of the probe upon transmitting high frequency signal. The maximum diameter of the probe is substantially equal to or smaller than two times of the diameter of the metal pin. Under this circumstance, a big amount of probes can be installed in a probe card for probing a big amount of electronic devices, so that a wafer-level electronic test can be achieved efficiently and rapidly.
    Type: Application
    Filed: January 8, 2008
    Publication date: July 10, 2008
    Applicant: MJC Probe Incorporation No.
    Inventors: Wei-Cheng KU, Chih-Hao Ho, Chia-Tai Chang, Ho-Hui Lin, Chien-Ho Lin
  • Publication number: 20080007278
    Abstract: A high-frequency probe card includes a circuit board having signal circuits and grounding circuits, transmission lines each having a bi-wire structure including a first lead wire for transmitting high-frequency signal and a second lead wire connected to the grounding circuits, and signal probes. High-frequency test signal provided by a test machine to the signal circuits can be transmitted to the signal probes through the first lead wires. Since the grounding circuits and second lead wires are provided adjacent to the signal circuits and first lead wires respectively, the high-frequency signal can be efficiently transmitted and the characteristic impedance matching can be maintained during high-frequency signal transmission. The bi-wire structure of the transmission lines has a diameter equal to or less than 1 millimeter, thereby allowing installation of a big number of the transmission lines such that the high-frequency test for a big number of electronic elements can be realized.
    Type: Application
    Filed: October 20, 2006
    Publication date: January 10, 2008
    Applicant: MJC Probe Incorporation
    Inventors: Wei-Cheng Ku, Hsin-Hung Lin, Chih-Hao Ho, Te-Chen Feng
  • Patent number: 7179683
    Abstract: An apparatus having and method of forming grooves in the surface of a substrate adjacent and parallel to sidewall locations for circuit chips or die mounted on the surface. The grooves have physical dimensions to retain fill material formed between the packages and the surface of the substrate so that the fill material does not bridge between chips, thus reducing warping of the substrate due to mismatches in coefficient of thermal expansion (CTE) between the fill material, the substrate, the chips, and mold material formed over the substrate, under fill, and chips.
    Type: Grant
    Filed: August 25, 2004
    Date of Patent: February 20, 2007
    Assignee: Intel Corporation
    Inventors: Al Ling Low, Yee Hao Ho, Yew Wee Cheong, Wei Keat Loh
  • Patent number: 7152496
    Abstract: A screw nut assembly of a linear actuation device, having a screw, a main screw nut and a safety screw nut is disclosed. The main screw nut and the safety screw nut engaged with the screw are operative to displace linearly along an axis of the screw. The safety screw nut includes an exterior surface and the main screw nut includes a receiving portion for receiving the safety screw nut therein. The receiving portion includes an interior surface recessed with at least one slot and a spring disposed within the slot, such that the safety screw nut is inserted into the receiving portion by a resilient force exerted by the spring.
    Type: Grant
    Filed: November 14, 2003
    Date of Patent: December 26, 2006
    Assignee: Jaegar Industrial Co. Ltd.
    Inventors: Chih Hsien Chen, Chih Hsien Chang, Ching Feng Chan, Ming Hao Ho
  • Publication number: 20060008786
    Abstract: The illustrative embodiment is a simulation system for practicing vascular-access procedures without using human subjects. The simulator comprises a data-processing system and a haptics device. The haptics device provides the physical interface at which an end effector, which is representative of a medical instrument (e.g., a needle, catheter, etc.), is manipulated with respect to a haptics-device base to simulate instrument insertion. The data-processing system, by exchanging signals with the haptics device, provides a three-dimensional simulation that includes the resistive forces that a medical practitioner would experience if the simulated procedure were an actual procedure that was being performed on a real anatomy (e.g., human arm, etc.). The simulator displays the ongoing simulation and assesses the performance of its user.
    Type: Application
    Filed: July 8, 2004
    Publication date: January 12, 2006
    Inventors: David Feygin, Gerald Higgins, Chih-Hao Ho, Marjorie Moreau, Ned Way
  • Publication number: 20050214724
    Abstract: The illustrative embodiment is a simulation system for practicing vascular-access procedures without using human subjects. The simulator includes a data-processing system and a haptics interface device. The haptics device provides the physical interface at which a user interacts with various mechanisms that are intended to enable the user to simulate various aspects of a vascular-access procedure. The haptics device is designed so that its physical form and manner of use are not inconsistent with the experience of performing an actual vascular access procedure.
    Type: Application
    Filed: March 23, 2004
    Publication date: September 29, 2005
    Inventors: David Feygin, Chih-Hao Ho
  • Publication number: 20050214726
    Abstract: The illustrative embodiment is a simulation system for practicing vascular-access procedures without using human subjects. The simulator includes a data-processing system and a haptics interface device. The haptics device provides the physical interface at which an end effector (e.g., medical instrument, such as a needle, catheter, etc.) is manipulated to simulate needle insertion, etc. In accordance with the illustrative embodiment, the haptics device includes a receiver. The receiver receives the end effector when it's inserted by a user into the haptics device. Sensors that are associated with the receiver monitor the motion and position of the end effector, generate signals indicative thereof, and transmit the signals to the data processing system. The signals are processed to determine the effects of manipulation of the end effector.
    Type: Application
    Filed: March 23, 2004
    Publication date: September 29, 2005
    Inventors: David Feygin, Chih-Hao Ho