Patents by Inventor Hao Ho
Hao Ho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20100253378Abstract: A probe for high frequency signal transmission includes a metal pin, and a metal line spacedly arranged on and electrically insulated from the metal pin and electrically connected to grounding potential so as to maintain the characteristic impedance of the probe upon transmitting high frequency signal. The maximum diameter of the probe is substantially equal to or smaller than two times of the diameter of the metal pin. Under this circumstance, a big amount of probes can be installed in a probe card for probing a big amount of electronic devices, so that a wafer-level electronic test can be achieved efficiently and rapidly.Type: ApplicationFiled: May 26, 2010Publication date: October 7, 2010Applicant: MPI CORPORATIONInventors: Wei-Cheng Ku, Chih-Hao Ho, Chia-Tai Chang, Ho-Hui Lin, Chien-Ho Lin
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Patent number: 7791359Abstract: A probe for high frequency signal transmission includes a metal pin, and a metal line spacedly arranged on and electrically insulated from the metal pin and electrically connected to grounding potential so as to maintain the characteristic impedance of the probe upon transmitting high frequency signal. The maximum diameter of the probe is substantially equal to or smaller than two times of the diameter of the metal pin. Under this circumstance, a big amount of probes can be installed in a probe card for probing a big amount of electronic devices, so that a wafer-level electronic test can be achieved efficiently and rapidly.Type: GrantFiled: January 8, 2008Date of Patent: September 7, 2010Assignee: MPI CorporationInventors: Wei-Cheng Ku, Chih-Hao Ho, Chia-Tai Chang, Ho-Hui Lin, Chien-Ho Lin
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Patent number: 7782070Abstract: A probing device includes a rack that has an outer support member supporting a circuit layer and a center support member supporting a probe assembly. When the tester touching down the circuit layer of the probing device from the top side, the outer support member of the rack bears this touchdown stress. When the probes of the probe holder touching down the electronic components of an IC wafer under test, the center support member of the rack bears the reaction force from the IC wafer.Type: GrantFiled: June 4, 2008Date of Patent: August 24, 2010Assignee: MJC Probe IncorporatedInventors: Wei-Cheng Ku, Chih-Hao Ho, Ho-Hui Lin, Te-Chen Feng, Jun-Liang Lai, Jia-Chi Ho, Chih-Chung Chien, Chien-Huei Huang, Ai-Chuan Chang, Horng-Chuan Sun
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Patent number: 7731500Abstract: The illustrative embodiment is a simulation system for practicing vascular-access procedures without using human subjects. The simulator comprises a data-processing system and a haptics device. The haptics device provides the physical interface at which an end effector, which is representative of a medical instrument (e.g., a needle, catheter, etc.), is manipulated with respect to a haptics-device base to simulate instrument insertion. The data-processing system, by exchanging signals with the haptics device, provides a three-dimensional simulation that includes the resistive forces that a medical practitioner would experience if the simulated procedure were an actual procedure that was being performed on a real anatomy (e.g., human arm, etc.). The simulator displays the ongoing simulation and assesses the performance of its user.Type: GrantFiled: July 8, 2004Date of Patent: June 8, 2010Assignee: Laerdal Medical CorporationInventors: David Feygin, Gerald Higgins, Chih-Hao Ho, Marjorie Moreau, Ned Way
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Patent number: 7683645Abstract: A high-frequency probe card includes a circuit board having signal circuits and grounding circuits, transmission lines each having a bi-wire structure including a first lead wire for transmitting high-frequency signal and a second lead wire connected to the grounding circuits, and signal probes. High-frequency test signal provided by a test machine to the signal circuits can be transmitted to the signal probes through the first lead wires. Since the grounding circuits and second lead wires are provided adjacent to the signal circuits and first lead wires respectively, the high-frequency signal can be efficiently transmitted and the characteristic impedance matching can be maintained during high-frequency signal transmission. The bi-wire structure of the transmission lines has a diameter equal to or less than 1 millimeter, thereby allowing installation of a big number of the transmission lines such that the high-frequency test for a big number of electronic elements can be realized.Type: GrantFiled: October 20, 2006Date of Patent: March 23, 2010Assignee: MPI CorporationInventors: Wei-Cheng Ku, Hsin-Hung Lin, Chih-Hao Ho, Te-Chen Feng
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Publication number: 20100047753Abstract: The illustrative embodiment is a simulation system for practicing vascular-access procedures without using human subjects. The simulator includes a data-processing system and a haptics interface device. The haptics device provides the physical interface at which an end effector (e.g., medical instrument, such as a needle, catheter, etc.) is manipulated to simulate needle insertion, etc. In accordance with the illustrative embodiment, the haptics device includes a receiver. The receiver receives the end effector when it's inserted by a user into the haptics device. Sensors that are associated with the receiver monitor the motion and position of the end effector, generate signals indicative thereof, and transmit the signals to the data processing system. The signals are processed to determine the effects of manipulation of the end effector.Type: ApplicationFiled: October 27, 2009Publication date: February 25, 2010Applicant: LAERDAL DC, INC.Inventors: David Feygin, Chih-Hao Ho
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Patent number: 7625211Abstract: The illustrative embodiment is a simulation system that provides realistic training and practice for vascular-access procedures without using human subjects. The simulator includes a data-processing system and a haptics interface device. The haptics device provides the physical interface for performing vascular-access procedures by manipulating a needle/catheter module to simulate needle insertion, etc. Some embodiments of the system include a palpation module, a skin-stretch module, or both. The palpation module provides an ability to practice palpation and occlusion techniques, while the skin-stretch module provides an ability to practice a skin-stretch technique.Type: GrantFiled: March 23, 2004Date of Patent: December 1, 2009Assignee: Laerdal DCInventors: David Feygin, Chih-Hao Ho
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Patent number: 7616479Abstract: A data writing method for flash memories suitable for a flash memory using a switching unit to control a bit line thereof is disclosed. The data writing method for flash memories includes applying a square wave signal to a word line of the flash memory and applying a descent wave signal to the switching unit for the bit line of the flash memory to receive a fixed drain voltage.Type: GrantFiled: August 15, 2007Date of Patent: November 10, 2009Assignee: Macronix International Co., Ltd.Inventors: Chih-Hao Ho, Cheng-Ming Yih
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Patent number: 7595651Abstract: A cantilever-type probe card includes a circuit board, a grounding block electrically connected to a zero potential, signal probes, and at least one grounding probe connected to the grounding block. Each signal probe has a probing tip, a connection portion affixed to the circuit board, and a front arm defined between the connection portion and the probing tip. The front arm of each of the signal probes is suspended in the grounding block and spaced from the grounding block at a predetermined pitch.Type: GrantFiled: February 13, 2007Date of Patent: September 29, 2009Assignee: MPI CorporationInventors: Wei-Cheng Ku, Chih-Hao Ho, Shu-Kan Lin
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Publication number: 20090209978Abstract: Embodiments of systems, methods, and computer-readable media for real-time winding analysis for knot detection are disclosed. For example, one embodiment of the present invention includes a method having the steps of receiving a first wrapping signal indicating a first wrapping of the simulated thread around a second tool to create a first loop. The method further includes determining a first wrapping direction based at least in part on the first wrapping signal; receiving a first tightening signal indicating a pulling of a first end of the simulated thread through the first loop; determining a first half-hitch based at least in part on the first winding direction and the first tightening signal; and outputting the first half-hitch. In another embodiment, a computer-readable media includes code for a carrying out such a method.Type: ApplicationFiled: February 14, 2008Publication date: August 20, 2009Inventors: Donald Douglas Nelson, Milan Ikits, Chih-Hao Ho, Kevin Kunkler
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Publication number: 20090046516Abstract: A data writing method for flash memories suitable for a flash memory using a switching unit to control a bit line thereof is disclosed. The data writing method for flash memories includes applying a square wave signal to a word line of the flash memory and applying a descent wave signal to the switching unit for the bit line of the flash memory to receive a fixed drain voltage.Type: ApplicationFiled: August 15, 2007Publication date: February 19, 2009Applicant: MACRONIX INTERNATIONAL CO., LTD.Inventors: Chih-Hao Ho, Cheng-Ming Yih
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Publication number: 20090009198Abstract: A probing device includes a rack that has an outer support member supporting a circuit layer and a center support member supporting a probe assembly. When the tester touching down the circuit layer of the probing device from the top side, the outer support member of the rack bears this touchdown stress. When the probes of the probe holder touching down the electronic components of an IC wafer under test, the center support member of the rack bears the reaction force from the IC wafer.Type: ApplicationFiled: June 4, 2008Publication date: January 8, 2009Applicant: MJC PROBE INCORPORATIONInventors: Wei-Cheng Ku, Chih-Hao Ho, Ho-Hui Lin, Te-Chen Feng, Jun-Liang Lai, Jia-Chi Ho, Chih-Chung Chien, Chien-Huei Huang, Ai-Chuan Chang, Horng-Chuan Sun
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Publication number: 20080191726Abstract: A cantilever-type probe card includes a circuit board, a grounding block electrically connected to a zero potential, signal probes, and at least one grounding probe connected to the grounding block. Each signal probe has a probing tip, a connection portion affixed to the circuit board, and a front arm defined between the connection portion and the probing tip. The front arm of each of the signal probes is suspended in the grounding block and spaced from the grounding block at a predetermined pitch.Type: ApplicationFiled: February 13, 2007Publication date: August 14, 2008Applicant: MJC PROBE INCORPORATIONInventors: Wei-Cheng Ku, Chih-Hao Ho, Shu-Kan Lin
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Publication number: 20080164900Abstract: A probe for high frequency signal transmission includes a metal pin, and a metal line spacedly arranged on and electrically insulated from the metal pin and electrically connected to grounding potential so as to maintain the characteristic impedance of the probe upon transmitting high frequency signal. The maximum diameter of the probe is substantially equal to or smaller than two times of the diameter of the metal pin. Under this circumstance, a big amount of probes can be installed in a probe card for probing a big amount of electronic devices, so that a wafer-level electronic test can be achieved efficiently and rapidly.Type: ApplicationFiled: January 8, 2008Publication date: July 10, 2008Applicant: MJC Probe Incorporation No.Inventors: Wei-Cheng KU, Chih-Hao Ho, Chia-Tai Chang, Ho-Hui Lin, Chien-Ho Lin
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Publication number: 20080007278Abstract: A high-frequency probe card includes a circuit board having signal circuits and grounding circuits, transmission lines each having a bi-wire structure including a first lead wire for transmitting high-frequency signal and a second lead wire connected to the grounding circuits, and signal probes. High-frequency test signal provided by a test machine to the signal circuits can be transmitted to the signal probes through the first lead wires. Since the grounding circuits and second lead wires are provided adjacent to the signal circuits and first lead wires respectively, the high-frequency signal can be efficiently transmitted and the characteristic impedance matching can be maintained during high-frequency signal transmission. The bi-wire structure of the transmission lines has a diameter equal to or less than 1 millimeter, thereby allowing installation of a big number of the transmission lines such that the high-frequency test for a big number of electronic elements can be realized.Type: ApplicationFiled: October 20, 2006Publication date: January 10, 2008Applicant: MJC Probe IncorporationInventors: Wei-Cheng Ku, Hsin-Hung Lin, Chih-Hao Ho, Te-Chen Feng
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Patent number: 7179683Abstract: An apparatus having and method of forming grooves in the surface of a substrate adjacent and parallel to sidewall locations for circuit chips or die mounted on the surface. The grooves have physical dimensions to retain fill material formed between the packages and the surface of the substrate so that the fill material does not bridge between chips, thus reducing warping of the substrate due to mismatches in coefficient of thermal expansion (CTE) between the fill material, the substrate, the chips, and mold material formed over the substrate, under fill, and chips.Type: GrantFiled: August 25, 2004Date of Patent: February 20, 2007Assignee: Intel CorporationInventors: Al Ling Low, Yee Hao Ho, Yew Wee Cheong, Wei Keat Loh
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Patent number: 7152496Abstract: A screw nut assembly of a linear actuation device, having a screw, a main screw nut and a safety screw nut is disclosed. The main screw nut and the safety screw nut engaged with the screw are operative to displace linearly along an axis of the screw. The safety screw nut includes an exterior surface and the main screw nut includes a receiving portion for receiving the safety screw nut therein. The receiving portion includes an interior surface recessed with at least one slot and a spring disposed within the slot, such that the safety screw nut is inserted into the receiving portion by a resilient force exerted by the spring.Type: GrantFiled: November 14, 2003Date of Patent: December 26, 2006Assignee: Jaegar Industrial Co. Ltd.Inventors: Chih Hsien Chen, Chih Hsien Chang, Ching Feng Chan, Ming Hao Ho
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Publication number: 20060008786Abstract: The illustrative embodiment is a simulation system for practicing vascular-access procedures without using human subjects. The simulator comprises a data-processing system and a haptics device. The haptics device provides the physical interface at which an end effector, which is representative of a medical instrument (e.g., a needle, catheter, etc.), is manipulated with respect to a haptics-device base to simulate instrument insertion. The data-processing system, by exchanging signals with the haptics device, provides a three-dimensional simulation that includes the resistive forces that a medical practitioner would experience if the simulated procedure were an actual procedure that was being performed on a real anatomy (e.g., human arm, etc.). The simulator displays the ongoing simulation and assesses the performance of its user.Type: ApplicationFiled: July 8, 2004Publication date: January 12, 2006Inventors: David Feygin, Gerald Higgins, Chih-Hao Ho, Marjorie Moreau, Ned Way
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Publication number: 20050214724Abstract: The illustrative embodiment is a simulation system for practicing vascular-access procedures without using human subjects. The simulator includes a data-processing system and a haptics interface device. The haptics device provides the physical interface at which a user interacts with various mechanisms that are intended to enable the user to simulate various aspects of a vascular-access procedure. The haptics device is designed so that its physical form and manner of use are not inconsistent with the experience of performing an actual vascular access procedure.Type: ApplicationFiled: March 23, 2004Publication date: September 29, 2005Inventors: David Feygin, Chih-Hao Ho
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Publication number: 20050214726Abstract: The illustrative embodiment is a simulation system for practicing vascular-access procedures without using human subjects. The simulator includes a data-processing system and a haptics interface device. The haptics device provides the physical interface at which an end effector (e.g., medical instrument, such as a needle, catheter, etc.) is manipulated to simulate needle insertion, etc. In accordance with the illustrative embodiment, the haptics device includes a receiver. The receiver receives the end effector when it's inserted by a user into the haptics device. Sensors that are associated with the receiver monitor the motion and position of the end effector, generate signals indicative thereof, and transmit the signals to the data processing system. The signals are processed to determine the effects of manipulation of the end effector.Type: ApplicationFiled: March 23, 2004Publication date: September 29, 2005Inventors: David Feygin, Chih-Hao Ho