Abstract: A semiconductor device is provided. The semiconductor device includes a substrate of a first conductivity type and an epitaxial structure of the first conductivity type disposed on the substrate. The semiconductor device further includes a well region having a first doping concentration of a second conductivity type disposed in the epitaxial structure and the substrate. The semiconductor device further includes a drain region and a source region respectively formed in the epitaxial structure inside and outside of the well region. The semiconductor device further includes a body region of the first conductivity type disposed under the source region, and a pair of first and second doped regions disposed in the well region between the drain region and the source region. The first and second doped regions extend outside of the well region and toward the body region.

Abstract: A testing jig includes a substrate, a carrier provided on the substrate, two conductive members made of a conductive material, and a compensation member made of a conductive material. The substrate has a signal circuit and a grounding circuit thereon. The carrier has a base board made of an insulating material and a conductive circuit made of a conductive material provided thereon. The base board has a signal perforation aligning with the signal circuit, a grounding perforation aligning with the grounding circuit, and multiple compensation holes. The conductive members both have an end exposed out of the carrier, and are respectively fitted in the signal perforation and the grounding perforation to make another end thereof contact the signal circuit or the grounding circuit. The compensation member is fitted in one of the compensation holes to be electrically connected to the conductive member in the grounding perforation through the conductive circuit.

Abstract: A testing jig includes a substrate and a plurality of conductive elastic pieces, wherein the substrate has a recess and a plurality of circuits; the recess is located on a top surface of the substrate, while the circuits are provided on the top surface of the substrate. The conductive elastic pieces are provided on the substrate, and are respectively electrically connected to the circuits. Each of the conductive elastic pieces has a contact portion located within an orthographic projection range of the recess, wherein each of the contact portions contacts a pad of a DUT. Whereby, attenuation happens while transmitting test signals with high frequency can be effectively reduces by using the conductive elastic pieces to transmit test signals.

Abstract: A probe module, which is provided between a tester and a DUT for transmitting electrical signals therebetween, includes a PCB, a plurality of probes, a positioning member, and a signal connector. The PCB has a circuit and two grounding. The probes are electrical connected to the circuit and the groundings of the PCB. The positioning member is made of an insulating material, and provided on the probes. The positioning member is above the substrate, and the probes are between the substrate and the positioning member. The signal connector is adapted to be electrically connected to the tester, wherein the signal connector has a signal transmission portion and a grounding portion; the signal transmission portion is electrically connected to the circuit of the PCB, and the grounding portion is electrically connected to the at least one grounding of the PCB.

Abstract: A probe module, which is provided between a tester and a DUT for transmitting electrical signals therebetween, includes a signal transmitting member, a plurality of probes, a positioning member, and a signal connector. The signal transmitting member has a circuit and two grounding. The probes are electrical connected to the circuit and the groundings of the signal transmitting member. The positioning member is made of an insulating material, and provided on the probes. The signal connector is adapted to be electrically connected to the tester, wherein the signal connector has a signal transmission portion and a grounding portion; the signal transmission portion is electrically connected to the circuit of the signal transmitting member, and the grounding portion is electrically connected to the at least one grounding of the signal transmitting member.

Abstract: The present disclosure provides a semiconductor device, including a semiconductor substrate, an epitaxial structure, a well region, a drain region and a source region respectively formed in the epitaxial structure inside and outside of the well region. At least one set of first, second and third heavily doped regions formed in the well region between source and drain regions, wherein the first, second and third heavily doped regions are adjoined sequentially from bottom to top. A gate structure disposed over the epitaxial structure. The present disclosure also provides a method for manufacturing the semiconductor device.

Abstract: A cantilever probe card, which is provided between a device under test (DUT) and a tester, includes a carrier board, a probe base, two probes, and a transmission device. The carrier board is provided with through holes. The probe base is provided on the carrier board, and the probes are mounted to the probe base. Each probe has a tip to contact a test pad of the DUT. The transmission device is flexible, and has signal circuits. The transmission device passes through the through hole on the carrier board, and the signal circuits connect the probes to the tester respectively.

Abstract: A multilayer circuit board includes a plurality of stacked substrates, a plurality of first conductive lands, and a plurality of second conductive lands. A surface at a side of each of the substrates has an exposed portion which is not covered by the neighboring substrate, wherein each of the first conductive lands is respectively provided on each of the exposed portions. Each of the second conductive lands is provided on the exposed portion of the outermost substrate, wherein each of the substrates has a conductor pattern to be electrically connected to one of the first conductive lands and to one of the second conductive lands.

Abstract: The illustrative embodiment is a simulation system for practicing vascular-access procedures without using human subjects. The simulator includes a data-processing system and a haptics interface device. The haptics device provides the physical interface at which an end effector (e.g., medical instrument, such as a needle, catheter, etc.) is manipulated to simulate needle insertion, etc. In accordance with the illustrative embodiment, the haptics device includes a receiver. The receiver receives the end effector when it's inserted by a user into the haptics device. Sensors that are associated with the receiver monitor the motion and position of the end effector, generate signals indicative thereof, and transmit the signals to the data processing system. The signals are processed to determine the effects of manipulation of the end effector.

Abstract: A probe card for high-frequency signal transmission includes a circuit board with transmission lines, a plurality of probes, and a signal path adjuster having first lead wires with a same length respectively connected between the transmission lines and the probes. Each first lead wire is selectively replaceable by a second lead having a length different from that of the first lead wire. As a result, a first high-frequency signal transmitting from one transmission line through the associated first lead wire to the associated probe and a second high-frequency signal transmitting from another transmission line through the associated second lead wire to the associated probe may have a same output timing when the first and second high-frequency signals are synchronously inputted into the circuit board.

Abstract: The illustrative embodiment is a simulation system for practicing vascular-access procedures without using human subjects. The simulator includes a data-processing system and a haptics interface device. The haptics device provides the physical interface at which an end effector (e.g., medical instrument, such as a needle, catheter, etc.) is manipulated to simulate needle insertion, etc. In accordance with the illustrative embodiment, the haptics device includes a receiver. The receiver receives the end effector when it's inserted by a user into the haptics device. Sensors that are associated with the receiver monitor the motion and position of the end effector, generate signals indicative thereof, and transmit the signals to the data processing system. The signals are processed to determine the effects of manipulation of the end effector.

Abstract: A probe card having a configurable structure for exchanging/swapping electronic components for impedance matching is provided. In the probe card, an applied force is exerted on the electronic component so as to make the electronic component electrically connected with at least one conductive contact pad of a supporting unit. The supporting unit is a circuit board or a space transformer. In order to facilitate the exchange or swap of the electronic component, the applied force can be removed. The probe card includes a pressing plate which can be moved between a pressing position and a non-pressing position. The pressing plate has a pressing surface which is contacted with the top end of the electronic component while the pressing plate is in the pressing position. Therefore, the applied force can be generated or removed by changing the positioning of the pressing plate.

Abstract: A probe card having a configurable structure for exchanging/swapping electronic components for impedance matching and an impedance method therefore are provided. In the probe card, an applied force is exerted on the electronic component so as to make the electronic component electrically connected with at least one conductive contact pad of a supporting unit. The supporting unit is a circuit board or a space transformer. In order to facilitate the exchange or swap of the electronic component, the applied force can be removed. The probe card includes a pressing plate which can be moved between a pressing position and a non-pressing position. The pressing plate has a pressing surface which is contacted with the top end of the electronic component while the pressing plate is in the pressing position. Therefore, the applied force can be generated or removed by changing the positioning of the pressing plate.

Abstract: An earthquake alarm has a casing, a P-wave detecting device and an S-wave detecting device. The casing has a power supply, a controlling unit and a sound alarming unit. The controlling unit is electrically connected with the power supply. The sound alarming unit is electrically connected with the controlling unit. The P-wave detecting device has a longitudinally moving element and a contacting tab. The longitudinally moving element has a first end connected securely to the casing and a second end movable relative to the casing along a longitudinal direction. The contacting tab is spaced from and selectively contacting with the second end of the longitudinally moving element and is electrically connected with the controlling unit. The S-wave detecting device has a pendulum hung in the casing and a contacting ring. The contacting ring is mounted around the pendulum and is electrically connected with the controlling unit.

Abstract: The illustrative embodiment is a simulation system for practicing vascular-access procedures without using human subjects. The simulator includes a data-processing system and a haptics interface device. The haptics device provides the physical interface at which a user interacts with various mechanisms that are intended to enable the user to simulate various aspects of a vascular-access procedure. The haptics device is designed so that its physical form and manner of use are not inconsistent with the experience of performing an actual vascular access procedure.

Abstract: A probe card for high-frequency signal transmission includes a circuit board with transmission lines, a plurality of probes, and a signal path adjuster having first lead wires with a same length respectively connected between the transmission lines and the probes. Each first lead wire is selectively replaceable by a second lead having a length different from that of the first lead wire. As a result, a first high-frequency signal transmitting from one transmission line through the associated first lead wire to the associated probe and a second high-frequency signal transmitting from another transmission line through the associated second lead wire to the associated probe may have a same output timing when the first and second high-frequency signals are synchronously inputted into the circuit board.

Abstract: Method for transmitting a high-frequency signal by a coupling effect includes receiving a high-frequency signal by a high-frequency circuit and coupling the high-frequency signal to a coupling circuit by the coupling effect to output a high-frequency coupled signal, and adjusting a filter between the coupling circuit and the high-frequency circuit formed by the coupling effect for adjusting transmission frequency of the high-frequency coupled signal; upon when the high-frequency circuit includes a high-frequency metal probe, the coupling circuit comprises a coupling transmission wire. Meanwhile, upon when the high-frequency circuit includes the coupling transmission wire, the coupling circuit includes the high-frequency metal probe.

Abstract: A simulator trains for hemorrhage control using hemostatic agents, tourniquets, and/or other hemorrhage control techniques in a simulator that works with a wide variety of existing human surrogates. The simulator merges a live video feed of the surrogate and trainee's hands (or objects interacting with the surrogate) with a computer-generated visual representation of the wound and hemorrhaging blood to provide an immersive display experience to the trainee without requiring different surrogates for different simulated wounds. The trainee may wear pulse-generating glove(s) that simulate the patient's pulse where the trainee's finger tip contacts the surrogate. A sensorized substrate (e.g., load sensors, haptic output generators) may automatically be moved between the trainee and the surrogate to sense interaction with the surrogate and provide haptic feedback. The substrate may replace the surrogate altogether. The simulator may alternatively simulate events and objects other than wounds and humans.

Abstract: A probe for high frequency signal transmission includes a metal pin, and a metal line spacedly arranged on and electrically insulated from the metal pin and electrically connected to grounding potential so as to maintain the characteristic impedance of the probe upon transmitting high frequency signal. The maximum diameter of the probe is substantially equal to or smaller than two times of the diameter of the metal pin. Under this circumstance, a big amount of probes can be installed in a probe card for probing a big amount of electronic devices, so that a wafer-level electronic test can be achieved efficiently and rapidly.

Abstract: A probe card having a configurable structure for exchanging/swapping electronic components for impedance matching and an impedance method therefore are provided. In the probe card, an applied force is exerted on the electronic component so as to make the electronic component electrically connected with at least one conductive contact pad of a supporting unit. The supporting unit is a circuit board or a space transformer. In order to facilitate the exchange or swap of the electronic component, the applied force can be removed. The probe card includes a pressing plate which can be moved between a pressing position and a non-pressing position. The pressing plate has a pressing surface which is contacted with the top end of the electronic component while the pressing plate is in the pressing position. Therefore, the applied force can be generated or removed by changing the positioning of the pressing plate.