Patents by Inventor Hao Hsu

Hao Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11940388
    Abstract: Example methods are provided to improve placement of an adaptor (210,220) to a mobile computing device (100) to measure a test strip (221) coupled to the adaptor (220) with a camera (104) and a screen (108) on a face of the mobile computing device (100). The method may include displaying a light area on a first portion of the screen (108). The first portion may be adjacent to the camera (104). The light area and the camera (104) may be aligned with a key area of the test strip (221) so that the camera (104) is configured to capture an image of the key area. The method may further include providing first guiding information for a user to place the adaptor (210,220) to the mobile computing device (100) according to a position of the light area on the screen (108).
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: March 26, 2024
    Assignee: IXENSOR CO., LTD.
    Inventors: Yenyu Chen, An Cheng Chang, Tai I Chen, Su Tung Yang, Chih Jung Hsu, Chun Cheng Lin, Min Han Wang, Shih Hao Chiu
  • Patent number: 11940659
    Abstract: An optical integrated circuit (IC) structure includes: a substrate including a fiber slot formed in an upper surface of the substrate and extending from an edge of the substrate, and an undercut formed in the upper surface and extending from the fiber slot; a semiconductor layer disposed on the substrate; a dielectric structure disposed on the semiconductor layer; an interconnect structure disposed in the dielectric structure; a plurality of vents that extend through a coupling region of the dielectric structure and expose the undercut; a fiber cavity that extends through the coupling region of dielectric structure and exposes the fiber slot; and a barrier ring disposed in the dielectric structure, the barrier ring surrounding the interconnect structure and routed around the perimeter of the coupling region.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: March 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Chen-Hao Huang, Hau-Yan Lu, Sui-Ying Hsu, Yuehying Lee, Chien-Ying Wu, Chia-Ping Lai
  • Publication number: 20240096880
    Abstract: In some embodiments, the present disclosure relates to an integrated chip. The integrated chip includes a first channel structure configured to transport charge carriers within a first transistor device and a first gate electrode layer wrapping around the first channel structure. A second channel structure is configured to transport charge carriers within a second transistor device. A second gate electrode layer wraps around the second channel structure. The second gate electrode layer continuously extends from around the second channel structure to cover the first gate electrode layer. A third channel structure is configured to transport charge carriers within a third transistor device. A third gate electrode layer wraps around the third channel structure. The third gate electrode layer continuously extends from around the third channel structure to cover the second gate electrode layer.
    Type: Application
    Filed: November 16, 2023
    Publication date: March 21, 2024
    Inventors: Mao-Lin Huang, Chih-Hao Wang, Kuo-Cheng Chiang, Jia-Ni Yu, Lung-Kun Chu, Chung-Wei Hsu
  • Publication number: 20240096834
    Abstract: A method is provided. The method includes determining a first bump map indicative of a first set of positions of bumps. The method includes determining, based upon the first bump map, a first plurality of bump densities associated with a plurality of regions of the first bump map. The method includes smoothing the first plurality of bump densities to determine a second plurality of bump densities associated with the plurality of regions of the first bump map. The method includes determining, based upon the second plurality of bump densities, a second bump map indicative of the first set of positions of the bumps and a set of sizes of the bumps.
    Type: Application
    Filed: March 27, 2023
    Publication date: March 21, 2024
    Inventors: Shih Hsuan HSU, Chan-Chung CHENG, Chun-Chen LIU, Cheng-Hung CHEN, Peng-Ren CHEN, Wen-Hao CHENG, Jong-l MOU
  • Publication number: 20240094626
    Abstract: A pellicle for an extreme ultraviolet (EUV) photomask includes a pellicle frame and a main membrane attached to the pellicle frame. The main membrane includes a plurality of nanotubes, and each of the plurality of nanotubes is covered by a coating layer containing Si and one or more metal elements.
    Type: Application
    Filed: April 12, 2023
    Publication date: March 21, 2024
    Inventors: Pei-Cheng HSU, Wei-Hao LEE, Huan-Ling LEE, Hsin-Chang LEE, Chin-Hsiang LIN
  • Publication number: 20240099030
    Abstract: A bonded assembly includes an interposer; a semiconductor die that is attached to the interposer and including a planar horizontal bottom surface and a contoured sidewall; a high bandwidth memory (HBM) die that is attached to the interposer; and a dielectric material portion contacting the semiconductor die and the interposer. The contoured sidewall includes a vertical sidewall segment and a non-horizontal, non-vertical surface segment that is adjoined to a bottom edge of the vertical sidewall segment and is adjoined to an edge of the planar horizontal bottom surface of the semiconductor die. The vertical sidewall segment and the non-horizontal, non-vertical surface segment are in contact with the dielectric material portion. The contoured sidewall may provide a variable lateral spacing from the HBM die to reduce local stress in a portion of the HBM die that is proximal to the interposer.
    Type: Application
    Filed: April 20, 2023
    Publication date: March 21, 2024
    Inventors: Kuan-Yu Huang, Sung-Hui Huang, Kuo-Chiang Ting, Chia-Hao Hsu, Hsien-Pin Hsu, Chih-Ta Shen, Shang-Yun Hou
  • Patent number: 11930843
    Abstract: A cartridge assembly may be utilized in combination with an electronic nicotine delivery system for the safe, efficient and cost-effective means for delivering a controlled dose of nicotine to a user on demand. The cartridge assembly includes a reservoir with a material for holding liquid nicotine or a liquid nicotine solution and is constructed from a material that is chemically resistant to nicotine or nicotine solution. The cartridge assembly includes an anti-counterfeit feature to prevent use of an unauthorized cartridge in the electronic nicotine delivery system. The cartridge assembly also includes an anti-reuse feature that precludes reuse of the cartridge assembly once removed from the electronic nicotine delivery system. Essentially, the cartridge assembly is designed for a single use only.
    Type: Grant
    Filed: February 5, 2019
    Date of Patent: March 19, 2024
    Assignee: McNeil AB
    Inventors: Corrado Tasselli, Cheng-Hsien Lu, Chun-Hao Hsu
  • Publication number: 20240084447
    Abstract: A sealing article includes a body and a coating layer disposed on at least one surface of the body. The body comprises a polymeric elastomer such as perfluoroelastomer or fluoroelastomer. The coating layer comprises at least one metal. The sealing article may be a seal, a gasket, an O-ring, a T-ring or any other suitable product. The sealing article is resistant to ultra-violet (UV) light and plasma, and may be used for sealing a semiconductor processing chamber.
    Type: Application
    Filed: November 17, 2023
    Publication date: March 14, 2024
    Inventors: Peng-Cheng Hong, Jun-Liang Pu, W.L. Hsu, Chung-Hao Kao, Chia-Chun Hung, Cheng-Yi Wu, Chin-Szu Lee
  • Publication number: 20240089607
    Abstract: An image sensing device and a control device of an illumination device thereof are provided. The control device includes a control circuit, an operation circuit, and multiple driving signal generators. The control circuit generates multiple control signals. The operation circuit performs a logical operation on the control signals and an image capturing signal to generate multiple operation results. The driving signal generator respectively provides multiple driving signals to the illumination device according to the operation results, and the driving signals respectively have multiple different output powers.
    Type: Application
    Filed: May 29, 2023
    Publication date: March 14, 2024
    Applicant: HTC Corporation
    Inventors: Chao Shuan Huang, Sheng-Long Wu, Yu-Jui Hsu, Shih-Yao Tsai, Tun-Hao Chao, Sen-Lin Chung, Chih Pin Chung, Chih-Yuan Chien, Shih Hong Sun
  • Publication number: 20240089917
    Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment (UE) may receive configuration information identifying a set of possible paging occasions and a set of connected mode communications. The UE may receive paging in a paging occasion, of the set of possible paging occasions, for which there is not a collision between the paging occasion and the set of connected mode communications and that is selected from the set of possible paging occasions based at least in part on a power utilization characteristic. Numerous other aspects are described.
    Type: Application
    Filed: September 12, 2022
    Publication date: March 14, 2024
    Inventors: Edward William SANDOR, Sharad SHAHI, Shishir RAMESHA, Chun-Hao HSU, Heechoon LEE
  • Publication number: 20240085613
    Abstract: A backlight module includes a light guide plate, a light source, a first prism sheet, and a second prism sheet. The light source is disposed on a light incident surface of the light guide plate. The first prism sheet is disposed on a side of a light exiting surface of the light guide plate and has multiple first prism structures facing the light guide plate. The second prism sheet has multiple second prism structures facing the light guide plate. An included angle between an extending direction of the first prism structures and an extending direction of the second prism structures is greater than or equal to 85 degrees and less than or equal to 95 degrees. An included angle between the extending direction of the second prism structures and the light incident surface is greater than or equal to 85 degrees and less than or equal to 95 degrees.
    Type: Application
    Filed: July 26, 2023
    Publication date: March 14, 2024
    Applicants: Coretronic Optics (Suzhou) Co., Ltd., Coretronic Corporation
    Inventors: Chun-Hsiang Hsu, Yen-Hao Lin, Wen-Pin Yang
  • Patent number: 11926113
    Abstract: An optical element and a method for manufacturing the optical element are described. The optical element includes a transparent substrate, an optical layer, and an adhesive layer. The optical layer is located on a surface of the transparent substrate. The optical layer has a first surface and a second surface, which are opposite to each other. The first surface is set with various diffracting optical structures. A refractive index of the optical layer is equal to or greater than 1.4. The adhesive layer is sandwiched between the surface of the transparent substrate and the second surface of the optical layer.
    Type: Grant
    Filed: August 3, 2022
    Date of Patent: March 12, 2024
    Assignee: HIMAX TECHNOLOGIES LIMITED
    Inventors: Han Yi Kuo, Shu-Hao Hsu, Yin Tung Lu
  • Patent number: 11927991
    Abstract: Embodiments of synchronized hinges for foldable displays are described. In some embodiments, a hinge may include: a first bracket coupled to a first shaft via a first arm, a second bracket coupled to a second shaft via a second arm, and a synchronization bracket coupled to the first and second shafts.
    Type: Grant
    Filed: May 12, 2021
    Date of Patent: March 12, 2024
    Assignee: Dell Products, L.P.
    Inventors: Christopher A. Torres, Enoch Chen, Anthony J. Sanchez, Chia-Hao Hsu, Hsu Hong Yao, Mo-Yu Zhang
  • Publication number: 20240079364
    Abstract: Die structures and methods of forming the same are described. In an embodiment, a device includes: a lower integrated circuit die; a first upper integrated circuit die face-to-face bonded to the lower integrated circuit die, the first upper integrated circuit die including a first semiconductor substrate and a first through-substrate via; a gap-fill dielectric around the first upper integrated circuit die, a top surface of the gap-fill dielectric being substantially coplanar with a top surface of the first semiconductor substrate and with a top surface of the first through-substrate via; and an interconnect structure including a first dielectric layer and first conductive vias, the first dielectric layer disposed on the top surface of the gap-fill dielectric and the top surface of the first semiconductor substrate, the first conductive vias extending through the first dielectric layer to contact the top surface of the first through-substrate via.
    Type: Application
    Filed: January 9, 2023
    Publication date: March 7, 2024
    Inventors: Chia-Hao Hsu, Jian-Wei Hong, Kuo-Chiang Ting, Sung-Feng Yeh
  • Publication number: 20240078341
    Abstract: Examples described herein relate to a security management system to secure a container ecosystem. In some examples, the security management system may protect one or more entities such as container management applications, container images, containers, and/or executable applications within the containers. The security management system may make use of digital cryptography to generate digital signatures corresponding to one or more of these entities and verify them during the execution so that any compromised entities can be blocked from execution and the container ecosystem may be safeguarded from any malicious network attacks.
    Type: Application
    Filed: September 7, 2022
    Publication date: March 7, 2024
    Inventors: Wan-Yen Hsu, Chih-Hao Chang, Lin-Chan Hsiao
  • Publication number: 20240076454
    Abstract: In some aspects, the present disclosure pertains to reactive multi-arm polymers having a cage-like silicon-oxygen core and a plurality of polyoxazoline-containing arms extending from the core, in which the polyoxazoline-containing arms comprise a first end that is covalently attached to the cage-like silicon-oxygen core and a second end comprising a moiety that comprises a reactive end group. In other aspects, the present disclosure pertains to systems that comprise such reactive multi-arm polymers and multifunctional compounds that comprise functional groups that are reactive with the reactive end groups of the reactive multi-arm polymers. Other aspects pertain to medical hydrogels formed by crosslinking such reactive multi-arm polymers with such multifunctional compounds and methods of treatment that comprise administering to a subject a mixture that comprises and such reactive multi-arm polymers with such multifunctional compounds.
    Type: Application
    Filed: August 15, 2023
    Publication date: March 7, 2024
    Applicant: Boston Scientific Scimed, Inc.
    Inventors: Joseph Thomas Delaney, JR., Yen-Hao Hsu
  • Publication number: 20240080180
    Abstract: The federated learning system includes a moderator and client devices. Each client device performs a method for verifying model update as follows: receiving a hash function and a general model; training a client model according to the general model and raw data; calculating a difference as an update parameter between the general model and the client model, sending the update parameter to the moderator; inputting the update parameter to the hash function to generate a hash value; sending the hash value to other client devices, and receiving other hash values; summing all the hash values to generate a trust value; receiving an aggregation parameter calculated according to the update parameters; inputting the aggregation parameter to the hash function to generate a to-be-verified value; and updating the client model according to the aggregation parameter when the to-be-verified value equals the trust value.
    Type: Application
    Filed: December 20, 2022
    Publication date: March 7, 2024
    Inventors: Chih-Fan HSU, Wei-Chao CHEN, Jing-Lun Huang, Ming-Ching Chang, Feng-Hao Liu
  • Publication number: 20240075190
    Abstract: In some aspects, the present disclosure pertains to systems for forming a hydrogel that comprise (a) an iodinated polyamino compound and (b) a reactive multi-arm polymer that comprises a plurality of hydrophilic polymer arms having unsaturated end groups that are reactive with amino groups of the iodinated polyamino compound. Other aspects of the present disclosure pertain to medical hydrogels that are formed by crosslinking the iodinated polyamino compound and the reactive multi-arm polymer of such systems. Further aspects of the present disclosure pertain to medical procedures that can be performed using such systems.
    Type: Application
    Filed: August 15, 2023
    Publication date: March 7, 2024
    Applicant: Boston Scientific Scimed, Inc.
    Inventors: Yen-Hao Hsu, Joseph Thomas Delaney, Jr., Cristian Parisi
  • Publication number: 20240079391
    Abstract: In an embodiment, a device includes: a first integrated circuit die comprising a semiconductor substrate and a first through-substrate via; a gap-fill dielectric around the first integrated circuit die, a surface of the gap-fill dielectric being substantially coplanar with an inactive surface of the semiconductor substrate and with a surface of the first through-substrate via; a dielectric layer on the surface of the gap-fill dielectric and the inactive surface of the semiconductor substrate; a first bond pad extending through the dielectric layer to contact the surface of the first through-substrate via, a width of the first bond pad being less than a width of the first through-substrate via; and a second integrated circuit die comprising a die connector bonded to the first bond pad.
    Type: Application
    Filed: January 10, 2023
    Publication date: March 7, 2024
    Inventors: Chia-Hao Hsu, Jian-Wei Hong, Kuo-Chiang Ting, Sung-Feng Yeh
  • Publication number: 20240076266
    Abstract: In various aspects, the present disclosure pertains to systems for forming hydrogels that comprise an iodinated polyamino compound and a reactive multi-arm polymer that comprises a plurality of hydrophilic polymer arms having reactive end groups that are reactive with amino groups of the iodinated polyamino compound. Other aspects of the present disclosure pertain to medical hydrogels that are formed by crosslinking the iodinated polyamino compound and the reactive multi-arm polymer of such systems. Further aspects of the present disclosure pertain to medical procedures that can be performed using such systems. Still other aspects of the present disclosure pertain to methods of making iodinated polyamino compounds.
    Type: Application
    Filed: August 17, 2023
    Publication date: March 7, 2024
    Applicant: Boston Scientific Scimed, Inc.
    Inventors: Joseph Thomas Delaney, JR., Yen-Hao Hsu, Tatyana Dyndikova