Patents by Inventor Haruki Ito

Haruki Ito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Synthetic leather
    Patent number: 12031267
    Abstract: Provided is a synthetic leather including a fibrous substrate, a porous resin layer provided on the fibrous substrate, and a non-porous resin layer provided on the porous resin layer. The synthetic leather has a thickness of 800 ?m or more, and a vertical cross-section of the porous resin layer has a pore area ratio of 25% or more.
    Type: Grant
    Filed: May 12, 2020
    Date of Patent: July 9, 2024
    Assignee: SEIREN CO., LTD.
    Inventor: Haruki Ito
  • SYNTHETIC LEATHER
    Publication number: 20220220667
    Abstract: Provided is a synthetic leather including a fibrous substrate, a porous resin layer provided on the fibrous substrate, and a non-porous resin layer provided on the porous resin layer. The synthetic leather has a thickness of 800 ?m or more, and a vertical cross-section of the porous resin layer has a pore area ratio of 25% or more.
    Type: Application
    Filed: May 12, 2020
    Publication date: July 14, 2022
    Applicant: SEIREN CO., LTD.
    Inventor: Haruki Ito
  • SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, CIRCUIT SUBSTRATE, AND ELECTRONIC APPARATUS
    Publication number: 20220115296
    Abstract: A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.
    Type: Application
    Filed: December 20, 2021
    Publication date: April 14, 2022
    Inventors: Haruki Ito, Nobuaki Hashimoto
  • Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
    Patent number: 11205608
    Abstract: A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.
    Type: Grant
    Filed: July 27, 2020
    Date of Patent: December 21, 2021
    Assignee: Advanced Interconnect Systems Limited
    Inventors: Haruki Ito, Nobuaki Hashimoto
  • SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, CIRCUIT SUBSTRATE, AND ELECTRONIC APPARATUS
    Publication number: 20200357724
    Abstract: A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.
    Type: Application
    Filed: July 27, 2020
    Publication date: November 12, 2020
    Inventors: Haruki Ito, Nobuaki Hashimoto
  • Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
    Patent number: 10727166
    Abstract: A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.
    Type: Grant
    Filed: October 28, 2019
    Date of Patent: July 28, 2020
    Assignee: Advanced Interconnect Systems Limited
    Inventors: Haruki Ito, Nobuaki Hashimoto
  • Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
    Patent number: 10636726
    Abstract: A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.
    Type: Grant
    Filed: September 12, 2019
    Date of Patent: April 28, 2020
    Assignee: Advanced Interconnect Systems Limited
    Inventors: Haruki Ito, Nobuaki Hashimoto
  • SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, CIRCUIT SUBSTRATE, AND ELECTRONIC APPARATUS
    Publication number: 20200066616
    Abstract: A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.
    Type: Application
    Filed: October 28, 2019
    Publication date: February 27, 2020
    Inventors: Haruki Ito, Nobuaki Hashimoto
  • SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, CIRCUIT SUBSTRATE, AND ELECTRONIC APPARATUS
    Publication number: 20200006200
    Abstract: A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.
    Type: Application
    Filed: September 12, 2019
    Publication date: January 2, 2020
    Inventors: Haruki Ito, Nobuaki Hashimoto
  • SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, CIRCUIT SUBSTRATE, AND ELECTRONIC APPARATUS
    Publication number: 20190295927
    Abstract: A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.
    Type: Application
    Filed: June 7, 2019
    Publication date: September 26, 2019
    Inventors: Haruki Ito, Nobuaki Hashimoto
  • Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
    Patent number: 10424533
    Abstract: A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.
    Type: Grant
    Filed: June 7, 2019
    Date of Patent: September 24, 2019
    Assignee: ADVANCED INTERCONNECT SYSTEMS LIMITED
    Inventors: Haruki Ito, Nobuaki Hashimoto
  • Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
    Patent number: 10361144
    Abstract: A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.
    Type: Grant
    Filed: June 22, 2018
    Date of Patent: July 23, 2019
    Assignee: ADVANCED INTERCONNECT SYSTEMS LIMITED
    Inventors: Haruki Ito, Nobuaki Hashimoto
  • Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
    Patent number: 10312182
    Abstract: A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.
    Type: Grant
    Filed: October 8, 2018
    Date of Patent: June 4, 2019
    Assignee: ADVANCED INTERCONNECT SYSTEMS LIMITED
    Inventors: Haruki Ito, Nobuaki Hashimoto
  • Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
    Patent number: 10283438
    Abstract: A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.
    Type: Grant
    Filed: June 22, 2018
    Date of Patent: May 7, 2019
    Assignee: ADVANCED INTERCONNECT SYSTEMS LIMITED
    Inventors: Haruki Ito, Nobuaki Hashimoto
  • Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
    Patent number: 10262923
    Abstract: A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.
    Type: Grant
    Filed: June 22, 2018
    Date of Patent: April 16, 2019
    Assignee: ADVANCED INTERCONNECT SYSTEMS LIMITED
    Inventors: Haruki Ito, Nobuaki Hashimoto
  • SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, CIRCUIT SUBSTRATE, AND ELECTRONIC APPARATUS
    Publication number: 20190043786
    Abstract: A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.
    Type: Application
    Filed: October 8, 2018
    Publication date: February 7, 2019
    Inventors: Haruki Ito, Nobuaki Hashimoto
  • SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, CIRCUIT SUBSTRATE, AND ELECTRONIC APPARATUS
    Publication number: 20180301394
    Abstract: A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.
    Type: Application
    Filed: June 22, 2018
    Publication date: October 18, 2018
    Inventors: Haruki Ito, Nobuaki Hashimoto
  • SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, CIRCUIT SUBSTRATE, AND ELECTRONIC APPARATUS
    Publication number: 20180301393
    Abstract: A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.
    Type: Application
    Filed: June 22, 2018
    Publication date: October 18, 2018
    Inventors: Haruki Ito, Nobuaki Hashimoto
  • SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, CIRCUIT SUBSTRATE, AND ELECTRONIC APPARATUS
    Publication number: 20180301395
    Abstract: A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.
    Type: Application
    Filed: June 22, 2018
    Publication date: October 18, 2018
    Inventors: Haruki Ito, Nobuaki Hashimoto
  • Physical quantity sensor, electronic device, altimeter, electronic apparatus, and mobile object
    Patent number: 9863828
    Abstract: A physical quantity sensor includes: a physical quantity sensor chip which detects a physical quantity and generates an electrical signal; a package which has an internal space and accommodates the physical quantity sensor chip in the internal space; and a first wire which connects the package and the physical quantity sensor chip together. The physical quantity sensor chip is moored in the internal space by the first wire.
    Type: Grant
    Filed: June 12, 2015
    Date of Patent: January 9, 2018
    Assignee: Seiko Epson Corporation
    Inventors: Hideo Imai, Satoshi Nakajima, Haruki Ito