Abstract: Systems and method are provided for a memory circuit. In embodiments, the circuit includes a plurality of memory cells corresponding to a word of data and a global write word line. A plurality of local write lines are connected to a subset of the plurality of memory cells of the word of data. Selection logic is configured to activate a particular subset of memory cells for writing via a particular local write line based on a signal on the global write line and a selection signal associated with the particular subset of memory cells.

Abstract: An electronic device for checking a randomness of an identification key device, a random key checker circuit for an electronic device and a method of checking randomness for an electronic device. An electronic device for checking a randomness of an identification key device includes an identification key generator, configured to generate an identification key. A random key checker circuit, configured to receive the identification key from the identification key generator, calculates a randomness value of the identification key according to the identification key for checking a randomness of the identification key and generates an output of the identification key with high randomness.

Abstract: A memory circuit includes a selection circuit, a column of memory cells, and an adder tree. The selection circuit is configured to receive input data elements, each input data element including a number of bits equal to H, and output a selected set of kth bits of the H bits of the input data elements. Each memory cell of the column of memory cells includes a first storage unit configured to store a first weight data element and a first multiplier configured to generate a first product data element based on the first weight data element and a first kth bit of the selected set of kth bits. The adder tree is configured to generate a summation data element based on each of the first product data elements.

Abstract: A memory device including: active regions; gate electrodes which are substantially aligned relative to four corresponding track lines such that the memory device has a width of four contacted poly pitch (4 CPP) and are electrically coupled to the active regions; contact-to-transistor-component structures (MD structures) which are electrically coupled to the active regions, and are interspersed among corresponding ones of the gate electrodes; via-to-gate/MD (VGD) structures which are electrically coupled to the gate electrodes and the MD structures; conductive segments which are in a first layer of metallization (M_1st layer), and are electrically coupled to the VGD structures; buried contact-to-transistor-component structures (BVD structures) which are electrically coupled to the active regions; and buried conductive segments which are in a first buried layer of metallization (BM_1st layer), and are electrically coupled to the BVD structures, and correspondingly provide a first reference voltage or a second r

Abstract: A memory device is disclosed. The memory device includes a first program line and a second program line. A first portion of the first program line is formed in a first conductive layer, and a second portion of the first program line is formed in a second conductive layer above the first conductive layer. A first portion of the second program line is formed in the first conductive layer, and a second portion of the second program line is formed in a third conductive layer above the second conductive layer. A width of at least one of the second portion of the first program line or the second portion of the second program line is different from a width of at least one of the first portion of the first program line or the first portion of the second program line. A method is also disclosed herein.

Abstract: A memory device includes a first program line and a second program line. A first portion of the first program line is formed in a first conductive layer, and a second portion of the first program line is formed in a second conductive layer above the first conductive layer. A first portion of the second program line is formed in the first conductive layer. A second portion of the second program line is formed in the second conductive layer. A third portion of the second program line is formed in a third conductive layer above the second conductive layer. The first portion and the second portion of the first program line have sizes that are different from each other, and the first portion, the second portion and the third portion of the second program line have sizes that are different from each other.

Abstract: Disclosed herein are related to an integrated circuit to regulate a supply voltage. In one aspect, the integrated circuit includes a metal rail including a first point, at which a first functional circuit is connected, and a second point, at which a second functional circuit is connected. In one aspect, the integrate circuit includes a voltage regulator coupled between the first point of the metal rail and the second point of the metal rail. In one aspect, the voltage regulator senses a voltage at the second point of the metal rail and adjusts a supply voltage at the first point of the metal rail, according to the sensed voltage at the second point of the metal rail.

Abstract: A method includes specifying a target memory macro, and determining failure rates of function-blocks in the target memory macro based on an amount of transistors and area distributions in a collection of base cells. The method also includes determining a safety level of the target memory macro, based upon a failure-mode analysis of the target memory macro, from a memory compiler, based on the determined failure rate.

Abstract: A static random access memory (SRAM) cell includes a four-contact polysilicon pitch (4Cpp) fin field effect transistor (FinFET) architecture including a first bit-cell and a second bit cell. The SRAM cell includes a first bit line and a first complementary bit line, wherein the first bit line and the first complementary bit line are shared by the first and second bit-cells of the SRAM cell. The SRAM cell includes a first word line connected to the first bit cell, and a second word line connected to the second bit cell.

Abstract: An SRAM includes multiple memory cells, each memory cell includes a data storage unit; a data I/O control adapted to input data to, and output data from, a data line (BL); and multiple access controls respectively connected to at least two access control lines (WL's) and adapted to enable and disable the data input and output from the at least two WL's (WX and WY). The access controls are configured to permit data input only when both WL's are in their respective states that permit data input. A method of writing to a group of SRAM cells include sending a first write-enable signal to the cells via a first WL, sending a group of respective second write-enable signals to the respective cells, and, for each of the cells, preventing writing data to the cell if either of the first write-enable signal and respective second write enable signal is in a disable-state.

Abstract: A cell structure is disclosed. The cell structure includes a first unit comprising a first group of transistors and a first data latch, a second unit comprising a second group of transistors and a second data latch a read port unit comprising a plurality of p-type transistors, a search line and a complementary search line, the search line and the complementary search line function as input of the cell structure, and a master line, the master line functions as an output of the cell structure, the first unit is coupled to the second unit, both the first and the second units are coupled to the read port unit. According to some embodiments, the first data latch comprises a first and a second p-type transistors, a first and a second n-type transistors.

Abstract: A memory cell includes a write port and a read port. The write port includes two cross-coupled inverters that form a storage unit. The cross-coupled inverters are connected between a first power source signal line and a second power source signal line. The write port also includes a first local interconnect line in an interconnect layer that is connected to the second power source signal line. The read port includes a transistor that is connected to the storage unit in the write port and to the second power source signal line, and a second local interconnect line in the interconnect layer that is connected to the second power source signal line. The second local interconnect line in the read port is separate from the first local interconnect line in the write port.

Abstract: A memory device is provided. The memory device includes a plurality of memory cells arranged in a matrix of a plurality of rows and a plurality of columns. A first column of the plurality of columns of the matrix includes a first plurality of memory cells of the plurality of memory cells, a first pair of bit lines connected to each of the first plurality of bit cells, and a second pair of bit lines connectable to the first pair of bit lines through a plurality of switches.

Abstract: A semiconductor chip is provided. The semiconductor chip includes a SRAM cell, a logic cell, a signal line and a ground line. The SRAM cell includes a storage transmission gate, a read transmission gate and a latch circuit. The latch circuit is serially connected between the storage and read transmission gates, and includes a first inverter, a second inverter and a transmission gate connected to an output of the first inverter, an input of the second inverter and an output of the storage transmission gate. The logic cell disposed aside the SRAM cell is connected with the SRAM cell by first and second active structures. The signal and ground lines extend at opposite sides of the SRAM and logic cells, and are substantially parallel with the first and second active structures. The SRAM and logic cells are disposed between and electrically connected to the signal and ground lines.

Abstract: A static random access memory (SRAM) circuit can group the column bit lines in a memory array into subsets of bit lines, and a y-address signal input is provided for each subset of bit lines. Additionally or alternatively, each row in the array of memory cells is operably connected to multiple word lines.

Abstract: A method of designing a memory circuit is provided that includes generating a layout of a first memory cell using an integrated circuit design system. The layout of the first memory cell is generated by routing a first word line in a first layer on a first level, and routing a second word line in the first layer. Also, the method includes generating a layout of a second memory cell using the integrated circuit design system. The layout of the second memory cell is generated by routing a third word line in the first layer, the second word line being between the first word line and the third word line, and routing a fourth word line in the first layer, the third word line being between the second word line and the fourth word line. Moreover, the method includes assigning a first color scheme to the first word line and to the third word line, and assigning a second color scheme to the second word line and to the fourth word line.

Abstract: A method, of detecting an address decoding error of a semiconductor device, includes: decoding an original address, with an address decoder of the semiconductor device, to form a corresponding decoded address; recoding the decoded address, with an encoder of the semiconductor device, to form a recoded address; making a comparison, with a comparator of the semiconductor device, of the recoded address and the original address; and detecting an address decoding error based on the comparison.

Abstract: A method of fabricating (a distributed write driving arrangement for a semiconductor memory device) includes: forming bit cells and a local write driver in a first device layer; forming a local write bit (LWB) line and a local write bit_bar (LWB_bar) line in a first metallization layer; connecting each of the bit cells correspondingly between the LWB and LWB_bar lines; connecting the local write driver to the LWB line and the LWB_bar line; forming a global write bit (GWB) line and a global write bit_bar (GWBL_bar) line in a second metallization layer; connecting the GWB line to the LWB line; connecting the GWB line and the GWBL_bar line to the corresponding LWB line and LWB_bar line; forming a global write driver in a second device layer; and connecting the global write driver to the GWB line and the GWBL_bar line.

Abstract: A method of forming a memory circuit includes generating a layout design of the memory circuit, and manufacturing the memory circuit based on the layout design. The memory circuit is a four transistor memory cell that includes at least the first pass gate transistor and the first pull up transistor. The generating of the layout design includes generating a first active region layout pattern corresponding to fabricating a first active region of a first pull up transistor, generating a second active region layout pattern corresponding to fabricating a second active region of a first pass gate transistor, and generating a first metal contact layout pattern corresponding to fabricating a first metal contact is electrically coupled to a source of the first pull up transistor. The first metal contact layout pattern extends in a second direction, overlaps a cell boundary of the memory circuit and the first active region layout pattern.

Abstract: A charge sharing scheme is used to mitigate the variations in cell currents in order to achieve higher accuracy for CIM computing. In some embodiments, a capacitor is associated with each SRAM cell, and the capacitors associated with all SRAM cells in a column are included in averaging the RBL current. In some embodiments, a memory unit associated to an RBL in a CIM device includes a storage element adapted to store a weight, a first switch device connected to the storage element and adapted to be controlled by an input signal and generate a product signal having a magnitude indicative of the product of the input signal and the stored weight. The memory unit further includes a capacitor adapted to receive the product signal and store an amount of charge corresponding to the magnitude of the product signal. The memory unit further include a second switch device adapted to transfer the charge on the capacitor to the RBL.