Abstract: A heat-transfer component defines a thermal-interface surface and has a composite thermal-interface material on the thermal-interface surface. The composite thermal-interface material comprises a silicone oil substrate and a metallic filler. In some embodiments, the metallic filler undergoes a transition from solid to liquid at a temperature below a typical operating temperature of an electronic device. For example, an embodiment of a metallic filler has a solid-to-liquid transition temperature between about 25° C. and about 95° C. In some embodiments, a second thermal interface material extends around an outer periphery of the composite thermal interface material, which can inhibit or prevent seepage or other migration of metallic filler in the composite thermal-interface material out of a thermal interface region between the heat-transfer component and, e.g., a heat-generating component. Also disclosed are electrical devices having a heat generating component cooled by such a heat-transfer component.

Abstract: A heat-transfer component defines a thermal-interface surface and has a metallic thermal-interface material bonded to the thermal-interface surface. The metallic thermal-interface material has a solid-to-liquid phase-change temperature between about 60° C. and about 90° C. With a thermal-interface material bonded to the thermal-interface surface, the thermal-contact resistance between the thermal-interface material and the heat-transfer component can be reduced or substantially eliminated compared to conventional thermal-interface materials, including conventional metallic thermal-interface materials. Also disclosed are electrical devices having a heat generating component cooled by such a heat-transfer component.

Abstract: A heat-transfer component defines a thermal-interface surface and has a composite thermal-interface material bonded to the thermal-interface surface. The composite thermal-interface material comprises a particulate filler material dispersed within a metallic carrier material having a solid-to-liquid phase-change temperature between about 60° C. and about 90° C. With a thermal-interface material bonded to the thermal-interface surface, the thermal-contact resistance between the thermal-interface material and the heat-transfer component can be reduced or substantially eliminated compared to conventional thermal-interface materials, including conventional metallic thermal-interface materials.

Abstract: A loop thermosyphon can combine the best of heat-pipes and traditional liquid-cooling systems that include a mechanical pump. A disclosed heat-transfer device includes a first heat-transfer component and a second heat-transfer component fluidly coupled with each other by a first conduit and a second conduit. A first manifold is positioned in the first heat-transfer component and defines a first plurality of liquid pathways. The first manifold fluidly couples with the first conduit. A second manifold is also positioned in the first heat-transfer component and defines a second plurality of liquid pathways fluidly coupled with and extending from the first plurality of liquid pathways. The second manifold further defines a plurality of boiling channels, a plurality of accumulator channels and a vapor manifold. The boiling channels extend transversely relative to and are fluidly coupled with the second plurality of liquid pathways.

Abstract: The present invention is directed to an electronic device with an ionic wind generator assembly that provides flow of air stream inside the housing of the device. The ionic wind generator assembly with a cover assembly and a catalyst provide a mechanism for cooling heated components embedded on a PCB of the electronic device. The cover assembly is configured depending on the orientation of the ionic wind generators to increase cooling when there is a narrow gap between the PCB and the ionic wind generator assembly through which the airstream flows for cooling of the internal components.

Abstract: Heat transfer devices are based on using one or more ionic pumps to circulate a dielectric working fluid around a closed circulation path, which may be contained in a conduit. The working fluid may be a liquid or a gas. The ionic pumps are disposed along the closed circulation path. The pumps include an emitter and collector. When a voltage is applied to the emitter, the working fluid is ionized at the emitter. The ionized fluid is drawn electrostatically to the lower-voltage collector, which, through collision with molecules that in turn impart their momentum, creates a flow of the working fluid. This approach may be used with either positive or negative corona devices.

Abstract: Emitter wires and collector pins of current ionic air flow generator designs are replaced by conductors joined to a dielectric substrate, such as metal deposited on the dielectric substrate. One conductor, which is shaped to form the emitter with sharp edges, is joined to one side of the dielectric substrate. Another conductor, which is shaped to form the collector with rounded edges, is joined to the opposite side of the dielectric substrate. The dielectric substrate is not solid. It is shaped with voids that form an air gap between the emitter and the collector. Thus, when a voltage is applied to the emitter, air is ionized at the emitter. The ionized air is drawn electrostatically to the lower-voltage collector, which, through collision with neutral molecules that in turn impart their momentum, creates a flow of air through the air gap.

Abstract: The present invention is a directed to an integrated ionic air mover that provides air flow rates through an opening within the a printed circuit board (PCB), or other similar insulating surface, to create the structure of the air mover, so that high heat generating components mounted on the PCB can be cooled. The ionic air mover has sharp and blunt electrodes with a corona discharge taking place in the air gap in between the electrodes. A directional emission of the ions creates an ionic wind the moves air through the PCB. The invention provides a low-cost structure, while achieving high electro-air flow power conversion efficiency and air-flow performance integrated into the PCB that the heat generating components are mounted on. The ionic air mover may also be surface mounted to a PCB and include a transmittal coil for wireless charging.

Abstract: A loop thermosyphon can combine the best of heat-pipes and traditional liquid-cooling systems that include a mechanical pump. A disclosed heat-transfer device includes a first heat-transfer component and a second heat-transfer component fluidly coupled with each other by a first conduit and a second conduit. A first manifold is positioned in the first heat-transfer component and defines a first plurality of liquid pathways. The first manifold fluidly couples with the first conduit. A second manifold is also positioned in the first heat-transfer component and defines a second plurality of liquid pathways fluidly coupled with and extending from the first plurality of liquid pathways. The second manifold further defines a plurality of boiling channels, a plurality of accumulator channels and a vapor manifold. The boiling channels extend transversely relative to and are fluidly coupled with the second plurality of liquid pathways.

Abstract: A cooling system includes an evaporator unit, a condensing unit, and a thermal battery fluidly coupled to the evaporator unit and the condensing unit. The cooling system also includes a control system configured to selectively direct a fluid refrigerant between any two of the condensing unit, the evaporator unit, and the thermal battery.

Abstract: A cooling system includes an evaporator unit, a condensing unit, and a thermal battery fluidly coupled to the evaporator unit and the condensing unit. The cooling system also includes a control system configured to selectively direct a fluid refrigerant between any two of the condensing unit, the evaporator unit, and the thermal battery.

Abstract: In one embodiment, a heat exchanger may be formed using a corrosion-resistant aluminum material to enable usage of water as a working fluid for the exchanger. In one embodiment, the exchanger may have an aluminum substrate with multiple treated layers formed thereon. A first treated layer corresponds to a hydrated aluminum oxide layer, and a second treated layer corresponds to a mono-layer organic molecule layer. Other embodiments are described and claimed.

Abstract: An apparatus and method configured to provide electric power from a thermal source. The apparatus may include a thermoelectric generator and a heat source. The apparatus may include a fuel source. The heat source may be combustive or non-combustive. The apparatus may also include a thermal battery. The heat source may be configured to combust a hydrocarbon fuel to generated heat. The apparatus may include one or more thermal diodes and/or a heat sink to remove waste heat. The method may include converting thermal energy into electrical energy using the apparatus. The method may also include powering a light or other electrical load using the apparatus. The present disclosure includes a method for manufacturing the apparatus.

Abstract: The present disclosure is related to an apparatus for generating electric power from selected wavelengths of electromagnetic radiation and a method of manufacture of said apparatus. The apparatus may include a selective wavelength absorber that is thermally coupled to a thermoelectric generator. The selective wavelength absorber may include alternating absorber and dielectric layers configured to absorb and reflect selected wavelengths of electromagnetic radiation. Absorbed electromagnetic radiation may be converted to heat energy for driving the thermoelectric generator. The method may include manufacturing the selective wavelength absorber, including depositing the alternating layers on a substrate that has been formed to receive the electromagnetic radiation at a selected angle or range of angles.

Abstract: The present disclosure provides a method and a thermoelectric cooling apparatus for cooling a fluid. The thermoelectric cooling apparatus comprises one or more of thermoelectric devices, a hot sink, a cold sink, and a heat rejection apparatus which comprises condenser fins and a fan to attain a high figure of merit. The heat from the fluid is transferred to the hot sink and/or one or more heat pipes by the one or more thermoelectric devices. The heat from the one or more heat pipes is dissipated to the ambient through condenser fins and the fan.

Abstract: The heat pipe made of composite material is a sealed hollow tube being a multilayer structure made of a composite material including copper and aluminum, is filled with water and has an inner surface, an evaporator end, a condenser end and a wick. The wick is attached to the inner surface of the tube. The invention provides a cost effective and lightweight heat pipe as it uses aluminum, which is cheap and light in weight. Also, the invention provides a high performance heat pipe system as it uses copper, which is highly thermally conductive. Therefore, the heat pipe is desirable for thermal management applications in a variety of products.

Abstract: Embodiments of the present invention provide composite bodies having a discontinuous graphite preform and at least one silicon-bearing metal alloy infiltrant. Embodiments of the present invention also provide methods for producing such composite bodies. The metal alloy is preferably comprised of aluminum, copper, or magnesium, or combinations thereof. Certain preferred embodiments provide at least one aluminum alloy having from about 5% silicon to about 30% silicon, more preferably from about 11% to about 13% silicon, as an alloying element. Certain presently preferred embodiments provide an aluminum-silicon eutectic composition having about 12.5% silicon. Embodiments of the invention provide composite materials be “tuned” to more closely match thermal expansion characteristics of a number of semiconductor or integrated circuit materials such as, but not limited to, silicon, alumina, aluminum nitride, gallium nitride, and gallium arsenide while also providing high thermal conductivity.

Abstract: A heat sink including a composite material base plate that defines at least one through hole. At least one composite material insert is position into the at least one through hole prior to pressure infiltration. The composite material insert is oriented to increase thermal conductivity in the through-plan direction.

Abstract: In one embodiment, a heat exchanger may be formed using a corrosion-resistant aluminum material to enable usage of water as a working fluid for the exchanger. In one embodiment, the exchanger may have an aluminum substrate with multiple treated layers formed thereon. A first treated layer corresponds to a hydrated aluminum oxide layer, and a second treated layer corresponds to a mono-layer organic molecule layer. Other embodiments are described and claimed.

Abstract: Embodiments of the present invention provide composite bodies having a discontinuous graphite preform and at least one silicon-bearing metal alloy infiltrant. Embodiments of the present invention also provide methods for producing such composite bodies. The metal alloy is preferably comprised of aluminum, copper, or magnesium, or combinations thereof. Certain preferred embodiments provide at least one aluminum alloy having from about 5% silicon to about 30% silicon, more preferably from about 11% to about 13% silicon, as an alloying element. Certain presently preferred embodiments provide an aluminum-silicon eutectic composition having about 12.5% silicon. Embodiments of the invention provide composite materials be “tuned” to more closely match thermal expansion characteristics of a number of semiconductor or integrated circuit materials such as, but not limited to, silicon, alumina, aluminum nitride, gallium nitride, and gallium arsenide while also providing high thermal conductivity.