Abstract: A docking station is provided with a thermoelectric module to generate cool air of a first temperature to be fed into a docked computer.

Abstract: A tablet air cooling dock. In one embodiment, the dock includes a cooling unit a tablet cradle to receive and support a tablet computer. The cradle includes a passageway to receive air from the cooling unit and to provide the air to a vent of the tablet computer. In one embodiment, the tablet cradle is pivotally mounted to provide multiple viewing positions of the tablet computer.

Abstract: An apparatus including a heat pipe having an evaporator portion and a condenser portion, the evaporator portion to be thermally coupled to a heat generating component; and an actuation membrane unit to generate air movement in a direction of the condenser portion of the heat pipe.

Abstract: A technique for increasing the thermal capability of a portable electronic device includes transferring dissipated heat from a heat source disposed within the portable electronic device to at least one heat exchanger via at least one respective thermal transfer device. This may be in addition to another heat exchanger connected to the heat source via another thermal transfer device. At least one external fan is disposed adjacent to the at least one heat exchanger and dissipated heat transferred from the heat source to the at least one heat exchanger is removed via a flow of air generated by the at least one external fan. This may be in addition to an internal fan disposed adjacent the another heat exchanger to dissipate heat transferred from the heat source to the anther heat exchanger via flow of air generated by the internal fan. The at least one thermal transfer device may be a heat pipe. The portable electronic device may be a notebook computer and the heat source disposed therein may be a processor.

Abstract: An apparatus including an actuation membrane unit to generate air movement in a direction of a heat generating device to reduce an ambient temperature of the device.

Abstract: A method and apparatus for cooling a portable computer system using a computer cooler with a cold plate that comes into contact with the portable computer system to transfer heat from the portable computer system to the environment surrounding the computer cooler.

Abstract: A system and a method for using parallel heat exchangers to disperse heat from a mobile computing system are disclosed. In one possible embodiment, multiple heat exchangers are thermally coupled to a thermal attach platform. Multiple remote heat exchangers may be thermally coupled to the thermal attach platform using a heat pipe for each remote heat exchanger or a single heat pipe for all the remote heat exchangers. In one embodiment, the thermal attach platform may be a copper block or a heat pipe chamber. An air circulation unit may be coupled adjacent to each remote heat exchanger. Direct attachment heat exchangers may be directly attached to the thermal attach platform. An air circulation unit, such as a fan, may be coupled adjacent to the direct attachment heat exchanger, either vertically or horizontally.

Abstract: An external heat exchanger to be attached external to a computer to force air into an internal chamber of the computer, to reduce an ambient temperature within the chamber of the computer.

Abstract: A docking station is provided with a thermoelectric module to generate cool air of a first temperature to be fed into a docked computer.

Abstract: A technique for increasing the thermal capability of a portable electronic device includes transferring dissipated heat from a heat source disposed within the portable electronic device to at least one heat exchanger via at least one respective thermal transfer device. This may be in addition to another heat exchanger connected to the heat source via another thermal transfer device. At least one external fan is disposed adjacent to the at least one heat exchanger and dissipated heat transferred from the heat source to the at least one heat exchanger is removed via a flow of air generated by the at least one external fan. This may be in addition to an internal fan disposed adjacent the another heat exchanger to dissipate heat transferred from the heat source to the anther heat exchanger via flow of air generated by the internal fan. The at least one thermal transfer device may be a heat pipe. The portable electronic device may be a notebook computer and the heat source disposed therein may be a processor.

Abstract: A method and apparatus for processing semiconductor substrates by reacting hydroxyl radicals with a precursor to cause the precursor to decompose and form a film which deposits on a substrate. Hydroxyl radicals, which are produced in a hydroxyl-ion producing apparatus outside of a chemical vapor deposition reactor, are mixed with a precursor to form a hydroxyl ions-precursor mixture. The hydroxyl ions-precursor mixture is introduced into the chemical vapor deposition reactor.

Abstract: A computer system is described having additional cooling capabilities in a docking station for a mobile computer. The docking station includes P- and N-doped semiconductor thermoelectric components. The thermoelectric components are connected in series when the mobile computer engages with the docking station. A current flowing through a doped semiconductor causes heat to be transferred either in a direction of a current through the semiconductor component or in a direction opposite to a current in the thermoelectric components, depending on their doping. The thermoelectric components alternate from being P-doped to N-doped and the direction in which current flows alternates accordingly so that heat is transferred in one direction only. A heat pumping effect is created by the thermoelectric components which does not require high-pressure contact upon engagement of the mobile computer with the docking station.

Abstract: A method for processing semiconductor substrates by reacting hydroxyl radicals with a precursor to cause the precursor to decompose and form a film which deposits on a substrate. Hydroxyl radicals, which are produced in a hydroxyl-ion producing apparatus outside of a chemical vapor deposition reactor, are mixed with a precursor to form a hydroxyl ions-precursor mixture. The hydroxyl ions-precursor mixture is introduced into the chemical vapor deposition reactor.

Abstract: A computer system is described having a refrigeration cycle for a logic processor each utilizes first and second refrigeration cycles, each including a respective adsorber/desorber. Each adsorber/desorber is alternatingly cooled and heated. A liquid is adsorbed into the adsorber/desorber when being cooled and desorbed when the adsorber/desorber is heated. When the liquid is desorbed from the adsorber/desorber, and a checkvalve is closed, a pressure of the liquid increases. The adsorber/desorber together with the checkvalve act as a compressor in the respective refrigeration cycle. Heating and cooling is alternated so that one adsorber/desorber always adsorbs liquid while the other adsorber/desorber desorbes liquid. Thermal swings of the logic processor are thereby avoided.

Abstract: A method and apparatus for cooling a portable computer system using a computer cooler with a cold plate that comes into contact with the portable computer system to transfer heat from the portable computer system to the environment surrounding the computer cooler.

Abstract: Method and apparatus for abating F2 from byproducts generated during cleaning of a processing chamber. F2 abatement is efficiently performed by directly injecting H2 in line with a foreline exiting the processing chamber. A tube which is highly resistant to oxidation and corrosive gases, even at high temperature, is connected in line with the foreline as part of the exhaust line of the processing chamber. A cooling jacket may be provided for cooling the tube, since the reaction between F2 and H2 is exothermic. A pressure monitoring arrangement may also be employed to insure that pressure within a hydrogen line, that feed the injection of H2 into the tube, does not exceed a predetermined pressure value.

Abstract: A heating chamber assembly for heating or maintaining the temperature of at least one wafer, employs thick film heater plates stacked at an appropriate distance to form a slot between each pair of adjacent heater plate surfaces. The heating chamber assembly may be employed adjacent one or more processing chambers to form a preheat station separate from the processing chambers, or may be incorporated in the load lock of one or more such processing chambers. The thick film heater plates are more efficient and have a better response time than conventional heat plates. A chamber surrounding the stack of heater plates is pressure sealable and nay include a purge gas inlet for supply purge gas thereto under pressure. A door to the chamber opens to allow wafers to be inserted or removed and forms a pressure seal upon closing. The slots in the stack are alignable with the door for loading and unloading of wafers.

Abstract: A technique for increasing the thermal capability of a portable electronic device includes transferring dissipated heat from a heat source disposed within the portable electronic device to at least one heat exchanger via at least one respective thermal transfer device. This may be in addition to another heat exchanger connected to the heat source via another thermal transfer device. At least one external fan is disposed adjacent to the at least one heat exchanger and dissipated heat transferred from the heat source to the at least one heat exchanger is removed via a flow of air generated by the at least one external fan. This may be in addition to an internal fan disposed adjacent the another heat exchanger to dissipate heat transferred from the heat source to the anther heat exchanger via flow of air generated by the internal fan. The at least one thermal transfer device may be a heat pipe. The portable electronic device may be a notebook computer and the heat source disposed therein may be a processor.

Abstract: A computer system is described having a refrigeration cycle for a logic processor each utilizes first and second refrigeration cycles, each including a respective adsorber/desorber. Each adsorber/desorber is alternatingly cooled and heated. A liquid is adsorbed into the adsorber/desorber when being cooled and desorbed when the adsorber/desorber is heated. When the liquid is desorbed from the adsorber/desorber, and a checkvalve is closed, a pressure of the liquid increases. The adsorber/desorber together with the checkvalve act as a compressor in the respective refrigeration cycle. Heating and cooling is alternated so that one adsorber/desorber always adsorbs liquid while the other adsorber/desorber desorbes liquid.

Abstract: A heating chamber assembly for heating or maintaining the temperature of at least one wafer, employs thick film heater plates stacked at an appropriate distance to form a slot between each pair of adjacent heater plate surfaces. The heating chamber assembly may be employed adjacent one or more processing chambers to form a preheat station separate from the processing chambers, or may be incorporated in the load lock of one or more such processing chambers. The thick film heater plates are more efficient and have a better response time than conventional heat plates. A chamber surrounding the stack of heater plates is pressure sealable and may include a purge gas inlet for supply purge gas thereto under pressure. A door to the chamber opens to allow wafers to be inserted or removed and forms a pressure seal upon closing. The slots in the stack are alignable with the door for loading and unloading of wafers.