Patents by Inventor Himanshu Pokharna

Himanshu Pokharna has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7494628
    Abstract: Method and apparatus for abating F2 from by-products generated during cleaning of a processing chamber. F2 abatement is efficiently performed by directly injecting H2 in line with a foreline exiting the processing chamber. A tube which is highly resistant to oxidation and corrosive gases, even at high temperature, is connected in line with the foreline as part of the exhaust line of the processing chamber. A cooling jacket may be provided for cooling the tube, since the reaction between F2 and H2 is exothermic. A pressure monitoring arrangement may also be employed to insure that pressure within a hydrogen line, that feeds the injection of H2 into the tube, does not exceed a predetermined pressure value.
    Type: Grant
    Filed: April 21, 2006
    Date of Patent: February 24, 2009
    Assignee: Applied Materials, Inc.
    Inventors: Himanshu Pokharna, Phong Le, Srinivas D. Nemani
  • Publication number: 20090002939
    Abstract: Systems and methods for controlling cooling fan speed based on ambient noise levels are disclosed. Some embodiments may include a method for controlling cooling fan speed. The method may include receiving an indication of a current ambient noise level at a computer system and predicting noise due to one or more cooling fans at an expected operator position for the computer system based on a first speed of the cooling fan(s). Embodiments of the method may also include comparing the predicted operation position noise due to the cooling fan(s) with the current ambient noise level and adjusting the cooling fan(s) to a second speed based on the comparison between the predicted operator position noise and the current ambient noise level. Other embodiments are disclosed and claimed.
    Type: Application
    Filed: June 29, 2007
    Publication date: January 1, 2009
    Inventors: Eric Baugh, Himanshu Pokharna, Rajiv Mongia, Rafael de la Guardia, Willem M. Beltman, Robert J. Brennan
  • Patent number: 7443670
    Abstract: According to some embodiments, systems for improved blower fans are provided. In some embodiments, systems may include a casing comprising an inlet to accept a fluid and an outlet to evacuate the fluid. The systems may further comprise an impeller disposed within the casing, comprising a hub and one or more impeller blades coupled to the hub. In some embodiments, the inlet of the casing may be shaped to reduce the amount of fluid that evacuates the casing via the inlet due to pressure within the casing.
    Type: Grant
    Filed: January 7, 2005
    Date of Patent: October 28, 2008
    Assignee: Intel Corporation
    Inventors: Yoshifumi Nishi, Masahiro Kuroda, Sridhar V. Machiroutu, Himanshu Pokharna, Karen Stafford
  • Publication number: 20080130221
    Abstract: A thermal hinge couples a computing platform to a lid. The thermal hinge includes a hinge block that has a groove passing through the hinge block and a hinge pillar to couple to the lid. The hinge pillar is inserted in a first end of the groove passing through the hinge block. The thermal hinge also includes a thermally conductive conduit inserted in a second end of the groove passing through the hinge block. The thermally conductive conduit couples with a heat spreader in the lid in order to transfer thermal energy from the hinge block to the heat spreader.
    Type: Application
    Filed: December 2, 2006
    Publication date: June 5, 2008
    Inventors: Krishnakumar Varadarajan, Rajiv Mongia, Himanshu Pokharna
  • Patent number: 7308931
    Abstract: A cooling apparatus may include an attach block manufactured using at least partially a graphite material. The attach block may be coupled to two heat pipes. The graphite material may be positioned in between the two heat pipes and in a direction that enables high heat conductivity and low thermal resistance.
    Type: Grant
    Filed: December 1, 2004
    Date of Patent: December 18, 2007
    Assignee: Intel Corporation
    Inventor: Himanshu Pokharna
  • Publication number: 20070284089
    Abstract: A method, apparatus and system are described for carbon nanotube wick structures. The system may include a frame and an apparatus. The apparatus may include a heat exchanger, a cold plate with a cold plate internal volume, and a heat pipe in the cold plate internal volume. In some embodiments, the heat pipe includes a thermally conductive wall material forming the inner dimensions of the heat pipe, a catalyst layer deposited onto the wall material, a carbon nanotube array formed on the catalyst layer, and a volume of working fluid. Other embodiments may be described.
    Type: Application
    Filed: May 31, 2006
    Publication date: December 13, 2007
    Inventors: Unnikrishnan Vadakkanmaruveedu, Gregory M. Chrysler, Ravi S. Prasher, Himanshu Pokharna
  • Patent number: 7300244
    Abstract: Apparatus, systems, and methods may operate to distribute acoustic spectral energy associated with a primary blade-passing frequency tonal component of fan noise and with harmonics thereof. The energy may be spectrally distributed by irregularly spacing a plurality of fan blades or stationary structures associated with the fan, or both. The stationary structures may be capable of being pressure-coupled to each one of the plurality of fan blades as each fan blade passes by each one of the stationary structures. Other embodiments are described and claimed.
    Type: Grant
    Filed: September 30, 2005
    Date of Patent: November 27, 2007
    Assignee: Intel Corporation
    Inventors: Eric Baugh, Marco Beltman, Himanshu Pokharna
  • Patent number: 7288895
    Abstract: A system to improve display efficiency based on recycling a local heat source. In one embodiment, the system includes a display and a lamp to illuminate the display. Heat from a heat generating component within the system in transferred to the lamp. In one embodiment, the lamp is a cold cathode fluorescent lamp (CCFL). The heat can be transferred to the lamp via conduction or convection.
    Type: Grant
    Filed: November 17, 2003
    Date of Patent: October 30, 2007
    Assignee: Intel Corporation
    Inventors: Thomas M. Rossi, Himanshu Pokharna
  • Patent number: 7283360
    Abstract: An evaporator having an enhanced flow channel design for use in a computer system is described. Specifically, micro-channels of the evaporator comprise nucleation sites and different channel widths. The enhanced flow channel design improves heat transfer from a computer component to a working fluid.
    Type: Grant
    Filed: September 6, 2006
    Date of Patent: October 16, 2007
    Assignee: Intel Corporation
    Inventors: Je-Young Chang, Himanshu Pokharna
  • Publication number: 20070227707
    Abstract: A method, apparatus and system are described for providing for optimized heat exchanger fin spacing. The system may include a chassis and an apparatus. The apparatus may include a heat exchanger, and a cold plate. In some embodiments, a pump may provide for the flow of the fluid between the heat exchanger and the cold plate. In some embodiments, the heat exchanger may include a tube to transport a cooling fluid, and a plurality of fins coupled to the tube and having a spacing that facilitates optimizing the airflow from a blower; and a cold plate coupled to the tube and coupled to an electronic component from which thermal energy is transferred. Other embodiments may be described.
    Type: Application
    Filed: March 31, 2006
    Publication date: October 4, 2007
    Inventors: Sridhar Machiroutu, Himanshu Pokharna, Rajiv Mongia, Eric Baugh
  • Publication number: 20070217147
    Abstract: A microchannel structure has microchannels formed therein. The microchannels are to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. At least one of the microchannels has a length extent and has a first section at a first location along the length extent and a second section at a second location along the length extent. The first section of the microchannel has a first aspect ratio and the second section is divided into at least two sub-channels. Each sub-channel has a respective second aspect ratio that is greater than the first aspect ratio.
    Type: Application
    Filed: May 16, 2007
    Publication date: September 20, 2007
    Inventors: Je-Young Chang, Ioan Sauciuc, Chuan Hu, Chia-Pin Chiu, Gregory Chrysler, Ravi Prasher, Rajiv Mongia, Himanshu Pokharna, Eric DiStefano
  • Patent number: 7272006
    Abstract: An apparatus includes a microchannel structure that has microchannels formed therein. The microchannels are for transporting a coolant and are intended to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. The apparatus further includes a cover positioned on the microchannel structure. The cover has formed therein a right-angle passage to provide fluid communication between a first port on a lower horizontal surface of the cover and a second port on a vertical surface of the cover. The cover includes a plurality of tabs. Each tab extends from a respective corner of the cover. The tabs each have an aperture formed therein. The apertures are shaped and sized to receive a fastener.
    Type: Grant
    Filed: September 30, 2005
    Date of Patent: September 18, 2007
    Assignee: Intel Corporation
    Inventors: Rajiv K. Mongia, Himanshu Pokharna, Eric DiStefano, Shawn S. McEuen, Brian A. Wilk
  • Patent number: 7269005
    Abstract: A notebook computer system that utilizes both natural convection and forced convection cooling methods is described. Specifically, at low power levels, the forced convection components are disabled to conserve energy and to reduce noise.
    Type: Grant
    Filed: November 21, 2003
    Date of Patent: September 11, 2007
    Assignee: Intel Corporation
    Inventors: Himanshu Pokharna, Eric DiStefano
  • Patent number: 7259965
    Abstract: A microchannel structure has microchannels formed therein. The microchannels are to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. At least one of the microchannels has a length extent and has a first section at a first location along the length extent and a second section at a second location along the length extent. The first section of the microchannel has a first aspect ratio and the second section is divided into at least two sub-channels. Each sub-channel has a respective second aspect ratio that is greater than the first aspect ratio.
    Type: Grant
    Filed: April 7, 2005
    Date of Patent: August 21, 2007
    Assignee: Intel Corporation
    Inventors: Je-Young Chang, Ioan Sauciuc, Chuan Hu, Chia-Pin Chiu, Gregory M. Chrysler, Ravi S. Prasher, Rajiv K. Mongia, Himanshu Pokharna, Eric DiStefano
  • Publication number: 20070177349
    Abstract: A fluid mover includes a rotor to transfer momentum with a fluid when operated at a given volumetric flow rate through the rotor. The rotor includes a plurality of enclosed passages to transfer momentum in or out of the fluid as the fluid passes through the enclosed passages in response to rotation of the rotor. The passages are formed with a cross sectional shape and cross sectional dimensions along their entire length sufficient to establish and maintain laminar flow of the fluid along the entire length of the enclosed passages when the fluid is passing through the rotor at the given volumetric flow rate. The fluid mover also includes a housing having at least one inlet and at least one outlet for the fluid.
    Type: Application
    Filed: November 22, 2006
    Publication date: August 2, 2007
    Inventors: Himanshu Pokharna, Eric Baugh, Eric DiStefano, Jason Ku, Rajiv Mongia, Yoshifumi Nishi, Theodore Hill, Charles Hill
  • Publication number: 20070146993
    Abstract: Some embodiments of a method, apparatus and computer system are described for enhancing the transfer of heat from electronic components. The computer system includes a housing and an apparatus. The apparatus includes a heat transfer enhancement module internally coupled to an electronic device and positioned with respect to an electronic component, wherein the heat transfer enhancement module includes an air mover to enhance heat transfer of the electronic component, and wherein the apparatus enhances cooling of a primary heat exchanger. In embodiments, the air mover is a blower fan, a piezoelectric fan, and/or a membrane fan. The apparatus provides enhanced heat transfer for the system. Other embodiments are described.
    Type: Application
    Filed: December 23, 2005
    Publication date: June 28, 2007
    Inventors: Rajiv Mongia, Himanshu Pokharna, Sridhar Machiroutu
  • Patent number: 7203064
    Abstract: A device may include an integrated circuit chip and channels to carry a coolant. The channels may be proximate to an upper surface of the integrated circuit chip, and the channels may extend along a length of the integrated circuit chip. A density of the channels may change across the length of the integrated circuit chip.
    Type: Grant
    Filed: December 12, 2003
    Date of Patent: April 10, 2007
    Assignee: Intel Corporation
    Inventors: Rajiv K. Mongia, Himanshu Pokharna
  • Publication number: 20070076374
    Abstract: An apparatus includes a microchannel structure that has microchannels formed therein. The microchannels are for transporting a coolant and are intended to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. The apparatus further includes a cover positioned on the microchannel structure. The cover has formed therein a right-angle passage to provide fluid communication between a first port on a lower horizontal surface of the cover and a second port on a vertical surface of the cover. The cover includes a plurality of tabs. Each tab extends from a respective corner of the cover. The tabs each have an aperture formed therein. The apertures are shaped and sized to receive a fastener.
    Type: Application
    Filed: September 30, 2005
    Publication date: April 5, 2007
    Inventors: Rajiv Mongia, Himanshu Pokharna, Eric DiStefano, Shawn McEuen, Brian Wilk
  • Publication number: 20070077139
    Abstract: Apparatus, systems, and methods may operate to distribute acoustic spectral energy associated with a primary blade-passing frequency tonal component of fan noise and with harmonics thereof. The energy may be spectrally distributed by irregularly spacing a plurality of fan blades or stationary structures associated with the fan, or both. The stationary structures may be capable of being pressure-coupled to each one of the plurality of fan blades as each fan blade passes by each one of the stationary structures. Other embodiments are described and claimed.
    Type: Application
    Filed: September 30, 2005
    Publication date: April 5, 2007
    Inventors: Eric Baugh, Marco Beltman, Himanshu Pokharna
  • Publication number: 20070076376
    Abstract: A method, apparatus and computer system are described for providing for the transfer of heat from electronic components. The computer system includes a frame and an apparatus. The apparatus includes a chassis component with a heat pipe, a heat exchanger, a conduit of tubing, a cold plate, and a pump to provide for the flow of the fluid between the heat exchanger and the cold plate. The heat pipe is thermally coupled between the cold plate and the heat exchanger to provide for the transfer of thermal energy from the cold plate to the heat exchanger independently of the conduit of tubing. The heat pipe may transfer a substantial amount of the thermal energy from the cold plate to the heat exchanger. The heat pipe may operate passively and provide cooling in an ambient manner.
    Type: Application
    Filed: September 30, 2005
    Publication date: April 5, 2007
    Inventors: Rajiv Mongia, Himanshu Pokharna, Eric DiStefano