Abstract: A system and a method for using parallel heat exchangers to disperse heat from a mobile computing system are disclosed. In one possible embodiment, multiple heat exchangers are thermally coupled to a thermal attach platform. Multiple remote heat exchangers may be thermally coupled to the thermal attach platform using a heat pipe for each remote heat exchanger or a single heat pipe for all the remote heat exchangers. In one embodiment, the thermal attach platform may be a copper block or a heat pipe chamber. An air circulation unit may be coupled adjacent to each remote heat exchanger. Direct attachment heat exchangers may be directly attached to the thermal attach platform. An air circulation unit, such as a fan, may be coupled adjacent to the direct attachment heat exchanger, either vertically or horizontally.

Abstract: Cooling techniques to cool electronic devices in a computer system are disclosed. For one embodiment, the cooling technique utilizes a combination of an active cooling component with a passive cooling component. The active cooling component includes a heat exchanger, a pipe loop, and a pump. A liquid coolant is to extract heat from an electronic device and be transported by the pipe loop to the heat exchanger where the heat is rejected. The flow of the liquid coolant between the electronic device and the heat exchanger is enhanced by the pump. The passive cooling component includes a heat pipe. An evaporation end of the heat pipe is coupled to the electronic device to extract heat from the electronic device. A condensation end of the heat pipe is coupled to the heat exchanger to condense vapor in the heat pipe.

Abstract: An apparatus for using fluid laden with nanoparticles for application in electronic cooling is described. In one embodiment, an electromagnetic pump is used to circulate the nanoparticle laden fluid.

Abstract: Folded fin microchannel heat exchangers for cooling integrated circuit (IC) dies and packages and cooling systems employing the same are disclosed. The heat exchangers include a folded fin enclosed within the heat exchanger thereby defining a plurality of microchannels. In one embodiment, a folded fin microchannel heat exchanger is operatively coupled to an IC die or IC package using fasteners and is thermally coupled to the IC die or an IC package using a thermal interface material. In other embodiments, a folded fin microchannel heat exchanger is operatively and thermally coupled to an IC die or an IC package using a thermal epoxy or a solderable material. The folded fin microchannel heat exchangers may be employed in a closed loop cooling system includes a pump and a heat rejecter. The folded fin microchannels are configured to support either a two-phase or a single-phase heat transfer process using a working fluid such as water.

Abstract: A device may include an integrated circuit chip and channels to carry a coolant. The channels may be proximate to an upper surface of the integrated circuit chip, and the channels may extend along a length of the integrated circuit chip. A density of the channels may change across the length of the integrated circuit chip.

Abstract: A device may include a boiling structure and a wick structure adjacent the boiling structure. The boiling structure may convert a coolant from liquid to vapor and may have a first thermal resistance. The wick structure may bring the coolant to the boiling structure and may have a second thermal resistance that is higher than the first thermal resistance of the boiling structure.

Abstract: According to one embodiment of the present invention, a cooling apparatus for notebook computer systems is disclosed. The apparatus includes: an evaporator coupled to a heat generating device to extract the generated heat away from the device, the device being installed inside a notebook computer, a heat exchanger coupled to the evaporator; a transport medium to flow inside the evaporator and the heat exchanger to transfer the generated heat from the device to the heat exchanger; and a pump attached to the evaporator and the heat exchanger to force the transport medium between the evaporator and the heat exchanger.

Abstract: An evaporator having an enhanced flow channel design for use in a computer system is described. Specifically, micro-channels of the evaporator comprise nucleation sites and different channel widths. The enhanced flow channel design improves heat transfer from a computer component to a working fluid.

Abstract: A system and a method for using parallel heat exchangers to disperse heat from a mobile computing system are disclosed. In one possible embodiment, multiple heat exchangers are thermally coupled to a thermal attach platform. Multiple remote heat exchangers may be thermally coupled to the thermal attach platform using a heat pipe for each remote heat exchanger or a single heat pipe for all the remote heat exchangers. In one embodiment, the thermal attach platform may be a copper block or a heat pipe chamber. An air circulation unit may be coupled adjacent to each remote heat exchanger. Direct attachment heat exchangers may be directly attached to the thermal attach platform. An air circulation unit, such as a fan, may be coupled adjacent to the direct attachment heat exchanger, either vertically or horizontally.

Abstract: A notebook computer system that utilizes both natural convection and forced convection cooling methods is described. Specifically, at low power levels, the forced convection components are disabled to conserve energy and to reduce noise.

Abstract: According to some embodiments, an enhanced heat exchanger may be used to dissipate heat.

Abstract: A system to improve display efficiency based on recycling a local heat source. In one embodiment, the system includes a display and a lamp to illuminate the display. Heat from a heat generating component within the system in transferred to the lamp. In one embodiment, the lamp is a cold cathode flourescent lamp (CCFL). The heat can be transferred to the lamp via conduction or convection.

Abstract: Apparatus and method are provided to enable cooling electronic components in computer systems using liquid metal as a coolant. The liquid metal coolant extracts heat generated by an electronic component and flows to a heat exchanger where the heat is rejected into ambient air through force convection. A pump is used to enable the liquid metal coolant to circulate in a closed loop system.

Abstract: According to one embodiment of the present invention, a cooling apparatus for notebook computer systems is disclosed. The apparatus includes: an evaporator coupled to a heat generating device to extract the generated heat away from the device, the device being installed inside a notebook computer; a heat exchanger coupled to the evaporator; a transport medium to flow inside the evaporator and the heat exchanger to transfer the generated heat from the device to the heat exchanger; and a pump attached to the evaporator and the heat exchanger to force the transport medium between the evaporator and the heat exchanger.

Abstract: A fuel cell and a platform associated with the fuel cell include a common fluid cooling system.

Abstract: A first cooling system pre-heats a fuel for a fuel cell, and a second cooling system cools a heat generating device using a fluid medium.

Abstract: A reversible cooling loop for a notebook computer is described. Specifically, at low power levels, a two-phase fluid cooling loop is implemented to conserve the battery life. At high power levels, a refrigeration loop is implemented.

Abstract: An apparatus including an actuation membrane unit to generate air movement in a direction of a heat generating device to reduce an ambient temperature of the device.

Abstract: A docking station is provided with apertures that line up with apertures in a notebook. When the notebook is docked on the docking station, air is forced out of the notebook through the openings of the docking station and the notebook.

Abstract: A tablet air cooling dock. In one embodiment, the dock includes a cooling unit a tablet cradle to receive and support a tablet computer. The cradle includes a passageway to receive air from the cooling unit and to provide the air to a vent of the tablet computer. In one embodiment, the tablet cradle is pivotally mounted to provide multiple viewing positions of the tablet computer.