Patents by Inventor Himanshu Pokharna

Himanshu Pokharna has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7193316
    Abstract: According to some embodiments, a microchannel is provided to transport a coolant. The microchannel may be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. Moreover, a movable portion may be provided to adjust a volume of a space associated with the microchannel (e.g., when the coolant freezes).
    Type: Grant
    Filed: December 16, 2004
    Date of Patent: March 20, 2007
    Assignee: Intel Corporation
    Inventors: Rajiv K. Mongia, Himanshu Pokharna, Eric DiStefano
  • Publication number: 20070002541
    Abstract: An evaporator having an enhanced flow channel design for use in a computer system is described. Specifically, micro-channels of the evaporator comprise nucleation sites and different channel widths. The enhanced flow channel design improves heat transfer from a computer component to a working fluid.
    Type: Application
    Filed: September 6, 2006
    Publication date: January 4, 2007
    Inventors: Je-Young Chang, Himanshu Pokharna
  • Patent number: 7123479
    Abstract: An evaporator having an enhanced flow channel design for use in a computer system is described. Specifically, micro-channels of the evaporator comprise nucleation sites and different channel widths. The enhanced flow channel design improves heat transfer from a computer component to a working fluid.
    Type: Grant
    Filed: December 8, 2003
    Date of Patent: October 17, 2006
    Assignee: Intel Corporation
    Inventors: Je-Young Chang, Himanshu Pokharna
  • Patent number: 7104313
    Abstract: An apparatus for using fluid laden with nanoparticles for application in electronic cooling is described. In one embodiment, an electromagnetic pump is used to circulate the nanoparticle laden fluid.
    Type: Grant
    Filed: December 31, 2003
    Date of Patent: September 12, 2006
    Assignee: Intel Corporation
    Inventors: Himanshu Pokharna, Rajiv K. Mongia, Ravi S. Prasher, Sridhar V. Machiroutu, Je-Young Chang, John W. Horigan
  • Publication number: 20060198769
    Abstract: Method and apparatus for abating F2 from by-products generated during cleaning of a processing chamber. F2 abatement is efficiently performed by directly injecting H2 in line with a foreline exiting the processing chamber. A tube which is highly resistant to oxidation and corrosive gases, even at high temperature, is connected in line with the foreline as part of the exhaust line of the processing chamber. A cooling jacket may be provided for cooling the tube, since the reaction between F2 and H2 is exothermic. A pressure monitoring arrangement may also be employed to insure that pressure within a hydrogen line, that feeds the injection of H2 into the tube, does not exceed a predetermined pressure value.
    Type: Application
    Filed: April 21, 2006
    Publication date: September 7, 2006
    Applicant: Applied Materials, Inc.
    Inventors: Himanshu Pokharna, Phong Le, Srinivas Nemani
  • Publication number: 20060152900
    Abstract: According to some embodiments, systems for improved blower fans are provided. In some embodiments, systems may include a casing comprising an inlet to accept a fluid and an outlet to evacuate the fluid. The systems may further comprise an impeller disposed within the casing, comprising a hub and one or more impeller blades coupled to the hub. In some embodiments, the inlet of the casing may be shaped to reduce the amount of fluid that evacuates the casing via the inlet due to pressure within the casing.
    Type: Application
    Filed: January 7, 2005
    Publication date: July 13, 2006
    Inventors: Yoshifumi Nishi, Masahiro Kuroda, Sridhar Machiroutu, Himanshu Pokharna, Karen Stafford
  • Publication number: 20060131733
    Abstract: According to some embodiments, a microchannel is provided to transport a coolant. The microchannel may be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. Moreover, a movable portion may be provided to adjust a volume of a space associated with the microchannel (e.g., when the coolant freezes).
    Type: Application
    Filed: December 16, 2004
    Publication date: June 22, 2006
    Inventors: Rajiv Mongia, Himanshu Pokharna, Eric DiStefano
  • Patent number: 7060234
    Abstract: Method and apparatus for abating F2 from byproducts generated during cleaning of a processing chamber. F2 abatement is efficiently performed by directly injecting H2 in line with a foreline exiting the processing chamber. A tube which is highly resistant to oxidation and corrosive gases, even at high temperature, is connected in line with the foreline as part of the exhaust line of the processing chamber. A cooling jacket may be provided for cooling the tube, since the reaction between F2 and H2 is exothermic. A pressure monitoring arrangement may also be employed to insure that pressure within a hydrogen line, that feeds the injection of H2 into the tube, does not exceed a predetermined pressure value.
    Type: Grant
    Filed: July 18, 2001
    Date of Patent: June 13, 2006
    Assignee: Applied Materials
    Inventors: Himanshu Pokharna, Phong Le, Srinivas D. Nemani
  • Publication number: 20060113066
    Abstract: A cooling system using counter-flow air and fins with thermal isolation sections is disclosed. The cooling system includes a pump and a liquid coolant. Counter-flow air is applied in a direction generally opposite to a direction of the liquid coolant. The thermally isolation fins help reducing conduction of heat.
    Type: Application
    Filed: December 1, 2004
    Publication date: June 1, 2006
    Inventors: Rajiv Mongia, Himanshu Pokharna, Eric Distefano
  • Publication number: 20060113064
    Abstract: According to one embodiment, a cooling apparatus includes an attach block that is manufactured using at least partially a graphite material. The attach block is coupled to two heat pipes. The graphite material is positioned in between the two heat pipes and in a direction that enables high heat conductivity and low thermal resistance.
    Type: Application
    Filed: December 1, 2004
    Publication date: June 1, 2006
    Inventor: Himanshu Pokharna
  • Patent number: 7048038
    Abstract: A technique for increasing the thermal capability of a portable electronic device includes transferring dissipated heat from a heat source disposed within the portable electronic device to at least one heat exchanger via at least one respective thermal transfer device. This may be in addition to another heat exchanger connected to the heat source via another thermal transfer device. At least one external fan is disposed adjacent to the at least one heat exchanger and dissipated heat transferred from the heat source to the at least one heat exchanger is removed via a flow of air generated by the at least one external fan. This may be in addition to an internal fan disposed adjacent the another heat exchanger to dissipate heat transferred from the heat source to the anther heat exchanger via flow of air generated by the internal fan. The at least one thermal transfer device may be a heat pipe. The portable electronic device may be a notebook computer and the heat source disposed therein may be a processor.
    Type: Grant
    Filed: January 6, 2004
    Date of Patent: May 23, 2006
    Assignee: Intel Corporation
    Inventors: Himanshu Pokharna, Eric Distefano
  • Patent number: 7031159
    Abstract: A system and a method for using parallel heat exchangers to disperse heat from a mobile computing system are disclosed. In one possible embodiment, multiple heat exchangers are thermally coupled to a thermal attach platform. Multiple remote heat exchangers may be thermally coupled to the thermal attach platform using a heat pipe for each remote heat exchanger or a single heat pipe for all the remote heat exchangers. In one embodiment, the thermal attach platform may be a copper block or a heat pipe chamber. An air circulation unit may be coupled adjacent to each remote heat exchanger. Direct attachment heat exchangers may be directly attached to the thermal attach platform. An air circulation unit, such as a fan, may be coupled adjacent to the direct attachment heat exchanger, either vertically or horizontally.
    Type: Grant
    Filed: March 1, 2005
    Date of Patent: April 18, 2006
    Assignee: Intel Corporation
    Inventors: Eric DiStefano, Ravi S. Prasher, Himanshu Pokharna
  • Patent number: 7023697
    Abstract: An apparatus including an actuation membrane unit to generate air movement in a direction of a heat generating device to reduce an ambient temperature of the device.
    Type: Grant
    Filed: March 5, 2004
    Date of Patent: April 4, 2006
    Assignee: Intel Corporation
    Inventors: Himanshu Pokharna, Eric DiStefano
  • Publication number: 20050284166
    Abstract: An apparatus to use a compressor in a mobile computing device to increase a temperature of a working fluid used to absorb heat generated by a heat generating unit of the mobile computer. In one embodiment, the apparatus includes a working fluid loop with the fluid of the loop being in thermal contact with the heat generating device, and the fluid is to pass through a heat exchanger to dissipate heat from the fluid.
    Type: Application
    Filed: June 23, 2004
    Publication date: December 29, 2005
    Inventors: Rajiv Mongia, Himanshu Pokharna, Eric DiStefano
  • Publication number: 20050285261
    Abstract: An apparatus, method, and system for a thermal management arrangement for cooling semiconductor packages with channels structurally adapted for varying heat flux areas.
    Type: Application
    Filed: June 25, 2004
    Publication date: December 29, 2005
    Inventors: Ravi Prasher, Chia-Pin Chiu, Himanshu Pokharna
  • Patent number: 6958912
    Abstract: According to some embodiments, an enhanced heat exchanger may be provided. The enhanced heat exchanger may comprise, for example, a heat transfer portion to receive heat from a heat source and to transfer heat from the heat source, and a remote heat sink adjacent to the heat transfer portion to remove heat from the heat transfer portion. In some embodiments, the remote heat sink may comprise a solid metal portion that extends away from the heat transfer portion, and a porous medium coupled to the solid metal portion. According to some embodiments, the porous medium may extend away from the solid metal portion such that a thermal boundary layer exists in substantially the entire porous medium.
    Type: Grant
    Filed: November 18, 2003
    Date of Patent: October 25, 2005
    Assignee: Intel Corporation
    Inventors: Himanshu Pokharna, Anandaroop Bhattacharya
  • Publication number: 20050217278
    Abstract: An apparatus to use a refrigerator in a mobile computing device is described. In one embodiment, the refrigerator includes a cold reservoir to absorb heat generated by a heat generating unit of the mobile device. A heat exchanger is used to dissipate heat of a hot reservoir of the refrigerator. In an alternative embodiment, the apparatus includes a working fluid loop, with a fluid of the loop to be in thermal contact with the heat generating device, and the cold reservoir of the refrigerator to absorb heat from the fluid.
    Type: Application
    Filed: September 30, 2004
    Publication date: October 6, 2005
    Inventors: Rajiv Mongia, Himanshu Pokharna, Eric DiStefano
  • Publication number: 20050219819
    Abstract: A thermal management system of a notebook computer that has an improved heat exchanger is described. Specifically, the heat exchanger may comprise a heat exchanger tube insert, a plurality of internal fins in the heat exchanger tube, or a flattened heat exchanger tube.
    Type: Application
    Filed: March 31, 2004
    Publication date: October 6, 2005
    Inventors: Himanshu Pokharna, Eric DiStefano, Rajiv Mongia
  • Publication number: 20050217827
    Abstract: An apparatus to use a refrigerator in a mobile computing device is described. In one embodiment, the refrigerator includes a cold reservoir to absorb heat generated by a heat generating unit of the mobile device. A heat exchanger is used to dissipate heat of a hot reservoir of the refrigerator. In an alternative embodiment, the apparatus includes a working fluid loop, with a fluid of the loop to be in thermal contact with the heat generating device, and the cold reservoir of the refrigerator to absorb heat from the fluid.
    Type: Application
    Filed: March 31, 2004
    Publication date: October 6, 2005
    Inventors: Himanshu Pokharna, Rajiv Mongia, Eric DiStefano
  • Publication number: 20050217279
    Abstract: An apparatus to use a refrigerator in a mobile computing device is described. In one embodiment, the refrigerator is a thermoacoustic based refrigerator. In one embodiment, the refrigerator is a Stirling based refrigerator.
    Type: Application
    Filed: September 30, 2004
    Publication date: October 6, 2005
    Inventors: Rajiv Mongia, Himanshu Pokharna, Eric DiStefano