Abstract: Provided is a semiconductor integrated circuit device including a first N-channel type high withstanding-voltage MOS transistor and a second N-channel type high withstanding-voltage MOS transistor formed on an N-type semiconductor substrate, the first N-channel type high withstanding-voltage transistor including a third N-type low-concentration impurity region containing arsenic having a depth smaller than a P-type well region in a drain region within the P-type well region, and the second N-channel type high withstanding-voltage MOS transistor including a fourth N-type low-concentration impurity region that is adjacent to the P-type well region and has a bottom surface being in contact with the N-type semiconductor substrate. In this manner, the high withstanding-voltage NMOS transistors capable of operating at 30 V or higher are integrated on the N-type semiconductor substrate.

Abstract: A semiconductor integrated circuit device has a first N-channel type high withstanding-voltage MOS transistor and a second N-channel type high withstanding-voltage MOS transistor formed on an N-type semiconductor substrate. The first N-channel type high withstanding-voltage transistor includes a third N-type low-concentration impurity region containing arsenic having a depth smaller than a P-type well region in a drain region within the P-type well region, and the second N-channel type high withstanding-voltage MOS transistor includes a fourth N-type low-concentration impurity region that is adjacent to the P-type well region and has a bottom surface in contact with the N-type semiconductor substrate. In this manner, the high withstanding-voltage NMOS transistors are capable of operating at 30 V or higher and are integrated on the N-type semiconductor substrate.

Abstract: A semiconductor nonvolatile memory element is used to form a constant current source in a semiconductor integrated circuit device. The semiconductor nonvolatile memory element includes a control gate electrode, a floating gate electrode, source/drain terminals, a thin first gate insulating film, and a second gate insulating film that is thick enough not to be broken down even when a voltage higher than an operating voltage of the semiconductor integrated circuit device is applied thereto, the first and second gate insulating films being formed below the control gate electrode. Thus, provided is a normally on type semiconductor nonvolatile memory element in which a threshold voltage can be regulated through injection of a large amount of charge with respect to the operating voltage from a drain terminal into the floating gate electrode via the second gate insulating film, and injected carriers do not leak in an operating voltage range.

Abstract: A semiconductor nonvolatile memory element is used to form a constant current source in a semiconductor integrated circuit device. The semiconductor nonvolatile memory element includes a control gate electrode, a floating gate electrode, source/drain terminals, a thin first gate insulating film, and a second gate insulating film that is thick enough not to be broken down even when a voltage higher than an operating voltage of the semiconductor integrated circuit device is applied thereto, the first and second gate insulating films being formed below the control gate electrode. Thus, provided is a normally on type semiconductor nonvolatile memory element in which a threshold voltage can be regulated through injection of a large amount of charge with respect to the operating voltage from a drain terminal into the floating gate electrode via the second gate insulating film, and injected carriers do not leak in an operating voltage range.

Abstract: Provided is a constant voltage circuit having a stable output voltage. In a constant voltage circuit formed by connecting an enhancement type NMOS and a depression type NMOS in series, in order to enhance the back bias effect of the depression type NMOS, the impurity concentration is set to be high only in a P-type well region on which the depression type NMOS is arranged.

Abstract: A semiconductor device includes an insulated gate field effect transistor and a resistance circuit having a resistance element. The resistance element has a first thin film arranged on an isolation oxide film provided on a surface of a semiconductor substrate, a second thin film of silicon nitride formed on the first thin film so as to be wider than the resistance element, an intermediate insulating film of silicon oxide formed on the second thin film, a contact hole passing through the second thin film and provided in the intermediate insulating film at a depth reaching the first thin film, and a metal wiring formed in the contact hole. The insulated gate field effect transistor is provided in a region of the semiconductor substrate surrounded by the isolation oxide film.

Abstract: A semiconductor integrated circuit device capable of stably forming a fuse element that is used to adjust the characteristics of the semiconductor integrated circuit device, and a method of manufacturing the semiconductor integrated circuit device are provided. The thickness of an interlayer insulating film above the fuse element is reduced by using an amorphous silicon layer that is formed by sputtering as a material of the fuse element, and by forming the amorphous silicon layer at the same time as metal wiring is formed. The steady ease of laser trimming processing is thus accomplished in the semiconductor integrated circuit device and the method of manufacturing the semiconductor integrated circuit device.

Abstract: A semiconductor resistor circuit has resistor elements of a polycrystalline silicon thin film formed on an insulating film deposited on a semiconductor substrate. A high stress insulating film is formed on and covers the resistor elements and the insulating film exposed between the resistor elements. Metal wirings cover upper portions of the resistor elements. The high stress insulating film has a membrane stress that is higher than that of the metal wirings.

Abstract: Provided is a semiconductor integrated circuit device including a first N-channel type high withstanding-voltage MOS transistor and a second N-channel type high withstanding-voltage MOS transistor formed on an N-type semiconductor substrate, the first N-channel type high withstanding-voltage transistor including a third N-type low-concentration impurity region containing arsenic having a depth smaller than a P-type well region in a drain region within the P-type well region, and the second N-channel type high withstanding-voltage MOS transistor including a fourth N-type low-concentration impurity region that is adjacent to the P-type well region and has a bottom surface being in contact with the N-type semiconductor substrate. In this manner, the high withstanding-voltage NMOS transistors capable of operating at 30 V or higher are integrated on the N-type semiconductor substrate.

Abstract: A semiconductor nonvolatile memory element is used to form a constant current source in a semiconductor integrated circuit device. The semiconductor nonvolatile memory element includes a control gate electrode, a floating gate electrode, source/drain terminals, a thin first gate insulating film, and a second gate insulating film that is thick enough not to be broken down even when a voltage higher than an operating voltage of the semiconductor integrated circuit device is applied thereto, the first and second gate insulating films being formed below the control gate electrode. Thus, provided is a normally on type semiconductor nonvolatile memory element in which a threshold voltage can be regulated through injection of a large amount of charge with respect to the operating voltage from a drain terminal into the floating gate electrode via the second gate insulating film, and injected carriers do not leak in an operating voltage range.

Abstract: Provided is a semiconductor integrated circuit device including a memory element to which a voltage and a current is input via a regulating input terminal to be able to change a threshold voltage thereof. The semiconductor integrated circuit device can change an output voltage depending on the threshold voltage. Also provided is a method of regulating an output voltage of the semiconductor integrated circuit device, including changing an input voltage to the regulating input terminal to change the output voltage, thereby setting an arbitrary output voltage.

Abstract: An ESD protection circuit having a smaller area is provided. The ESD protection circuit includes: a P-type diffusion resistor 12 whose one end is connected to an input terminal 11 formed in the N-type well; a diode 14 disposed between the diffusion resistor 12 and the N-type well connected to the power supply terminal; an NMOS transistor 15 whose drain is connected to the other end of the diffusion resistor 12; and a parasitic diode formed between the power supply terminal and the ground terminal.

Abstract: A merchandise sales data processing device includes a specification unit, a detection unit, a calculation unit, and a processing unit. The specification unit specifies merchandise. The detection unit detects information related to an ingredient which is contained in specified merchandise. The calculation unit calculates a tax amount which is imposed on merchandise based on the detected ingredient information. The processing unit processes sales data of merchandise using the calculated tax amount.

Abstract: Provided is a semiconductor integrated circuit device having flexible pin arrangement. A semiconductor integrated circuit is bonded to a die pad with an insulating paste, and the potential of the die pad is fixed through a bonding wire from an Al pad provided on the surface of the semiconductor integrated circuit. In the case of a P-type semiconductor substrate, the die pad is set as a terminal other than a terminal having a minimum operating potential of the semiconductor integrated circuit.

Abstract: A semiconductor device includes a resistance circuit and an insulated gate field effect transistor. The resistance circuit includes a resistance element having a first thin film arranged on an isolation oxide film provided on a surface of a semiconductor substrate, a second thin film of silicon nitride formed on the first thin film so as to be wider than the resistance element, an intermediate insulating film formed on the second thin film, a contact hole passing through the second thin film and being provided in the intermediate insulating film at a depth reaching the first thin film, and a metal wiring formed in the contact hole. The insulated gate field effect transistor is provided in a region of the semiconductor substrate surrounded by the isolation oxide film.

Abstract: Provided is a semiconductor resistor circuit with high accuracy. An insulating film is formed to cover a plurality of resistor groups having upper portions covered with a plurality of metal wirings. The insulating film has a membrane stress that is higher than that of the metal wirings, and is formed between the metal wirings and the resistor groups.

Abstract: A reference voltage generating circuit has more than two first wells each having a first impurity concentration and more than two second wells each having a second impurity concentration different from the first impurity concentration. A first group of MOS transistors has more than two MOS transistors formed in respective ones of the first wells. A second group of MOS transistors has More than two MOS transistors formed in respective ones of the second wells.

Abstract: A depletion type MOS transistor includes a well region having a first conductivity type and formed on a semiconductor substrate, a gate insulating film formed on the well region, and a gate electrode formed on the gate insulating film. Source and drain regions having a second conductivity type different from the first conductivity type are formed on respective sides of the gate electrode and within the well region. A first low concentration impurity region has the second conductivity type and is formed below the gate insulating film between the source and drain regions and within the well region. A second low concentration impurity region has the first conductivity type and is formed below the first low concentration impurity region between the source and drain regions and within the well region.

Abstract: An ESD protection circuit having a smaller area is provided. The ESD protection circuit includes: a P-type diffusion resistor 12 whose one end is connected to an input terminal 11 formed in the N-type well; a diode 14 disposed between the diffusion resistor 12 and the N-type well connected to the power supply terminal; an NMOS transistor 15 whose drain is connected to the other end of the diffusion resistor 12; and a parasitic diode formed between the power supply terminal and the ground terminal.

Abstract: Provided is a constant voltage circuit having a stable output voltage. In a constant voltage circuit formed by connecting an enhancement type NMOS and a depression type NMOS in series, in order to enhance the back bias effect of the depression type NMOS, the impurity concentration is set to be high only in a P-type well region on which the depression type NMOS is arranged.