Abstract: A method of filling a germanium film in a recess on a substrate to be processed having an insulating film on which the recess is formed on a surface of the substrate, includes forming a first germanium film so as to fill the recess by supplying a germanium raw material gas to the substrate, etching the first germanium film with an etching gas containing an excited H2 gas or NH3 gas, and forming a second germanium film on the first germanium film so as to fill the recess by supplying a germanium raw material gas.

Abstract: There is provided a nitride film forming method which includes: performing a pretreatment in which a chlorine-containing gas is supplied while heating a substrate to be processed having a first base film and a second base film formed on the substrate to a predetermined temperature, and is adsorbed onto a surface of the first base film and a surface of the second base film; and forming a nitride film on the first base film and the second base film subjected to the pretreatment, by an ALD method or a CVD method, using a raw material gas and a nitriding gas, while heating the substrate to be processed to a predetermined temperature.

Abstract: A method for forming a nitride film is provided. The method includes preparing a substrate to be processed, the substrate having a first base film formed of a material having a relatively long incubation time and a second base film formed of a material having a relatively short incubation time with respect to a nitride film, forming a nitride film on the substrate by means of ALD or CVD using a raw material gas and a nitriding gas while heating the substrate to a predetermined temperature, and etching nitride on the first base film to be removed by supplying an etching gas to thereby expose a film surface of the first base film, wherein the forming the nitride film and the etching the nitride are repeatedly performed a predetermined number of times to selectively form the nitride film on the second base film.

Abstract: A semiconductor storage device with a smaller chip size than prior art and a readout method are provided. The semiconductor storage device includes a memory cell array; a page buffer/sense circuit having a sensing node for sensing readout data from a selected page of the memory cell array and a latch circuit for holding data sensed by the sensing node; and a controller controls operations on the memory cell array. The sensing node includes an NMOS capacitor.

Abstract: A semiconductor memory device which is capable of high-speed operation in synchronization with external control signals is provided. The semiconductor memory device has a data input portion, a memory array, a data output portion, and a control portion. The data input portion receives command and address input data in response to the external control signals. The memory array has a plurality of memory elements. The data output portion outputs data read from the memory array in response to the external control signals. The control portion has the function of delay-compensation. During the time interval for receiving the input data, the function of delay-compensation estimates the delay time of the internal circuits, stores the estimated delay-time in a memory unit, and adjusts the output timing of the data output portion.

Abstract: A non-volatile semiconductor memory device and a driving method for word lines thereof are provided. A flash memory of the invention includes a memory cell array including blocks and a block selection element selecting the block of the memory cell array based on row address information and including a block selection transistor, a level shifter, a boost circuit and a voltage supplying element. The block selection transistor is connected to each word line of the block. The level shifter supplies a voltage to a node connected to a gate of the block selection transistor. The boost circuit boosts a potential of the node. The voltage supplying element supplies an operation voltage to one of the terminals of the block selection transistor. The node, after performing first boosting by the operating voltage supplied by the supplying element, performs second boosting by the second circuit.

Abstract: A method of filling a germanium film in a recess on a substrate to be processed having an insulating film on which the recess is formed on a surface of the substrate, includes forming a first germanium film so as to fill the recess by supplying a germanium raw material gas to the substrate, etching the first germanium film with an etching gas containing an excited H2 gas or NH3 gas, and forming a second germanium film on the first germanium film so as to fill the recess by supplying a germanium raw material gas.

Abstract: In a mask pattern forming method, a resist film is formed over a thin film, the resist film is processed into resist patterns having a predetermined pitch by photolithography, slimming of the resist patterns is performed, and an oxide film is formed on the thin film and the resist patterns after an end of the slimming step in a film deposition apparatus by supplying a source gas and an oxygen radical or an oxygen-containing gas. In the mask pattern forming method, the slimming and the oxide film forming are continuously performed in the film deposition apparatus.

Abstract: In a mask pattern forming method, a resist film is formed over a thin film, the resist film is processed into resist patterns having a predetermined pitch by photolithography, slimming of the resist patterns is performed, and an oxide film is formed on the thin film and the resist patterns after an end of the slimming step in a film deposition apparatus by supplying a source gas and an oxygen radical or an oxygen-containing gas. In the mask pattern forming method, the slimming and the oxide film forming are continuously performed in the film deposition apparatus.

Abstract: A method of selectively forming a thin film on a substrate to be processed in which a conductive film and an insulating film are exposed to a surface of the substrate includes: selectively forming a first Ru film only on a first surface, which is an exposed surface of the conductive film and formed of one of Ru, RuO2, Pt, Pd, CuO, and CuO2, using an Ru(EtCp)2 gas and an O2 gas; and selectively forming a first SiO2-containing insulating film only on a second surface, which is an exposed surface of the insulating film has OH groups, by performing one or more times a process of supplying a TMA gas to the substrate to adsorb TMA only to the second surface and a process of forming an SiO2 film only on a surface of the adsorbed TMA using a silanol group-containing silicon raw material and an oxidizing agent.

Abstract: An outdoor unit includes at least a compressor, a gas-liquid separator, and an outdoor heat exchanger of a refrigerant circuit, the refrigerant circuit being formed by connecting, by pipes, the compressor, a condenser, a pressure reducing device, the gas-liquid separator, and the outdoor heat exchanger that acts as an evaporator including at least a plurality of heat transfer tubes and an inlet header that distributes incoming refrigerant to the heat transfer tubes. The outdoor unit further includes a gas-liquid-separator bypass pipe, a gas-liquid-separator-side flow control valve, a header bypass pipe, a header-side flow control valve, and a determination device.

Abstract: A power steering apparatus according to the present invention comprises: a steering mechanism having a steering shaft and a rack bar which steers steer steerable wheels by a movement in an axial direction of the rack bar in association with a rotation of steering shaft; an electrically driven motor having a stator, a rotor, and a drive shaft integrally rotated with the rotor; a worm gear transmitting the rotation of the drive shaft to the steering mechanism; a housing member having a reduction gear housing section, a rack bar housing section, and a motor ECU housing section in which the electrically driven motor and the control circuit are housed; and a moisture detection sensor having a moisture detection section disposed within the reduction gear housing section and a transmission section connected with the control circuit passing through an inner part of the motor ECU housing from the moisture detection section.

Abstract: In a mask pattern forming method, a resist film is formed over a thin film, the resist film is processed into resist patterns having a predetermined pitch by photolithography, slimming of the resist patterns is performed, and an oxide film is formed on the thin film and the resist patterns after an end of the slimming step in a film deposition apparatus by supplying a source gas and an oxygen radical or an oxygen-containing gas. In the mask pattern forming method, the slimming and the oxide film forming are continuously performed in the film deposition apparatus.

Abstract: In a mask pattern forming method, a resist film is formed over a thin film, the resist film is processed into resist patterns having a predetermined pitch by photolithography, slimming of the resist patterns is performed, and an oxide film is formed on the thin film and the resist patterns after an end of the slimming step in a film deposition apparatus by supplying a source gas and an oxygen radical or an oxygen-containing gas. In the mask pattern forming method, the slimming and the oxide film forming are continuously performed in the film deposition apparatus.

Abstract: In a mask pattern forming method, a resist film is formed over a thin film, the resist film is processed into resist patterns having a predetermined pitch by photolithography, slimming of the resist patterns is performed, and an oxide film is formed on the thin film and the resist patterns after an end of the slimming step in a film deposition apparatus by supplying a source gas and an oxygen radical or an oxygen-containing gas. In the mask pattern forming method, the slimming and the oxide film forming are continuously performed in the film deposition apparatus.

Abstract: A semiconductor memory device is provided. The semiconductor memory device includes a maintaining circuit, a sensing circuit, an output circuit, and a verification circuit. The maintaining circuit is configured to maintain data read from a memory cell array and output the data to a data bus in response to a column selection signal. The sensing circuit is configured to sense the data on the data bus in response to at least one sensing enable signal. The output circuit is configured to output the data sensed by the sensing circuit. The verification circuit is configured to verify an operation margin of the sensing circuit and output a verification result. The timing of the at least one sensing enable signal is set according to the verification result of the verification circuit.

Abstract: In a mask pattern forming method, a resist film is formed over a thin film, the resist film is processed into resist patterns having a predetermined pitch by photolithography, slimming of the resist patterns is performed, and an oxide film is formed on the thin film and the resist patterns after an end of the slimming step in a film deposition apparatus by supplying a source gas and an oxygen radical or an oxygen-containing gas. In the mask pattern forming method, the slimming and the oxide film forming are continuously performed in the film deposition apparatus.

Abstract: A refrigeration cycle apparatus includes: a refrigerant circuit including a compressor, a condenser, an expansion device, and an evaporator; an oil separator provided at a refrigerant discharge side of the compressor and configured to separate refrigerant and a refrigerating machine oil; a first oil return path connecting the oil separator to a refrigerant suction side of the compressor; a flow control device provided on the first oil return path and configured to reduce pressure of the refrigerant and the refrigerating machine oil; an oil reservoir provided to branch from the first oil return path between the flow control device and the refrigerant suction side of the compressor and configured to store the refrigerating machine oil; a second oil return path on which the oil reservoir is provided and through which the oil accumulated in the oil reservoir flows when being returned to the compressor.

Abstract: A semiconductor device including a voltage generation circuit, and voltage generation circuit generates a required voltage according to internal data requested in response to an operation are provided. The voltage generating circuit includes a plurality of registers A-1, B-1, C-1, D-1, voltage generating blocks A-2, B-2, C-2 and a voltage switch. The registers A-1, B-1, C-1, D-1 hold data provided from control logic. The voltage generating blocks A-2, B-2, C-2 generate voltage based on voltage control data held by the registers A-1, B-1, C-1. The voltage switch selects voltages based on selection control data held by the register D-1. The connecting element includes signal lines for sequentially transmitting the voltage control data or the selection control data, signal lines for sequentially transmitting a clock signal CLK and signal lines for controlling output of data held by the registers.

Abstract: There is provided an etching method which includes supplying an etching gas including an H2 gas or an NH3 gas to a target substrate having a germanium portion in an excited state; and etching the germanium portion.