Abstract: A memory device includes: a memory cell array comprising a plurality of memory cells, the plurality of memory cells comprising a plurality of data memory cells including a first data memory cell and a plurality of backup memory cells including a first backup memory cell; a storage storing an error table configured to record errors in the plurality of data memory cells, the error table including a plurality of error table entries, each error table entry corresponding to one of the plurality of data memory cell and having an address and a failure count; and a controller configured to replace the first data memory cell with the first backup memory cell based on the error table.

Abstract: Various one-time-programmable (OTP) memory cells are disclosed. An OTP memory cell includes an additional dopant region that extends at least partially under the gate of a transistor, such as an anti-fuse transistor. The additional dopant region provides an additional current path for a read current. Alternatively, an OTP memory cell includes three transistors; an anti-fuse transistor and two select transistors. The two select transistors can be configured as a cascaded select transistor or as two separate select transistors.

Abstract: A memory device including a memory array with a plurality of memory macros, a power supplying circuit, and a controller is provided. The power supplying circuit is coupled to the memory array. The controller is coupled to the memory array. The power supplying circuit is configured to provide power to perform write operations to a number of the memory macros at the same time. The number of the memory macros for the write operations performed at the same time is not higher than a maximum number of the memory macros. The controller obtains the maximum number of the memory macros for the write operations performed at the same time by the power supplying circuit. The controller re-arranges a schedule for a sequence of the write operations of the memory macros to generate a re-arranged schedule. The maximum number is taken as a threshold value. In the re-arranged schedule, a number of part of the memory macros for the write operations performed at the same time is equal to or less then the threshold value.

Abstract: A device includes a substrate having a first side and a second side, a first transistor that includes a first gate over a first protrusion and a first source region and a first drain region interposing the first protrusion, a first buried contact disposed adjacent to the first protrusion and having at least a portion extending into the substrate, a first contact plug disposed over the first drain region, first conductive lines disposed over the first contact plug and electrically connecting to the first drain region by the first contact plug, first via penetrating through the substrate and connecting the first buried contact; and second conductive lines disposed over the second side of the substrate and electrically connecting to the first via. The first buried contact is electrically connecting to the first source region or the first gate.

Abstract: Disclosed herein is an integrated circuit including multiple magnetic tunneling junction (MTJ) cells coupled to a static random access memory (SRAM). In one aspect, the integrated circuit includes a SRAM having a first port and a second port, and a set of pass transistors coupled to the first port of the SRAM. In one aspect, the integrated circuit includes a set of MTJ cells, where each of the set of MTJ cells is coupled between a select line and a corresponding one of the set of pass transistors.

Abstract: A 3D IC structure includes multiple die layers, such as a top die layer and a bottom die layer. The top die layer and/or the bottom die layer each includes devices such as computing units, Analog-to-Digital converters, analog circuits, RF circuits, logic circuits, sensors, Input/Output devices, and/or memory devices. The devices on the first and the second die layers are laterally surrounded by, or adjacent, vertical interconnect structures (VIS).

Abstract: A memory device is provided. The memory device includes several sense amplifiers and at least one reference cell. Each of the sense amplifiers has a first terminal and a second terminal. The first terminals of the sense amplifiers are coupled to a memory cell block, and the second terminals of the sense amplifiers are coupled together to transmit a read current. The at least one reference cell transmits the read current to a ground terminal. The at least one reference cell has a decreased resistance value when a number N of the sense amplifiers increases.

Abstract: An encoding system may be provided. The encoding system may comprise a first stage and a second stage. The first stage may be configured to receive a first input, decode the first input, and produce a first output comprising the decoded first input. The second stage may be configured to receive a second input, receive the first output from the first stage, and convert the first input and the second input from a first coding system to a second coding system based on the second input and the first output. The second stage may produce a second output comprising the converted first input and the converted second input.

Abstract: A package structure may include a substrate, a plurality of dies on the substrate, and a memory bridge die including a first input/output structure connected to a first semiconductor die of the plurality of dies, and a second input/output structure connected to a second semiconductor die of the plurality of dies. The first semiconductor die may be connected to the second semiconductor die through the memory bridge die.

Abstract: A chip assembly structure includes a first chip-containing structure and a second chip-containing structure. The first chip-containing structure includes a back-end-of-line (BEOL) memory die including an array of memory cells and metal interconnect structures. The BEOL memory die is free of any semiconductor material portion having a greater a lateral extent greater than a lateral extent of each memory cell. The first chip-containing structure includes first bonding structures, and a subset of the first bonding structures is electrically connected to the metal interconnect structures in the BEOL memory die. The second chip-containing structure includes a control circuit including field effect transistors which are configured to control operation of the array of memory cells and further includes second bonding structures. The second bonding structures are bonded to the first bonding structures through metal-to-metal bonding or through-substrate-via-mediated bonding.

Abstract: An embodiment semiconductor device may include a semiconductor die stack having a first semiconductor die including a first front-side interconnect structure and a first back-side interconnect structure, and a second semiconductor die including a second front-side interconnect structure and a second back-side interconnect structure, such that the first back-side interconnect structure is electrically connected to the second front-side interconnect structure. The first semiconductor die may include a first central portion disposed between the first front-side interconnect structure and the first back-side interconnect structure, the second semiconductor die may include a second central portion disposed between the second front-side interconnect structure and the second back-side interconnect structure, and each of the first central portion and second central portion may include electrical circuit elements formed in or on a semiconductor substrate.

Abstract: A memory device includes: a memory cell array comprising a plurality of memory cells, the plurality of memory cells comprising a plurality of data memory cells including a first data memory cell and a plurality of backup memory cells including a first backup memory cell; a storage storing an error table configured to record errors in the plurality of data memory cells, the error table including a plurality of error table entries, each error table entry corresponding to one of the plurality of data memory cell and having an address and a failure count; and a controller configured to replace the first data memory cell with the first backup memory cell based on the error table.

Abstract: A memory device includes: a memory cell array comprising a plurality of memory cells; a temperature sensor configured to detect a temperature of the memory cell array; a write circuit configured to write data into the plurality of memory cells; and a controller coupled to the temperature sensor and the write circuit, wherein the controller is configured to determine a target write pulse width used by the write circuit based on the detected temperature of the memory device.

Abstract: A memory device, such as a MRAM device, includes a plurality of memory macros, where each includes an array of memory cells and a first ECC circuit configured to detect data errors in the respective memory macro. A second ECC circuit that is remote from the plurality of memory macros is communicatively coupled to each of the plurality of memory macros. The second ECC circuit is configured to receive the detected data errors from the first ECC circuits of the plurality of memory macros and correct the data errors.

Abstract: A memory system includes a memory device, a controller and a timer circuit. The controller is configured to refresh the memory device according to a first refresh time. The timer circuit is configured to count a first refresh time period. When a first operation temperature of the memory device changes to a second operation temperature, the controller is further configured to acquire a second refresh time, for refreshing the memory device, corresponding to the second operation temperature, and configured to refresh the memory device according to the second refresh time, and the controller is further configured to reset the timer circuit to count a second refresh time period different from the first refresh time period after the controller acquires the second refresh time.

Abstract: A memory device is provided. The memory device includes several sense amplifiers and at least one reference cell. Each of the sense amplifiers has a first terminal and a second terminal. The first terminals of the sense amplifiers are coupled to a memory cell block, and the second terminals of the sense amplifiers are coupled together to transmit a read current. The at least one reference cell transmits the read current to a ground terminal. The at least one reference cell has a decreased resistance value when a number N of the sense amplifiers increases.

Abstract: Performing refresh operation in a memory device is provided. A refresh operation without address rotation is performed in a cell array of the memory device. Performing the refresh operation without address rotation is repeated for a predetermined number of times. After repeating performing the refresh operation with address rotation for the predetermined number of times, a refresh operation with address rotation is performed in the cell array.

Abstract: A memory device is disclosed. The memory device includes a plurality of memory cells arranged in a plurality of rows and a plurality of columns; a plurality of word lines, each of the word lines coupled to a corresponding row of the memory cells; a plurality of bit lines, each of the bit lines coupled to a corresponding column of the memory cells; and a plurality of second word lines, each of the second word lines coupled to a corresponding column of the memory cells.

Abstract: A magnetic memory device includes a magnetic tunnel junction (MTJ) stack, a spin-orbit torque (SOT) induction wiring disposed over the MTJ stack, a first terminal coupled to a first end of the SOT induction wiring, a second terminal coupled to a second end of the SOT induction wiring, and a selector layer coupled to the first terminal.

Abstract: A memory system is provided. The memory system includes a controller configured to refresh a memory array at a first temperature before a first refresh time that is acquired from a lookup table and corresponds to a time period for stored data in the memory array being lost at the first temperature. After the controller acquires a second refresh time from the lookup table, the controller resets a refresh time period to refresh the memory array before the second refresh time. The second refresh time corresponds to a time period for stored data in the memory array being lost at a second temperature different from the first temperature. The refresh time period corresponds to a time period after refreshing the memory array.