Abstract: The present invention further provides a composition for inhibiting purine body absorption, a composition for inhibiting purine nucleotide metabolism, a composition for inhibiting phosphatase, a composition for inhibiting uric acid level elevation, a composition for improving blood pressure, a composition for improving blood glucose level, a composition for improving liver function, a composition for controlling serum iron level, or a composition for promoting calcium absorption, comprising an inositol phosphate or a salt thereof. The present invention further provides a composition comprising an inositol phosphate or a salt thereof, wherein the taste thereof is improved by adding thereto a predetermined amount of calcium lactate.

Abstract: A magnetic memory device includes a magnetic tunnel junction (MTJ) stack, a spin-orbit torque (SOT) induction wiring disposed over the MTJ stack, a first terminal coupled to a first end of the SOT induction wiring, a second terminal coupled to a second end of the SOT induction wiring, and a selector layer coupled to the first terminal.

Abstract: Performing refresh operation in a memory device is provided. A refresh operation without address rotation is performed in a cell array of the memory device. Performing the refresh operation without address rotation is repeated for a predetermined number of times. After repeating performing the refresh operation with address rotation for the predetermined number of times, a refresh operation with address rotation is performed in the cell array.

Abstract: In some aspects of the present disclosure, a memory device is disclosed. In some aspects, the memory device includes a plurality of memory cells arranged in a plurality of rows and a plurality of columns; a plurality of word lines, each of the word lines coupled to a corresponding row of the memory cells; a plurality of bit lines, each of the bit lines coupled to a corresponding column of the memory cells; and a plurality of second word lines, each of the second word lines coupled to a corresponding column of the memory cells.

Abstract: A memory device includes: a memory cell array comprising a plurality of memory cells; a temperature sensor configured to detect a temperature of the memory cell array; a write circuit configured to write data into the plurality of memory cells; and a controller coupled to the temperature sensor and the write circuit, wherein the controller is configured to determine a target write pulse width used by the write circuit based on the detected temperature of the memory device.

Abstract: A magnetic memory device includes a magnetic tunnel junction (MTJ) stack, a spin-orbit torque (SOT) induction wiring disposed over the MTJ stack, a first terminal coupled to a first end of the SOT induction wiring, a second terminal coupled to a second end of the SOT induction wiring, and a selector layer coupled to the first terminal.

Abstract: A memory device includes a plurality of sense amplifiers, a plurality of memory cells, a plurality of data lines, a plurality of reference cells, and a connection line. The memory cells are coupled to a plurality of first inputs of the plurality of sense amplifiers respectively. The data lines are coupled to a plurality of second inputs of the plurality of sense amplifiers respectively. The reference cells are arranged in a plurality of columns respectively and coupled to the plurality of data line respectively. Each of the plurality of reference cells includes a plurality of resistive elements. The connection line is coupled to the plurality of data lines. In a read mode, one of the sense amplifiers is configured to access the plurality of resistive elements arranged in at least one of the plurality of columns.

Abstract: A method includes depositing a first dielectric layer over a semiconductor substrate, depositing a first electrode layer over the first dielectric layer, etching the first electrode layer to form a first electrode and a second electrode laterally separated from the first electrode, depositing a Spin Orbit Torque (SOT) material on the first electrode and the second electrode, depositing Magnetic Tunnel Junction (MTJ) layers on the SOT material, depositing a second electrode layer on the MTJ layers, etching the SOT material to form a SOT layer extending from the first electrode to the second electrode, etching the MTJ layers to form an MTJ stack on the SOT layer, and etching the second electrode layer to form a top electrode on the MTJ stack.

Abstract: A memory device includes: a memory cell array comprising a plurality of memory cells, the plurality of memory cells comprising a plurality of data memory cells including a first data memory cell and a plurality of backup memory cells including a first backup memory cell; a storage storing an error table configured to record errors in the plurality of data memory cells, the error table including a plurality of error table entries, each error table entry corresponding to one of the plurality of data memory cell and having an address and a failure count; and a controller configured to replace the first data memory cell with the first backup memory cell based on the error table.

Abstract: Performing refresh operation in a memory device is provided. A refresh operation without address rotation is performed in a cell array of the memory device. Performing the refresh operation without address rotation is repeated for a predetermined number of times. After repeating performing the refresh operation with address rotation for the predetermined number of times, a refresh operation with address rotation is performed in the cell array.

Abstract: A 3D IC structure includes multiple die layers, such as a top die layer and a bottom die layer. The top die layer and/or the bottom die layer each includes devices such as computing units, Analog-to-Digital converters, analog circuits, RF circuits, logic circuits, sensors, Input/Output devices, and/or memory devices. The devices on the first and the second die layers are laterally surrounded by, or adjacent, vertical interconnect structures (VIS).

Abstract: A 3D IC structure includes multiple dies, such as a top die and a bottom die. The top die and/or the bottom die can each include devices such as computing units, Analog-to-Digital converters, analog circuits, RF circuits, logic circuits, sensors, Input/Output devices, and/or memory devices. One or more vertical interconnect structure (VIS) cells are formed adjacent one or more sides of the device. A VIS is formed in some or all of the VIS cells. One or more non-sensitive circuits, such as repeaters, diodes, and/or passive circuits (e.g., resistors, inductors, capacitors, transformers), are disposed in at least one VIS cell.

Abstract: The present invention further provides a composition for inhibiting purine body absorption, a composition for inhibiting purine nucleotide metabolism, a composition for inhibiting phosphatase, a composition for inhibiting uric acid level elevation, a composition for improving blood pressure, a composition for improving blood glucose level, a composition for improving liver function, a composition for controlling serum iron level, or a composition for promoting calcium absorption, comprising an inositol phosphate or a salt thereof. The present invention further provides a composition comprising an inositol phosphate or a salt thereof, wherein the taste thereof is improved by adding thereto a predetermined amount of calcium lactate.

Abstract: A memory device is provided and includes multiple memory cells, multiple reference cells, and multiple sense amplifiers. The memory cells are coupled to first inputs of the sense amplifiers, respectively. The reference cells are coupled to second inputs of the sense amplifiers, respectively. The reference cells are coupled to each other.

Abstract: A method includes depositing a first dielectric layer over a semiconductor substrate, depositing a first electrode layer over the first dielectric layer, etching the first electrode layer to form a first electrode and a second electrode laterally separated from the first electrode, depositing a Spin Orbit Torque (SOT) material on the first electrode and the second electrode, depositing Magnetic Tunnel Junction (MTJ) layers on the SOT material, depositing a second electrode layer on the MTJ layers, etching the SOT material to form a SOT layer extending from the first electrode to the second electrode, etching the MTJ layers to form an MTJ stack on the SOT layer, and etching the second electrode layer to form a top electrode on the MTJ stack.

Abstract: The present invention provides a column filler for liquid chromatography that has a great adsorption capacity, adjustable adsorption selectivity, and high shape retainability and therefore is usable for measurement of various substances and capable of achieving excellent separation performance and a high filling rate in a column when used as a column filler for liquid chromatography. Provided is a column filler for liquid chromatography including carbon-coated porous particles, the carbon-coated porous particles including porous particles each having a coating layer containing an amorphous carbon on a surface.

Abstract: A memory device is disclosed. The memory device includes at least one reference cell and multiple sense amplifiers. The at least one reference cell having a first terminal coupled to a ground. Each of the sense amplifiers has a first terminal and a second terminal. The first terminal is coupled to one of multiple first data lines, and the second terminal is coupled to a second terminal of the at least one reference cell.

Abstract: A memory system is provided. The memory system includes a compare circuit and a control circuit. The compare circuit determines, in response to a number of detected error bits in a read data from a first memory array, whether a fail word address associated with the detected error bits is in an error table. The control circuit increments a counter value corresponding to the fail word address when the fail word address is in the error table, and further compares the counter value with a threshold value to replace memory locations, corresponding to the fail word address, in the first memory array with backup memory locations in a second memory array.

Abstract: A sensing amplifier, coupled to at least one memory cell, includes an output terminal and a reference terminal, a multiplexer circuit, and a plurality of reference cells having equal value. An output terminal of the multiplexer circuit is coupled to the reference terminal of the sensing amplifier. Each of the reference cell is coupled to each input node of the multiplexer circuit. The multiplexer circuit is controlled by a control signal to select one of the reference cells as a selected reference cell to couple to the reference terminal of the sensing amplifier when each read operation to the at least one memory cell is performed. The plurality of reference cells are selected sequentially and repeatedly, and the one of the reference cells is selected for one read operation to the at least one memory cell.

Abstract: A memory system is provided. The memory system includes a controller configured to refresh a memory array at a first temperature before a first refresh time that is acquired from a lookup table and corresponds to a time period for stored data in the memory array being lost at the first temperature. After the controller acquires a second refresh time from the lookup table, the controller resets a refresh time period to refresh the memory array before the second refresh time. The second refresh time corresponds to a time period for stored data in the memory array being lost at a second temperature different from the first temperature. The refresh time period corresponds to a time period after refreshing the memory array.