Abstract: A sub word line is selected when an associated word line and any of sub decode lines are driven to attain a boosted potential. In a sub decoder selectively driving any of the sub decode lines, the pull-down transistors allowing the sub decode line to discharge are turned on successively with time in a pulsing manner.

Abstract: A sub word line is selected when an associated word line and any of sub decode lines are driven to attain a boosted potential. In a sub decoder selectively driving any of the sub decode lines, the pull-down transistors allowing the sub decode line to discharge are turned on successively with time in a pulsing manner.

Abstract: In a DRAM with an antifuse for programming a defective address, the antifuse and one electrode of a capacitor are connected to a shared node and the other electrode of the capacitor receives a boost signal. To blow the antifuse, the shared node is set high. To maintain the antifuse unblown, the shared node is set low. Then the boost signal is raised high to boost the shared node. Even when the resistance value of antifuse 1 is decreased, excessive current does not flow. This eliminates the necessity of providing a protection circuit as conventional and thus reduces circuit scale.

Abstract: A redundant memory cell column region provided corresponding to respective regular memory cell column regions can have data read and written through a sub I/O line pair and a main I/O line pair independent to those of the regular memory cell column region. Also, one redundant memory cell column region can be connected to a corresponding global I/O line pair G-I/O of any of the regular memory cell column regions via a multiplexer to be replaceable of any of two regular memory cell column regions.

Abstract: In the semiconductor memory device, independent from redundancy determination by a redundancy determining circuit, a word line activating signal (subdecode signal) for setting a word line in a normal block corresponding to a decoded address signal, is activated. A WL driver includes a driver portion for selecting a word line in the normal block, and a driver portion for selecting a spare word line in a redundant block. When redundancy is not to be used as a result of redundancy determination by the redundancy determining circuit, activated subdecode signal is inactivated. If redundancy is to be used as a result of redundancy determination, a corresponding word line is set to the selected state, using the activated subdecode signal. Thus a semiconductor memory device in which substitution can be done at high speed with high efficiency is provided.

Abstract: A semiconductor memory device comprises a p.sup.- -type semiconductor substrate (1), p.sup.+ -type regions (15, 80) formed thereon, n.sup.+ -type regions (6, 7) surrounded with the p.sup.+ -type regions (15, 80), a first gate electrode (2) formed on a charge storage region in the n.sup.+ -type region (6), and a second gate electrode (3) formed on the p.sup.+ -type region (80) and serving as a word line. The p.sup.+ -type regions (15, 80) prevent passage of electrons out of electron-hole pairs induced by alpha rays so as to prevent occurrence of soft errors. An oxide film (16) is formed on the side wall of the second gate electrode (3), a titanium silicide film (17) is formed on the n.sup.+ -type regions (6, 7) and a titanium silicide film (18) is formed on the second gate electrode (3) in a self-aligning manner. Therefore, increase of interconnection resistance of the second gate electrode (3 ) and diffusion resistance of the n.sup.+ -type regions (6, 7) is prevented.

Abstract: X-ray exposure equipment which can effectively converge a synchrotron radiation, which tends to diverge to a great extent in a horizontal direction, to assure a sufficiently high intensity on a lithographic plane and can irradiate X-rays perpendicularly to a full lateral extent of the lithographic plane over an entire exposure area. The X-ray exposure equipment comprises a point X-ray source and a first reflecting mirror having first and second point focuses and disposed such that the first focal point coincides with the location of the X-ray source so as to focus X-rays to the second focal point. A second reflecting mirror is disposed such that the focus thereof substantially coincides with the second focal point of the first reflecting mirror so as to collimate X-rays received from the first reflecting mirror by way of the focusing property thereof in parallel to a principal optical axis of an optical system for X-rays which includes the first and second reflecting mirrors.

Abstract: An element isolating structure employed for isolating the elements of a semiconductor substrate has an impurity region having a concentration lower than that of a source/drain and a channel stop region, between the source/drain of an MOS transistor formed in an active region, and the channel stop region formed under an LOCOS film.A field shield isolating structure has a low concentrated impurity region between the source/drain of an MOS transistor formed in the active region and the substrate surface region covered by a field shield electrode layer. The low concentrated impurity region improves its junction breakdown voltage in the boundary region with the element isolating region.An improved LOCOS film is formed into an amorphous region on the surface of the substrate by an oblique rotating ion implanting method, and the amorphous region is formed by thermal oxidation. The method suppresses the emergence of a bird's beak.

Abstract: A semiconductor memory device comprises a p.sup.- -type semiconductor substrate (1), thin p.sup.+ -type regions (15, 80) formed thereon, n.sup.+ -type regions (6, 7) surrounded with the p.sup.+ -type regions (15, 80), a first gate electrode (2) formed on a charge storage region in the n.sup.+ -type region (6), and a second gate electrode (3) formed on the p.sup.+ -type region (80) and serving as a word line. The p.sup.+ -type regions (15, 80) prevent passage of electrons out of electron-hole pairs induced by alpha rays so as to prevent occurrence of soft errors. Advantageously, the thin p+ layer used to control threshold voltage for a transfer gate of the device is extended and also used for prevention of such soft errors, thus providing reduced bulk for the device. In order to reduce bulk further, the n+-type regions (6, 7) are also reduced in thickness.

Abstract: A method of manufacturing a semiconductor device comprises the steps of forming memory cell portions (2, 4, 6, 11) on a p.sup.- -type semiconductor substrate (1), forming a gate insulator film (5) and a gate electrode (3) each having a larger width, by approximately 1 .mu.m, than the original width, ion-implanting p-type impurities utilizing the gate insulator film (5) and the gate electrode (3) as masks, to form p.sup.+ -type regions (120, 121), etching the side walls of the gate insulator film (5) and the gate electrode (3) to the original width and then, ion-implanting n-type impurities utilizing these regions as a mask, to form n.sup.+ -type regions (80, 81), and heat-treating these regions (80, 81, 120, 121), to form regions (80a, 81a, 120a, 121a). The p.sup.+ -type regions (120a, 121a) prevent passage of electrons out of electron-hole pairs induced by alpha rays, to prevent occurrence of soft errors. The p.sup.+ -type regions (120a, 121a) are located inside the n.sup.