Patents by Inventor Hironori Tanaka

Hironori Tanaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9417391
    Abstract: An optical combiner includes a plurality of input optical fibers, an output optical fiber, and a bridge fiber optically coupled to the plurality of input optical fibers and the output optical fiber. The bridge fiber includes a tapered portion whose outer diameter is reduced toward the emission end, and the outer diameter of the emission end face of the bridge fiber is smaller than the cladding outer diameter of the incident end face of the output optical fiber.
    Type: Grant
    Filed: August 19, 2014
    Date of Patent: August 16, 2016
    Assignee: FUJIKURA LTD.
    Inventor: Hironori Tanaka
  • Publication number: 20160161674
    Abstract: An optical combiner 3 includes a plurality of incoming optical fibers 10, an outgoing optical fiber 20, and a plurality of bridge fibers 60, 50 provided between the plurality of incoming optical fibers 10 and the outgoing optical fiber 20, the plurality of bridge fibers 60, 50 being optically coupled to each other. In the bridge fibers 60, 50, a ratio of the outer diameter of a core 61, 51 to the outer diameter of a cladding 62, 52 is smaller in a bridge fiber located more apart from the incoming optical fiber 10.
    Type: Application
    Filed: February 5, 2016
    Publication date: June 9, 2016
    Applicant: FUJIKURA LTD.
    Inventor: Hironori Tanaka
  • Patent number: 9226399
    Abstract: A wiring board with built-in capacitors includes a core substrate, and a high dielectric sheet including a lower electrode layer, an upper electrode layer and a dielectric layer, the dielectric layer made of a sintered ceramic body and sandwiched between the lower electrode layer and the upper electrode layer, the lower electrode layer and/or the upper electrode layer being partitioned into multiple electrodes such that the high dielectric sheet has multiple capacitors. The lower electrode layer and/or the upper electrode layer is connected to a ground line and the other one of the lower electrode layer and the upper electrode layer is connected to a power line such that the capacitors are electrically connected in parallel.
    Type: Grant
    Filed: November 23, 2010
    Date of Patent: December 29, 2015
    Assignee: IBIDEN CO., LTD.
    Inventor: Hironori Tanaka
  • Patent number: 9177236
    Abstract: An image forming apparatus that performs printing processing using first identification information for identifying, in a first system in a particular organization that performs first authentication, a user in the first authentication, including an obtaining unit that obtains print data from a logical printer in a second system that is a cloud service system that performs second authentication, wherein information for identifying a user in the second system is second identification information, and the print data includes the second identification information; a reference unit that refers to relationship information between the first and second identification information when the obtained print data includes the second identification information; and a controller that controls printing processing of the obtained print data obtained using the first identification information.
    Type: Grant
    Filed: February 26, 2014
    Date of Patent: November 3, 2015
    Assignee: FUJI XEROX CO., LTD
    Inventor: Hironori Tanaka
  • Patent number: 9101070
    Abstract: A multilayer printed wiring board includes a core substrate, a resin insulation layer laminated on the core substrate and a capacitor section coupled to the resin insulating layer. The capacitor section includes a first electrode including a first metal and configured to be charged by a negative charge, and a second electrode including a second metal and opposing the first electrode, the second electrode configured to be charged by a positive charge. A dielectric layer is interposed between the first electrode and second electrode, and an ionization tendency of the first metal is larger than and ionization tendency of the second metal.
    Type: Grant
    Filed: July 18, 2011
    Date of Patent: August 4, 2015
    Assignee: IBIDEN CO., LTD.
    Inventors: Hironori Tanaka, Keisuke Shimizu
  • Patent number: 9065939
    Abstract: A printing system includes at least one image forming apparatus and a management apparatus, each of the image forming apparatus and the management apparatus connected to an information system. The management system includes a receiving unit, an association relationship registration unit, and a user setting unit. The image forming apparatus includes a print data retrieval unit, a converter unit, and a control unit.
    Type: Grant
    Filed: August 31, 2012
    Date of Patent: June 23, 2015
    Assignee: FUJI XEROX CO., LTD.
    Inventor: Hironori Tanaka
  • Publication number: 20150055916
    Abstract: An optical combiner includes a plurality of input optical fibers, an output optical fiber, and a bridge fiber optically coupled to the plurality of input optical fibers and the output optical fiber. The bridge fiber includes a tapered portion whose outer diameter is reduced toward the emission end, and the outer diameter of the emission end face of the bridge fiber is smaller than the cladding outer diameter of the incident end face of the output optical fiber.
    Type: Application
    Filed: August 19, 2014
    Publication date: February 26, 2015
    Applicant: FUJIKURA LTD.
    Inventor: Hironori Tanaka
  • Patent number: 8958090
    Abstract: An image forming apparatus includes an authentication processor, a registration unit, and a print unit. The authentication processor performs a process for user authentication with respect to a user in response to an authentication request from the user. The registration unit registers the image forming apparatus with a print service system on a network as a printer to be used by the user by transmitting, to the print service system, a registration request including user information of the user and information about the image forming apparatus in the case where the user authentication has been successfully performed. The print unit receives, from the print service system, a print instruction to print an electronic document and executes printing in response to the print instruction.
    Type: Grant
    Filed: May 17, 2012
    Date of Patent: February 17, 2015
    Assignee: Fuji Xeros Co., Ltd.
    Inventor: Hironori Tanaka
  • Publication number: 20150015908
    Abstract: An image forming apparatus that performs printing processing using first identification information for identifying, in a first system in a particular organization that performs first authentication, a user in the first authentication, including an obtaining unit that obtains print data from a logical printer in a second system that is a cloud service system that performs second authentication, wherein information for identifying a user in the second system is second identification information, and the print data includes the second identification information; a reference unit that refers to relationship information between the first and second identification information when the obtained print data includes the second identification information; and a controller that controls printing processing of the obtained print data obtained using the first identification information.
    Type: Application
    Filed: February 26, 2014
    Publication date: January 15, 2015
    Applicant: FUJI XEROX CO., LTD.
    Inventor: Hironori TANAKA
  • Patent number: 8832935
    Abstract: A method for manufacturing a printed wiring board including providing a structure having a wiring substrate having a conductor circuit, a build-up multilayer structure formed over the wiring substrate and having an outermost conductor circuit and an outermost insulative resin layer, and a solder resist layer formed over the outermost conductor circuit and outermost insulative resin layer and having openings with an opening diameter D for mounting electronic elements, forming conductor pads with a pitch of about 200 pm or less on the outermost conductor circuit in the openings of the solder resist layer, respectively, and forming solder bumps with a height H from a surface of the solder resist layer on the conductor pads on the conductor pads, respectively, such that a ratio H/D is about 0.55 to about 1.0.
    Type: Grant
    Filed: November 23, 2010
    Date of Patent: September 16, 2014
    Assignee: Ibiden Co., Ltd.
    Inventors: Yoichiro Kawamura, Shigeki Sawa, Katsuhiko Tanno, Hironori Tanaka, Naoaki Fujii
  • Patent number: 8837160
    Abstract: A method of producing a capacitor for a printed circuit board includes producing high-dielectric sheets and selecting ones of the high-dielectric sheets, which are substantially free from a defect after the heat process. Each of the high-dielectric sheets is produced by providing a first electrode, forming a first sputter film on the first electrode, forming an intermediate layer on the first sputter film by calcining a sol-gel film, forming a second sputter film on the intermediate layer, and providing a second electrode on the second sputter film. The high-dielectric sheets are subjected to a heat process in which the high-dielectric sheets are subjected to a first temperature at least once and a second temperature higher than the first temperature at least once.
    Type: Grant
    Filed: July 1, 2011
    Date of Patent: September 16, 2014
    Assignee: Ibiden Co., Ltd.
    Inventors: Takashi Kariya, Hironori Tanaka
  • Patent number: 8774581
    Abstract: The invention aims to provide a holey fiber that can release leak light propagating through the clad at a desired location, and a laser device using the holey fiber. A holey fiber includes: one end and the other end; a core; an inner clad coating the core; a hole layer having a large number of holes formed therein and coating the inner clad; and an outer clad coating the hole layer. In this holey fiber, a collapse region is formed, and the holes in the collapse region are squashed by a predetermined length in the length direction of the fiber.
    Type: Grant
    Filed: September 20, 2012
    Date of Patent: July 8, 2014
    Assignee: Fujikura Ltd.
    Inventors: Hironori Tanaka, Kuniharu Himeno
  • Patent number: 8724949
    Abstract: The invention aims to provide an optical fiber in which light that is input to the clad is easily released to the outside of the clad, and a laser device using the optical fiber. An optical fiber (50) includes a core (51), and a clad (52) coating the core (51). The clad (52) includes a refractive-index varying region (56) in which the refractive index increases in the direction from the inner circumferential side toward the outer circumferential side. In this structure, even when light is input to the clad (52), the light that has reached the refractive-index varying region (56) of the clad (52) is refracted and propagates from the inner circumferential side toward the outer circumferential side of the clad (52). Accordingly, light that is input to the clad (52) is easily released to the outside of the clad (52).
    Type: Grant
    Filed: September 27, 2012
    Date of Patent: May 13, 2014
    Assignee: Fujikura Ltd.
    Inventor: Hironori Tanaka
  • Patent number: 8707552
    Abstract: A high-dielectric sheet for a printed circuit board includes a first electrode, a first sputter film formed on the first electrode, an intermediate layer formed on the first sputter film by calcining a sol-gel film, a second sputter film formed on the intermediate layer, and a second electrode provided on the second sputter film.
    Type: Grant
    Filed: October 16, 2006
    Date of Patent: April 29, 2014
    Assignee: Ibiden Co., Ltd.
    Inventors: Takashi Kariya, Hironori Tanaka
  • Patent number: 8624132
    Abstract: A printed wiring board including a wiring substrate provided with at least one conductor circuit, a solder resist layer provided on the surface of the wiring substrate, at least one conductor pad formed from a part of the conductor circuit exposed from an opening provided in the solder resist layer, and at least one solder bump for mounting electronic parts on the conductor pad. In the printed wiring board, since the at least one conductor pad is aligned at a pitch of about 200 ?m or less, and a ratio (W/D) of a diameter W of the solder bump to an opening diameter D of the opening formed in the solder resist layer is about 1.05 to about 1.7, connection reliability and insulation reliability can be easily improved.
    Type: Grant
    Filed: May 17, 2011
    Date of Patent: January 7, 2014
    Assignee: Ibiden Co., Ltd.
    Inventors: Yoichiro Kawamura, Shigeki Sawa, Katsuhiko Tanno, Hironori Tanaka, Naoaki Fujii
  • Patent number: 8613136
    Abstract: A printed wiring board is manufactured by a method in which a laminate body having a first insulation layer and a conductive film is provided. An alignment mark is formed in the laminate body by removing at least a portion of the conductive film. An electronic component is placed on an adhesive layer provided on the first insulation layer at a position determined based on the alignment mark. After the electronic component is enclosed inside an opening of the second insulation layer, a via hole exposing a terminal of the electronic component is formed at a position determined based on the alignment mark used to determine the position of the electronic component. A via conductor is formed in the via hole, and a conductive layer is formed on the conductive film and patterned to form a conductive circuit connected to the via conductor.
    Type: Grant
    Filed: November 9, 2009
    Date of Patent: December 24, 2013
    Assignee: Ibiden Co., Ltd.
    Inventors: Hironori Tanaka, Kazuhiro Yoshikawa, Naoaki Fujii, Atsunari Yamashita
  • Patent number: 8575496
    Abstract: A multilayer printed wiring board including a layered capacitor section provided on a first interlayer resin insulation layer and a high dielectric layer and first and second layered electrodes that sandwich the high dielectric layer. A second interlayer resin insulation layer is provided on the first insulation layer and the capacitor section, and a metal thin-film layer is provided over the capacitor section and on the second insulation layer. An outermost interlayer resin insulation layer is provided on the second insulation layer and the metal thin-film layer. A mounting section is provided on the outermost insulation layer and has first and second external terminals to mount a semiconductor element. Multiple via conductors penetrate each insulation layer. The via conductors include first via conductors that electrically connect the first layered electrode to the first external terminals. Second via conductors electrically connect the second layered electrode to the second external terminals.
    Type: Grant
    Filed: October 7, 2011
    Date of Patent: November 5, 2013
    Assignee: Ibiden Co., Ltd.
    Inventor: Hironori Tanaka
  • Patent number: 8547265
    Abstract: A power supply apparatus is provided for a test apparatus configured to supply a power supply signal to a DUT. An A/D converter performs analog/digital conversion of an analog observed value that corresponds to a power supply signal so as to generate a digital observed value. A digital signal processing circuit generates, by means of digital processing, a control value adjusted such that the digital observed value received from the A/D converter matches a predetermined reference value. A D/A converter performs digital/analog conversion of the control value, and supplies the resulting value to the DUT as the power supply signal. A digital signal processing circuit is configured to be capable of changing the content of its signal processing.
    Type: Grant
    Filed: June 14, 2011
    Date of Patent: October 1, 2013
    Assignee: Advantest Corporation
    Inventors: Takahiko Shimizu, Katsuhiko Degawa, Hironori Tanaka
  • Publication number: 20130235418
    Abstract: A printing system includes at least one image forming apparatus and a management apparatus, each of the image forming apparatus and the management apparatus connected to an information system. The management system includes a receiving unit, an association relationship registration unit, and a user setting unit. The image forming apparatus includes a print data retrieval unit, a converter unit, and a control unit.
    Type: Application
    Filed: August 31, 2012
    Publication date: September 12, 2013
    Applicant: FUJI XEROX CO., LTD.
    Inventor: Hironori TANAKA
  • Publication number: 20130163031
    Abstract: An image forming apparatus includes an authentication processor, a registration unit, and a print unit. The authentication processor performs a process for user authentication with respect to a user in response to an authentication request from the user. The registration unit registers the image forming apparatus with a print service system on a network as a printer to be used by the user by transmitting, to the print service system, a registration request including user information of the user and information about the image forming apparatus in the case where the user authentication has been successfully performed. The print unit receives, from the print service system, a print instruction to print an electronic document and executes printing in response to the print instruction.
    Type: Application
    Filed: May 17, 2012
    Publication date: June 27, 2013
    Applicant: FUJI XEROX CO., LTD.
    Inventor: Hironori TANAKA