Abstract: A multilayer printed wiring board including an insulation layer and a first interlayer resin insulation layer provided on the insulation layer. A layered capacitor section is provided on the first interlayer resin insulation layer and has a high dielectric layer and first and second layered electrodes that sandwich the high dielectric layer. Also included is a second interlayer resin insulation layer provided on the first interlayer resin insulation layer and the layered capacitor section, and a metal thin-film layer provided over the layered capacitor section and on the second interlayer resin insulation layer. An outermost interlayer resin insulation layer is provided on the second interlayer resin insulation layer and the metal thin-film layer, and a mounting section is provided on the outermost interlayer resin insulation layer and has first and second external terminals to mount a semiconductor element. Multiple via conductors penetrate each interlayer resin insulation layer.

Abstract: Laser beam irradiation areas are provided in a load curve portion and an angle adjustment portion of a suspension. The laser beam irradiation areas are oriented in a direction in which the suspension is to be bent. A laser beam having a predetermined length and a predetermined shape is irradiated onto each laser beam irradiation area.

Abstract: Laser beam irradiation areas are provided in a load curve portion and an angle adjustment portion of a suspension. The laser beam irradiation areas are oriented in a direction in which the suspension is to be bent. A laser beam having a predetermined length and a predetermined shape is irradiated onto each laser beam irradiation area.

Abstract: A multilayer printed wiring board includes a mounting portion supporting a semiconductor device and a layered capacitor portion including first and second layered electrodes and a ceramic high-dielectric layer therebetween. The first layered electrode is connected to a ground line and the second layered electrode is connected to a power supply line. The ratio of number of via holes, each constituting a conducting path part electrically connecting a ground pad to the ground line of a wiring pattern and passing through the second layered electrode in non-contact, to number of ground pads is 0.05 to 0.7. The ratio of number of second rod-shaped conductors, each constituting a conducting path part electrically connecting a power supply pad to the power supply line of the wiring pattern and passing through the first layered electrode in non-contact, to number of power supply pad is 0.05 to 0.7.

Abstract: There is provided a voltage generating apparatus that outputs a power source voltage from a voltage outputting terminal.

Abstract: A printed circuit board including a conductor portion, an insulating layer formed over the conductor portion, a thin-film capacitor formed over the insulating layer and including a first electrode, a second electrode and a high-dielectric layer interposed between the first electrode and the second electrode, and a via-hole conductor structure formed through the second electrode and insulating layer and electrically connecting the second electrode and the conductor portion. The via-hole conductor structure has a first portion in the second electrode and a second portion in the insulating layer. The first portion of the via-hole conductor structure has a truncated-cone shape tapering toward the conductor portion.

Abstract: A multilayer printed wiring board includes a core substrate, a resin insulation layer laminated on the core substrate and a capacitor section coupled to the resin insulating layer. The capacitor section includes a first electrode including a first metal and configured to be charged by a negative charge, and a second electrode including a second metal and opposing the first electrode, the second electrode configured to be charged by a positive charge. A dielectric layer is interposed between the first electrode and second electrode, and an ionization tendency of the first metal is larger than and ionization tendency of the second metal.

Abstract: A substrate for mounting an IC chip including a printed substrate including a first build-up layer. The first build-up layer including (i) a first conductor layer having first conductor circuits and (ii) a resin insulating layer. The first conductor circuits and the resin insulating layer alternating along a length of the first build-up layer. A low-elasticity resin layer formed on the first build-up layer. A low-thermal-expansion substrate formed of ceramics or silicon, and provided on the low-elasticity resin layer. Through-hole conductors provided through the low-thermal-expansion substrate and the low-elasticity resin layer; and second conductor circuits formed on the low-thermal-expansion substrate. The through-hole conductors electrically connect the first conductor layer and the second conductor circuits provided on the low-thermal-expansion substrate.

Abstract: A communication apparatus includes: a battery; a battery level detecting unit which detects a remaining battery level of the battery; a transmitting unit which transmits data; a wait time setting unit which determines an upper limit value from a minimum upper limit value to a maximum upper limit value for a random number generation range, generates a random number up to the upper limit value, and sets a wait time for transmitting the data on the basis of the random number; and a control unit which sets the minimum and maximum upper limit value for the random number generation range on the wait time setting unit. The control unit sets at least one of the minimum and maximum upper limit value in a different manner from a normal control time in case that the control unit receives data indicating that the remaining battery level is detected to be low.

Abstract: An optical module cage mounting structure is disclosed. In the module cage mounting structure, an optical module cage including a cage body with a box shape into which an optical module is inserted is mounted on a printed circuit board such that the cage body is spaced apart from a face of the printed circuit board.

Abstract: There is provided a voltage generating apparatus that outputs a power source voltage from a voltage outputting terminal.

Abstract: The invention provides a wiring board with built-in capacitors, that has a multilayer wiring structure and capable of mounting an IC chip thereon. The wiring board with built-in capacitors includes: a first capacitor that is built into the multilayer wiring structure and formed so that an overlapping area between a first lower electrode and a first upper electrode provided on respective surfaces of a first dielectric layer is a predetermined area; and a second capacitor that is built into the multilayer wiring structure along the same plane as the first dielectric layer and formed so that an overlapping area between a second lower electrode and a second upper electrode provided on respective surfaces of a second dielectric layer with the same thickness as the first dielectric layer is different from the predetermined area.

Abstract: A method of manufacturing a printed wiring board includes preparing a wiring substrate having a conductive circuit, coating a solder-resist layer over the conductive circuit, leveling a surface of the solder-resist layer so as to obtain a maximum surface roughness in a predetermined range, removing the resin film from the surface of the solder-resist layer, and forming multiple openings in the surface of the solder-resist layer to expose multiple portions of the conductive circuit so as to form multiple conductive pads for mounting an electronic components.

Abstract: The invention provides a wiring board with built-in capacitors, that has a multilayer wiring structure and capable of mounting an IC chip thereon. The wiring board with built-in capacitors includes: a first capacitor that is built into the multilayer wiring structure and formed so that an overlapping area between a first lower electrode and a first upper electrode provided on respective surfaces of a first dielectric layer is a predetermined area; and a second capacitor that is built into the multilayer wiring structure along the same plane as the first dielectric layer and formed so that an overlapping area between a second lower electrode and a second upper electrode provided on respective surfaces of a second dielectric layer with the same thickness as the first dielectric layer is different from the predetermined area.

Abstract: The invention provides a wiring board with built-in capacitors, that has a multilayer wiring structure and capable of mounting an IC chip thereon. The wiring board with built-in capacitors includes: a first capacitor that is built into the multilayer wiring structure and formed so that an overlapping area between a first lower electrode and a first upper electrode provided on respective surfaces of a first dielectric layer is a predetermined area; and a second capacitor that is built into the multilayer wiring structure along the same plane as the first dielectric layer and formed so that an overlapping area between a second lower electrode and a second upper electrode provided on respective surfaces of a second dielectric layer with the same thickness as the first dielectric layer is different from the predetermined area.

Abstract: There is provided a voltage generating apparatus that outputs a power source voltage from a voltage outputting terminal.

Abstract: A fine-bubble generator capable of supplying a fluid mixed with a large quantity of fine bubbles into a fluid without causing an unnecessary liquid flow and turbulent flow in the objective fluid. A fine-bubble generator (11) is constructed by arranging two fine-bubble generating sections (12, 13) in a rectangular parallelepiped casing (11a) with spouts (28a, 28b) of the fine-bubble generating sections (12, 13) to face each other.

Abstract: There is provided a voltage generating apparatus that outputs a power source voltage from a voltage outputting terminal.

Abstract: There is provided a voltage generating apparatus that outputs a power source voltage from a voltage outputting terminal.

Abstract: The invention provides a wiring board with built-in capacitors, that has a multilayer wiring structure and capable of mounting an IC chip thereon. The wiring board with built-in capacitors includes: a first capacitor that is built into the multilayer wiring structure and formed so that an overlapping area between a first lower electrode and a first upper electrode provided on respective surfaces of a first dielectric layer is a predetermined area; and a second capacitor that is built into the multilayer wiring structure along the same plane as the first dielectric layer and formed so that an overlapping area between a second lower electrode and a second upper electrode provided on respective surfaces of a second dielectric layer with the same thickness as the first dielectric layer is different from the predetermined area.