Abstract: Solid-patches 11, 12, and 13 each printed with color-inks of cyan, magenta, yellow, and a gray patch 14 included in a color bar 15 are printed on a printed-matter 10. A measuring and calculation device 4 measures actual ink densities at each of the solid-patches and gray patches in the color bars 15 and obtains differential values between the actual ink densities and target ink densities at the gray patch 14. Then, both the amount of the primary-color-component and that of the color-impurity-component at the solid patches 11, 12, and 13 are respectively substituted into equations at every detection of the differential values and that of the gray patches. In this way, ink supply volume is adjusted as a result of converting the differential values into primary-color-component differential amount in each of the color-inks.

Abstract: A lighting unit with a reflecting mirror to prevent irradiation nonuniformity on an irradiated surface, produced by arranging a bulb as a light source in a funnel-shaped reflecting mirror having a reflecting surface and by arranging a plurality of fine reflecting surfaces on the reflecting surface non-radially and non-concentrically without clearance. Preferably the fine reflecting surfaces appear to be a honeycomb, and are formed substantially the same size of 0.01-5 mm long, 0.01-5 mm wide.

Abstract: A method for reading data from an information recording medium having a plurality of address regions, includes the steps of: performing a reading operation for all of designated address regions among the plurality of address regions while holding read error information regarding the read error in the case where a read error occurs during reading of data from one of the plurality of address regions; transferring the read data to a data conversion device for converting the read data; and transferring the read error information to the data conversion device.

Abstract: The present invention provides a tungsten-halogen light bulb having an arc tube with a seal portion at one end. A filament is provided in the interior of the arc tube, and a basic gas mainly comprising at least either gaseous xenon or gaseous krypton is filled in the arc tube. When V (V) denotes a rated voltage of the tungsten-halogen light bulb, P(MPa) denotes a filling pressure of the basic gas at a room temperature, and Xe vol. % and Kr vol. % respectively denote composition ratios of the gaseous xenon and of the gaseous krypton, the following formulas (1) and (2) are satisfied simultaneously, in which ‘%’ means ‘volume % .

Abstract: A lead frame for LOC to which a semiconductor chip is fixed within a semiconductor chip-mounting region. In addition to applying insulative adhesives to the conventional portions or spots which are on the bottom surfaces of the leading edges of respective inner leads for wire bonding to the pads for the semiconductor ship, the insulative adhesives are applied to other portions of the inner leads in the vicinity of the semiconductor chip-mounting region. Accordingly, the area for bonding the semiconductor chip can be enlarged resulting in improvements in the stability of adhesion between the leads and the semiconductor chip, and in the stabilities of wire bonding and resin molding.

Abstract: A method of forming images on an image receiving material including a non-contact thermal fusing image fixing step employs a black toner made of black toner particles, a yellow toner made of yellow toner particles, a magenta toner made of magenta toner particles and a cyan toner made of cyan toner particles, the black toner particles having a greater volume mean diameter than the volume mean diameter of the toner particles of any of the yellow toner, the magenta toner and the cyan toner.

Abstract: A lead frame is provided which enables a coating of an insulating adhesive for fixing a semiconductor chip to be evenly and thickly foamed on inner leads. In a lead frame wherein an insulating adhesive for fixing a semiconductor chip is applied to a semiconductor chip mounting region, inner leads 1 are set to a value of w/s of not more than 1 wherein w represents the lead width and s represents the lead spacing.

Abstract: A lead frame for semiconductor device comprises first inner leads 21-2, 21-3 and 21-4 each having a region 22-2, 22-3, 22-4 on which a predetermined quantity of adhesive is applied, and second inner leads 21-1 and 21-5 each having a region 22-1, 22-5 which is wider than those of the first inner leads. The first inner leads 21-2, 21-3 and 21-4 have a width W.sub.1, while the second inner leads 21-1 and 21-5 have a width W.sub.2 which is wider than W1. The second inner leads 21-1 and 21-5 are arranged at the positions where one successive application of varnish-like adhesive to the inner leads begins and ends, respectively. The ratio of W.sub.1 to W.sub.2 is preferably 1 to 1.3 (i.e., W.sub.1 :W.sub.2 =1:1.3) or more. Even if an excessive quantity of varnish-like adhesive is applied to the beginning inner lead 21-1 or the ending inner lead 21-5, it is spread over the region 22-1 or 22-5, then adhesive layers having uniform thickness are formed.

Abstract: The present invention provides a lighting unit with a reflecting mirror using a bulb, in which the reflecting mirror will not fall out of a base due to vibration or deterioration of an adhesive by aging. The lighting unit includes a reflecting mirror (1) having a reflecting part (3) at one end and a neck portion (4) at another end, a bulb (11) as a light source, and a base (12). The bulb (11) is positioned inside the reflecting mirror (1). An end of the bulb (11) is inserted into the neck portion (4) of the reflecting mirror (1), and the base (12) is fixed to the neck portion (4). Thus, the bulb (11), the reflecting mirror (1), and the base (12) are combined into one component. The maximum outer diameter of the bulb (11) is larger than an inner diameter of the neck portion (4) of the reflecting mirror (1).

Abstract: A lamp for a halogen lamp a single-tube, high-intensity discharge lamp, a double-tube high-intensity discharge lamp having an outer housing formed of quartz, and the like, being characterized in that a film having desirable heat conductivity and emissivity is formed on the surface of each sealing portion thereof, whereby the temperature at the distal end of the molybdenum foil in the sealing portion away from the center of the bulb can be kept at about 350.degree. C. or less while the lamp is burning.

Abstract: A lead frame for LOC is provided which can reduce a variation in coverage of an insulating adhesive, permitting the fixation of a semiconductor chip and wire bonding to be stably performed. In a lead frame for LOC 10 wherein an insulating adhesive for fixing a semiconductor chip is applied to inner leads 11 in their semiconductor chip mounting region, a coverage regulating lead 14 is provided outside the semiconductor chip mounting region and adjacent to inner leads 11a, 11b located at the end of the semiconductor chip mounting region, permitting the insulting adhesive to be homogeneously applied to each of the inner leads 11 without creating any variation in coverage of the adhesive.

Abstract: A color developer is described that contains a toner and a resin-coated carrier, wherein the toner contains a hydrophobic particulate titania and a charge controlling agent, and the charge controlling agent contains an aromatic hydroxycarboxylic acid metal salt having the following formula (1): ##STR1## wherein each of Q and Q' each independently represents a residual group of an aromatic hydroxycarboxylic acid optionally substituted with an alkyl group, an aralkyl group, or an alkyl group and an aralkyl group; X is a counter ion; and M is a metal. A toner is also provided that contains the above charge controlling agent.

Abstract: A lead frame for LOC is provided which, even when an adhesive is applied to a lead prepared by stamping, can ensure insulation of a semiconductor element mounted from the lead. In applying an adhesive to a predetermined position of an inner lead 1 in a lead frame prepared by stamping to form an adhesive layer 4, the adhesive layer 4 is provided on the droop face of the inner lead 1. The droop face has no burr and a bulged center portion, permitting contact, derived from the burr, between a lead face and a semiconductor element, to be avoided, which ensures satisfactory insulation of the semiconductor element mounted from the lead.

Abstract: A method for punching an insulating film is composed of using plural divided punches having a clearance between each two of the divided punches. The clearance absorbs thermal expansion of the divided punches caused by receiving a heat from a heater. A punched insulating film is stuck to a lead frame by being pressed between the divided punches and the heater.

Abstract: A process of producing a diffraction grating includes the steps of forming a coating layer on a first diffraction grating layer of a resin formed on a substrate without damaging the diffraction grating layer, removing a portion of the coating layer positioned on the first diffraction grating layer by etching to form a second diffraction grating layer of the coating layer having the reverse phase to that of the first diffraction grating layer, removing the first diffraction grating layer, and etching the substrate with a mask of the second diffraction grating layer, so that the diffraction grating having the reverse phase can be easily produced. When the first diffraction grating layer is left and both the first and second diffraction grating layers are used as a mask, the diffraction grating having a period half times as large as that of the first grating layer can be easily produced.

Abstract: A video signal processing apparatus is obtainable which is capable of automatically and continuously adjusting variations of characteristics due to various factors after each video signal input system is adjusted.

Abstract: A planning support system and process in a workstation having an operator interface, planning process feature, a data file server, and memory feature therein, characterized in storing a planner model having data indicating a plurality of planning actions in the data file server and indicating flow among the planning actions and having process times of the planning actions, and in processes executed by the planning process feature including setting an operator model on the basis of a planning request input through the operator interface, and including determining action of a first planning action to be executed according to the planner model on the basis of the operator model and for determining a second planning action to be executed following the first planning action, and including storing data needed for process of the second planning action into the memory feature until the process of the second planning action is started after process of the first planning action ends on the basis of the planner model.

Abstract: A process of producing a diffraction grating comprises the steps of forming a coating layer on a first diffraction grating layer of a resin formed on a substrate without damaging the diffraction grating layer, removing a portion of the coating layer positioned on the first diffraction grating layer by etching to form a second diffraction grating layer of the coating layer having the reverse phase to that of the first diffraction grating layer, removing the first diffraction grating layer, and etching the substrate with a mask of the second diffraction grating layer, so that the diffraction grating having the reverse phase can be easily produced. When the first diffraction grating layer is left and both the first and second diffraction grating layers are used as a mask, the diffraction grating having a period half times as large as that of the first grating layer can be easily produced.

Abstract: A method for punching an insulating film is composed of using plural divided punches having a clearance between each two of the divided punches. The clearance absorbs thermal expansion of the divided punches caused by receiving a heat from a heater. A punched insulating film is stuck to a lead frame by being pressed between the divided punches and the heater.