Abstract: High strength plated steel sheet having high hydrogen embrittlement resistance, that is, alloyed hot dip galvannealed steel sheet including steel sheet containing C: 0.05 to 0.40%, Si: 0.2 to 3.0%, Mn: 0.1 to 5.0%, and sol. Al: 0.4 to 1.50% and a alloyed hot dip galvannealed layer deposited on at least one surface of the steel sheet to 10 to 100 g/m2 and containing Fe: 5.0 to 15.0% and Al: 0.01 to 1.0%, having an internal oxidation layer including grain boundary oxides in a surface layer of the steel sheet, when examining a cross-section of a surface layer of the steel sheet, a Ratio A of the length of the grain boundary oxides projected an interface of the steel sheet and the alloyed hot dip galvannealed layer to the length of interface is 50% or more and 100% or less, and a surface depleted layer with a steel composition not including the grain boundary oxides which satisfies, by mass %, Si?0.6% and Al?0.05% is included at a depth of ½ of the average depth of the internal oxidation layer.

Abstract: A hot stamped steel includes a base material, a plated layer that is formed on a surface of the base material, and an oxide film that is formed on a surface of the plated layer; chemical composition of the plated layer contains 20.00 to 45.00 mass % of Al, 10.00 to 45.00 mass % of Fe, 4.50 to 15.00 mass % of Mg, 0.10 to 3.00 mass % of Si, 0.05 to 3.00 mass % of Ca, 0 to 0.50 mass % of Sb, 0 to 0.50 mass % of Pb, 0 to 1.00 mass % of Cu, 0 to 1.00 mass % of Sn, 0 to 1.00 mass % of Ti, 0 to 0.50 mass % of Sr, 0 to 1.00 mass % of Cr, 0 to 1.00 mass % of Ni, and 0 to 1.00 mass % of Mn with a remainder of Zn and impurities; and chemical composition of the oxide film contains 20.0 to 55.0 at % of Mg, 0.5 to 15.0 at % of Ca, 0 to 15.0 at % of Zn, and 0 at % or more and less than 10.0 at % of Al with a remainder of O and a total of 5.0 at % or less of impurities, and the adhesion amount of the oxide film per one surface is in a range of 0.01 to 10 g/m2.

Abstract: High strength steel sheet and plated steel sheet having high plateability, LME resistance, and hydrogen embrittlement resistance, that is, steel sheet containing C: 0.05 to 0.40%, Si: 0.2 to 3.0%, Mn: 0.1 to 5.0%, and sol. Al: 0.4 to 1.50%, having an internal oxidation layer including fine granular oxides and coarse granular oxides in a surface layer of the steel sheet, a number density of fine granular oxides in the internal oxidation layer being 4.0/?m2 or more, a number density of coarse granular oxides in the internal oxidation layer being 4.0/25 ?m2 or more and 30.0/25 ?m2 or less, and including a surface depleted layer with a steel composition not including oxides which satisfies, by mass %, Si?0.6% and Al?0.05% at a depth of ½ of the average depth of the internal oxidation layer calculated from the cross-sectional SEM image of the steel sheet, and a plated steel sheet using the same.

Abstract: High strength steel sheet and plated steel sheet having high plateability, LME resistance, and hydrogen embrittlement resistance, that is, steel sheet containing C: 0.05 to 0.40%, Si: 0.2 to 3.0%, Mn: 0.1 to 5.0%, and sol. Al: 0.4 to 1.50%, having an internal oxidation layer including fine granular oxides in a surface layer of the steel sheet, a number density of fine granular oxides in the internal oxidation layer being 4.0/?m2 or more, and including a surface depleted layer with a steel composition not including oxides which satisfies, by mass %, Si?0.6% and Al?0.05% at a depth of ½ of the average depth of the internal oxidation layer calculated from the cross-sectional SEM image of the steel sheet, and a plated steel sheet using the same.

Abstract: An electrostatic chuck includes a ceramic base, a ceramic dielectric layer, an electrostatic electrode, and a ceramic insulating layer. The ceramic dielectric layer is positioned on the ceramic base and is thinner than the ceramic base. The electrostatic electrode is embedded between the ceramic dielectric layer and the ceramic base. The ceramic insulating layer is positioned on the ceramic dielectric layer and is thinner than the ceramic dielectric layer. The ceramic insulating layer has a higher volume resistivity and withstand voltage than the ceramic dielectric layer, and the ceramic dielectric layer has a higher dielectric constant than the ceramic insulating layer.

Abstract: In a lithium ion secondary battery (1), a positive electrode (2) and a negative electrode (3) are alternately adjacent to each other via separators (4) and (5). The positive electrode (2) includes a positive electrode current collector composed of a metal porous body, a first positive electrode active material (21) held on one side of the positive electrode current collector, and a second positive electrode active material (22) held on the other side. The negative electrode (3) includes a negative electrode current collector composed of a metal porous body, a first negative electrode active material (31) held on one side of the negative electrode current collector, and a second negative electrode active material (32) held on the other side. The first positive electrode active material (21) faces the first negative electrode active material (31), and the positive electrode active material (22) faces the second negative electrode active material (32).

Abstract: A wafer placement table includes: an electrostatic chuck that is a ceramic sintered body in which an electrode for electrostatic adsorption is embedded; a cooling member which is bonded to a surface on an opposite side of a wafer placement surface of the electrostatic chuck, and cools the electrostatic chuck; a hole for power supply terminal, the hole penetrating the cooling member in a thickness direction; and a power supply terminal which is bonded to the electrode for electrostatic adsorption from the surface on the opposite side of the wafer placement surface of the electrostatic chuck, and is inserted in the hole for power supply terminal. The outer peripheral surface of a portion of the power supply terminal is covered with an insulating thin film that is formed by coating of an insulating material, the portion being inserted in the hole for power supply terminal.

Abstract: There is provided an electrostatic chuck assembly including: an electrode-embedded ceramic plate; a cooling plate that supports a bottom surface of the ceramic plate and has an internal space of an annular or arcuate shape; an internal fixation member of an annular or arcuate shape accommodated in the internal space so as to be rotatable about a central axis of the cooling plate; female threads in a multiple of n, which is an integer of 2 or more, spaced apart from each other in the internal fixation member; and n insertion holes for insertion of bolts for being fixed to a chamber, the insertion holes each being provided at the bottom of the cooling plate such that one set of n female threads is exposed. Each of the female threads is disposed such that another set of n female threads is exposed in the insertion holes when rotated.

Abstract: The hot-dip plated steel material includes a steel material and a hot-dip plated layer disposed on a surface of the steel material, the hot-dip plated layer has a certain chemical composition, and the hot-dip plated layer has a diffraction intensity obtained from a result of X-ray diffraction measurement, the diffraction intensity satisfying a certain relationship.

Abstract: The present disclosure inhibits liquid metal embrittlement (LME) cracking and improves corrosion resistance in a welded joint obtained by spot welding a first steel sheet and a second steel sheet. In the welded joint of the present disclosure, a first plating layer is provided on a surface of the first steel sheet facing the second steel sheet, no plating layer is present on or a second plating layer is provided on a surface of the second steel sheet facing the first steel sheet, and a boundary plating layer is provided between the first steel sheet and the second steel sheet in a range of 0.5 mm from an end part of the corona bond toward an outside of the spot welded part. A higher tensile strength of a tensile strength of the first steel sheet and a tensile strength of the second steel sheet is 780 MPa or more, an area ratio of a MgZn2 phase at the cross-section of the boundary plating layer is 10% or more, and the first plating layer and the second plating layer satisfy a predetermined Relation I.

Abstract: The hot-dip plated steel material includes a steel material and a hot-dip plated layer disposed on a surface of the steel material, the hot-dip plated layer has a certain chemical composition, and the hot-dip plated layer has a diffraction intensity obtained from a result of X-ray diffraction measurement, the diffraction intensity satisfying a certain relationship.

Abstract: The present disclosure inhibits liquid metal embrittlement (LME) cracking and improves corrosion resistance in a welded joint obtained by spot welding a first steel sheet and a second steel sheet. In the welded joint of the present disclosure, a first plating layer is provided on a surface of the first steel sheet facing the second steel sheet, no plating layer is present on or a second plating layer is provided on a surface of the second steel sheet facing the first steel sheet, a boundary plating layer is provided between the first steel sheet and the second steel sheet in a range of 0.5 mm from an end part of the corona bond of the spot welded part toward an outside of the spot welded part, and a Zn penetrated part is present at least at one of the first steel sheet and the second steel sheet adjoining the boundary plating layer.

Abstract: The present disclosure inhibits liquid metal embrittlement (LME) cracking in a welded joint obtained by spot welding a first steel sheet and a second steel sheet. In the welded joint of the present disclosure, a first plating layer is provided on a surface of the first steel sheet facing the second steel sheet, no plating layer is present on or a second plating layer is provided on a surface of the second steel sheet facing the first steel sheet, and a boundary plating layer is provided between the first steel sheet and the second steel sheet in a range of 0.5 mm from an end part of the corona bond toward an outside of the spot welded part. A higher tensile strength of a tensile strength of the first steel sheet and a tensile strength of the second steel sheet is 780 MPa or more, an area ratio of a ?-Zn phase at the cross-section of the boundary plating layer is 5% or more, and the first plating layer and the second plating layer satisfy predetermined Relations I and II.

Abstract: A member for semiconductor manufacturing apparatus includes a ceramic plate incorporating an electrode; a ceramic plate through hole extending through the ceramic plate in an up-and-down direction; a base plate having electrical conductivity and located adjacent to a lower surface of the ceramic plate; a base plate through hole extending through the base plate in the up-and-down direction; an insulating sleeve inserted into the base plate through hole and having an outer circumferential surface adhered to an inner circumferential surface of the base plate through hole with an adhesive layer therebetween; and a sleeve through hole extending through the insulating sleeve in the up-and-down direction and communicating with the ceramic plate through hole, wherein the insulating sleeve has at least one ring-shaped or spiral outer circumferential groove on the outer circumferential surface of the insulating sleeve except for an upper end portion of the insulating sleeve.

Abstract: Provided is a surface treated steel sheet which includes a base metal, and a plated layer formed on a surface of the base metal, wherein an average composition of the plated layer contains, in mass %, Mg: 0.5 to 2.0%, and [60.0?Zn+Al?98.0], [0.4?Zn/Al?1.5], and [Zn/Al×Mg?1.6] are satisfied.

Abstract: A plated steel sheet for hot stamping including a base metal and a galvanized layer that is formed on a surface of the base metal, wherein the galvanized layer includes a galvannealed layer, a solidified zinc layer, and an oxide layer containing Al, in this order from the base metal, and a proportion of a content of Zn (g/m2) in the solidified zinc layer to a content of Zn (g/m2) in the galvanized layer is 10 to 95%.

Abstract: A member for semiconductor manufacturing apparatus includes: a ceramic plate having a wafer placement surface; a conductive base plate; a gas common passage provided inside the base plate; gas outlet passages provided to reach the wafer placement surface from the gas common passage; at least one gas inlet passage provided to communicate with the gas common passage from a lower surface of the base plate; and an insulating sleeve disposed in a base plate through-hole. The insulating sleeve has a first communication hole that constitutes part of the gas common passage, and a second communication hole that is provided to reach an upper surface of the insulating sleeve from the first communication hole, and constitute part of the gas outlet passages.

Abstract: A member for a semiconductor manufacturing apparatus, the member has a wafer placement surface and includes: a plurality of gas outflow passages each having an opening on the wafer placement surface; a common gas passage that is in communication with the plurality of gas outflow passages; and at least one gas inflow passage that is in communication with the common gas passage from a surface of the member for a semiconductor manufacturing apparatus that is on an opposite side from the wafer placement surface, the number of the at least one gas inflow passage being smaller than the number of the gas outflow passages in communication with the common gas passage. Among the plurality of gas outflow passages, a gas outflow passage closer to the gas inflow passage has a larger gas passage resistance than a gas outflow passage farther from the gas inflow passage.

Abstract: This hot stamped member includes: a steel; and a plating layer formed on the steel, in which the plating layer has a predetermined chemical composition, the plating layer contains a Zn-based oxide including one or two of a Zn oxide and a Zn—Mg oxide having a size of 1.0 ?m or more and 10.0 ?m or less in a thickness direction of the plating layer and 0.1 ?m or more in a direction perpendicular to the thickness direction, and in a cross section of the plating layer in the thickness direction, when a length of an interface between the plating layer and the steel is indicated as Le, a sum of lengths of the Zn-based oxide projected onto the interface from an upper surface of the plating layer is indicated as ?Li, and a sum of lengths of portions of the Zn-based oxide in contact with the plating layer projected onto the interface from the upper surface of the plating layer is indicated as ?Lai, ?Li/Le?0.10 and ?Lai/?Li?0.50 are satisfied.

Abstract: This hot-dip Zn-based plated steel sheet includes a steel sheet and a plating layer formed on at least part of a surface of the steel sheet, in which the plating layer has a chemical composition that includes, by mass %, Al: 6.00% to 35.00%, Mg: 2.00% to 12.00%, Ca: 0.005% to 2.00%, Si: 0% to 2.00%, Fe: 0% to 2.00%, Sb: 0% to 0.50%, Sr: 0% to 0.50%, Pb: 0% to 0.50%, Sn: 0% to 1.00%, Cu: 0% to 1.00%, Ti: 0% to 1.00%, Ni: 0% to 1.00%, Mn: 0% to 1.00%, Cr: 0% to 1.00%, and a remainder: Zn and impurities, the plating layer has an area ratio of a MgZn2 phase in a range of 15% to 60% in a cross section in a thickness direction, and the MgZn2 phase includes a Ca-based intermetallic compound having a circle equivalent diameter of 0.10 ?m or smaller.