Abstract: A substrate for a printed circuit board according to an embodiment of the present invention includes a resin film and a metal layer stacked on at least one of surfaces of the resin film. An average diffusion depth of a main metal of the metal layer in the resin film is 100 nm or less after a weather resistance test in which the substrate is held at 150° C. for seven days. The average diffusion depth is preferably 80 nm or less before the weather resistance test.

Abstract: In an image processing device, a motion image decoding processing unit extracts a feature amount of a target image to be decoded from an input stream, and changes a read size of a cache fill from an external memory to a cache memory, based on the feature amount. The feature amount represents an intra macro block ratio in, for example, one picture (frames or fields), or a motion vector variation. When the intra macro block ratio is high, the read size of the cache fill is decreased.

Abstract: A substrate for a printed circuit board according to an embodiment of the present invention includes a base film having an insulating property, and a conductive layer formed on at least one of surfaces of the base film. In the substrate for a printed circuit board, at least the conductive layer contains titanium in a dispersed manner. The conductive layer preferably contains copper or a copper alloy as a main component. A mass ratio of titanium in the conductive layer is preferably 10 ppm or more and 1,000 ppm or less. The conductive layer is preferably formed by application and heating of a conductive ink containing metal particles. The conductive ink preferably contains titanium or a titanium ion. The metal particles are preferably obtained by a titanium redox process including reducing metal ions using trivalent titanium ions as a reducing agent in an aqueous solution by an action of the reducing agent.

Abstract: According to an embodiment of the present invention, a substrate for a printed circuit board, the substrate including a resin film and a metal layer deposited on at least one surface of the resin film, includes a modified layer on the surface of the resin film on which the metal layer is deposited, the modified layer having a composition different from another portion, in which the modified layer contains a metal, a metal ion, or a metal compound different from a main metal of the metal layer. The content of a metal element of the metal, the metal ion, or the metal compound on a surface of the modified layer is preferably 0.2 atomic % or more and 10 atomic % or less.

Abstract: A data selector circuit divides a group of data including a plurality of types of data into the plurality of types of data. A first compression circuit and a second compression circuit respectively compress the plurality of types of data in parallel with each other in accordance with each of the plurality of types of data. The first compression circuit compresses data and obtains compressed data. The second compression circuit compresses data and obtains compressed data. The data transmission circuit-transmits the compressed data and the compressed data to a terminal.

Abstract: A display area can be smoothly moved. A semiconductor device sequentially receives a plurality of whole images, each of which includes a plurality of small screen images and which are temporally continuous and form a moving image, and decodes a received whole image. Here, the semiconductor device includes a reception unit that receives the whole image including the small screen images, a determination unit that determines a decoding area which includes a small screen image to be decoded and which is included in the whole image, and a decoding unit that decodes the small screen image in the decoding area which is determined by the determination unit and which is included in the whole image. The determination unit determines a new decoding area when a small screen image of intra frame appears in the decoding area.

Abstract: A data selector circuit divides a group of data including a plurality of types of data into the plurality of types of data. A first compression circuit and a second compression circuit respectively compress the plurality of types of data in parallel with each other in accordance with each of the plurality of types of data. The first compression circuit compresses data and obtains compressed data. The second compression circuit compresses data and obtains compressed data. The data transmission circuit-transmits the compressed data and the compressed data to a terminal.

Abstract: In an image processing device, a motion image decoding processing unit extracts a feature amount of a target image to be decoded from an input stream, and changes a read size of a cache fill from an external memory to a cache memory, based on the feature amount. The feature amount represents an intra macro block ratio in, for example, one picture (frames or fields), or a motion vector variation. When the intra macro block ratio is high, the read size of the cache fill is decreased.

Abstract: A planar coil element of the present invention includes an insulating base film having a first surface and a second surface opposite to the first surface, a first conductive pattern deposited on the first surface side of the insulating base film, and a first insulating layer covering the first conductive pattern on the first surface side, in which the first conductive pattern includes a core body and a widening layer deposited by plating on the outer surface of the core body, and the ratio of the average thickness of the first conductive pattern to the average circuit pitch of the first conductive pattern is ½ or more and 5 or less.

Abstract: A series of fluorine-containing bisphosphonic acids in which an alkylamine side chain is added, a series of fluorine-containing bisphosphonic acids in which an amino group substituted by a heterocyclic group or a heterocyclic group containing a nitrogen atom is added, to the carbon atom of P—C(F)—P, and a series of fluorine-containing bisphosphonate derivatives in which the acid moiety thereof is esterified by an alkoxymethyl group such as POM group, n-butanoyloxymethyl (BuOM) group and the like, that is, the fluorine-containing bisphosphonic acid and fluorine-containing bisphosphonate derivative represented by the following formula (I): wherein each symbol is as defined in the DESCRIPTION, can efficiently induce proliferation of peripheral blood ?? T cells that express V?2V?2 T cell receptor having superior cytotoxicity against tumor cells and virus infected cells, immunize tumor cells and virus infected cells, and can induce cytotoxicity by ?? T cells.

Abstract: An object of the present invention is to provide a metal powder and an ink with which a sintered body having good flexibility can be formed, and a sintered body having good flexibility. A metal powder according to an embodiment of the present invention has a mean particle size D50BET of 1 nm or more and 200 nm or less as calculated by a BET method, a mean crystallite size DCryst of 20 nm or less as determined by an X-ray analysis, and a ratio (DCryst/D50BET) of the mean crystallite size DCryst to the mean particle size D50BET of less than 0.4.

Abstract: A substrate for a printed circuit board according to an embodiment of the present invention includes a base film having insulating properties and a sintered layer formed of a plurality of metal particles, the sintered layer being stacked on at least one surface of the base film, in which a region of the sintered layer extending from an interface between the sintered layer and the base film to a position 500 nm or less from the interface has a porosity of 1% or more and 50% or less.

Abstract: Provided are a communication system, an abnormality detection device and an abnormality detection method that detects abnormality concerning communication such as information forged by utilizing a difference in timings of sampling between multiple communication devices. For the system configuration where ECUs transmit and receive information through a common communication line, abnormality detection related to communication is performed by a monitoring device connected to the communication line. Each ECU receives information by sampling once at a predetermined timing during a transmission period of one-bit information. The ECUs may also be allowed to perform sampling at different timings.

Abstract: An object is to provide a substrate for a printed wiring board that has good circuit formability while maintaining adhesion strength between a conductive layer (2) and a base film (1). The substrate includes a base film having an insulating property (1) and a conductive layer (2) formed on at least one surface of the base film (1). The maximum height Sz, which is defined in ISO25178, of the surface of the base film (1) is 0.05 ?m or more and less than 0.9 ?m.

Abstract: A substrate for a printed circuit board according to an embodiment of the present invention includes a base film having an insulating property, and a metal layer formed on at least one surface side of the base film. In the substrate for a printed circuit board, a plurality of fine particles are disposed between the base film and the metal layer, and the fine particles are formed of a metal the same as a main metal of the metal layer or formed of a metal compound of the main metal. The fine particles preferably have an average particle size of 0.1 nm or more and 20 nm or less. The fine particles are preferably formed of a metal oxide or a metal hydroxide. The fine particles are preferably present between the base film and the metal layer so as to form a layer. The metal layer preferably includes a metal grain layer formed by firing metal nanoparticles.

Abstract: A substrate for a printed circuit board according to an embodiment of the present invention includes a base film having an insulating property, and a conductive layer formed on at least one of surfaces of the base film. In the substrate for a printed circuit board, at least the conductive layer contains titanium in a dispersed manner. The conductive layer preferably contains copper or a copper alloy as a main component. A mass ratio of titanium in the conductive layer is preferably 10 ppm or more and 1,000 ppm or less. The conductive layer is preferably formed by application and heating of a conductive ink containing metal particles. The conductive ink preferably contains titanium or a titanium ion. The metal particles are preferably obtained by a titanium redox process including reducing metal ions using trivalent titanium ions as a reducing agent in an aqueous solution by an action of the reducing agent.

Abstract: There is a problem that memory protection against access to a shared memory by a sub-arithmetic unit used by a program executed in a main-arithmetic unit cannot be performed in a related-art semiconductor device. According to one embodiment, a semiconductor device includes a sub-arithmetic unit configured to execute a process of a part of a program executed by a main-arithmetic unit, and a shared memory shared by the main-arithmetic unit and the sub-arithmetic unit, in which the sub-arithmetic unit includes a memory protection unit configured to permit or prohibit access to the shared memory based on an access permission range address value provided from the main-arithmetic unit, the access to the shared memory being access that arises from a process executed by the sub-arithmetic unit.

Abstract: The substrate for a printed circuit board according to an embodiment of the present invention includes a base film having insulating properties, and a metal layer stacked on at least one surface of the base film, in which the base film includes a portion where a transition metal in group 10 of the periodic table is present. The transition metal in group 10 is preferably nickel or palladium. The portion where the transition metal in group 10 is present preferably includes a region having an average thickness of 500 nm and extending from an interface with the metal layer.

Abstract: Electric motor (100) according to the present invention includes stator (40), rotor (10), and a pair of bearings (30). Stator (40) has stator core (41) which is annularly formed. Rotor (10) is located on the inner circumferential side of stator core (41), and includes shaft (12), rotor core (11), and bonded magnets (14). Bonded magnets (14) are filled in magnet holes (13). Bonded magnets (14) are formed with high density portion (14b) having a high density and low density portion (14c) having a density lower than high density portion (14b). In electric motor (100), center position (11b) of rotor core (11) is located on the side where high density portion (14b) is present with respect to center position (41b) of stator core (41) in the direction of shaft center (12a) of shaft (12).

Abstract: A printed circuit board according to an embodiment of the present invention includes a base film having an insulating property, and a conductive pattern formed on at least one of surfaces of the base film, wherein at least a portion of the conductive pattern includes a core body, and a shrink layer formed by plating on an outer surface of the core body. The portion of the conductive pattern preferably has a striped configuration or a spiral configuration. The portion of the conductive pattern preferably has an average circuit gap width of 30 ?m or less. The portion of the conductive pattern preferably has an average aspect ratio of 0.5 or more. The plating is preferably electroplating or electroless plating.