Abstract: A method of forming solder bumps includes preparing a substrate having a surface on which a plurality of electrode pads are formed, forming a resist layer on the substrate, the resist layer having a plurality of openings, each of the openings being aligned with a corresponding electrode pad of the plurality of electrode pads, forming a conductive pillar in each of the openings of the resist layer, forming conductive layers to cover at least side walls of the resist layer in the openings to block gas emanating from the resist layer, filling molten solder in each of the openings in which the conductive layers has been formed and removing the resist layer.

Abstract: The present technology relates to a solid-state imaging device capable of suppressing deterioration in dark characteristics, and an electronic apparatus. The present invention is provided with: a photoelectric conversion section that performs photoelectric conversion; a charge retaining section that temporarily retains electric charge converted by the photoelectric conversion section; and a first trench formed in a semiconductor substrate between the photoelectric conversion section and the charge retaining section, the first trench being higher than the photoelectric conversion section in a depth direction of the semiconductor substrate. Alternatively, the first trench is lower than the photoelectric conversion section and higher than the charge retaining section in the depth direction of the semiconductor substrate. The present technology can be applied to, for example, a back-illuminated CMOS image sensor.

Abstract: A ringing suppressor circuit is connected to a differential signal transmission line that includes a high potential signal line and low potential signal line pair for transmitting high and low level differential signals, and includes a ringing suppressor and a stopper. When the differential signal changes to a high level, the ringing suppressor suppresses ringing by lowering the impedance between the signal lines by turning ON of a switching element. When a differential signal voltage drops below a voltage lowering determination voltage, the stopper stops the impedance lowering function of the ringing suppressor by turning OFF another switching element.

Abstract: A door service hole cover includes a cover component that is configured to cover a service hole, and a shock absorption component that is integral to the cover component. The shock absorption component includes a cabin inner component, at least a portion of which projects from the cover component toward the inside of the cabin and which is hollow and open toward the outside of the cabin; and a fragile portion formed on a side surface of the cabin inner component and configured to allow the cabin inner component to crush and deform upon application of a force acting in the direction of projection of the cabin inner component. Upon application of a force acting in the direction of projection, the cabin inner component crushes inwardly and deforms while being twisted.

Abstract: A sacrificial interposer test structure including a release layer, a dummy layer on the release layer, one or more conductive pads embedded in the dummy layer, wherein each of the one or more conductive pads has an exposed surface, and a tie layer on the dummy layer and on each exposed surface of the one or more conductive pads.

Abstract: A composite material 100 is obtained by laminating and tightly adhering a fabric 60 containing fibers made of spider silk fibroin and a synthetic resin film 50 having a tensile elongation equal to or greater than that of the fabric 60.

Abstract: A battery embedded structure is disclosed. The battery embedded structure comprises a substrate including one or more stacked battery units. Each stacked battery unit includes two or more conductive layers and one or more unit cells. Each unit cell is disposed between two conductive layers. The substrate has a principal surface provided by one or more respective side surfaces of the one or more stacked battery units. The battery embedded structure also comprises a wiring layer disposed on the principal surface of the substrate. The wiring layer includes a plurality of electrical paths and a plurality of vias. Each via is connected with one electrical path. Each via is located at a position corresponding to an edge surface of a conductive layer of the two or more conductive layers of the one or more stacked battery units so as to contact electrically to that conductive layer.

Abstract: A technique for interconnecting chips by using an interconnection substrate is disclosed. The interconnection substrate includes a base substrate, a first group of electrodes on the base substrate for a first chip to be mounted, and a second group of electrodes on the base substrate for a second chip to be mounted. The interconnection substrate further includes an interconnection layer that includes a first set of pads for the first chip, a second set of pads for the second chip, traces and an organic insulating material. The interconnection layer is disposed on the base substrate and located within a defined area on the base substrate between the first group of electrodes and the second group of the electrodes.

Abstract: A differential device includes a plurality of differential gears, one or a plurality of differential gear support members supporting the differential gears respectively, a support part supporting the differential gear support members, a pair of output gears meshing with each of the differential gears, a washer disposed on the output gears, one of cover members covering the back face side of the one of the output gears and has part of a planetary carrier and another cover member covering a back face side of the other output gear, one of the cover members formed on one of the output gears an abutment part that receives the washer, a plurality of through holes provided at intervals in a peripheral direction at positions where at least part thereof overlaps the abutment part, and a plurality of recess parts provided in parts where the through holes and the abutment part intersect.

Abstract: An interconnection layer carrying structure for transferring an interconnection layer onto a substrate is disclosed. The interconnection layer carrying structure includes a support substrate, a release layer on the support substrate; and an interconnection layer on the release layer. The interconnection layer includes an organic insulating material and a set of pads embedded in the organic insulating material. The set of the pads is configured to face towards the support substrate. The support substrate has a base part where the interconnection layer is formed and an extended part extending outside the base part.

Abstract: An electronic control unit coupled to a transmission line of a differential signal includes: a first suppression circuit suppressing a ringing effect and decreasing an impedance of the line for a first time interval when a level of the differential signal changes; a second suppression circuits suppressing a ringing effect and decreasing the impedance of the line for a second time interval when the level of the differential signal changes; and a switching unit isolating the second suppression circuit from the line when the operation power source energizes the electronic control unit, and connecting the second suppression circuit to the line when the operation power source does not energize the electronic control unit.

Abstract: An organic substrate includes a core layer including organic materials; a first buildup layer on a top surface of the core layer; a second buildup layer on a bottom surface of the core layer; and at least one correction layer formed on at least one part of surfaces of the first buildup layer and the second buildup layer, wherein the correction layer has a thickness which has been calculated using properties of constituent materials including the coefficient of thermal expansion (CTE) and the Young's modulus of the core layer, and CTEs and the Young's modulus of the first and the second buildup layers for reducing warpage of the organic substrate.

Abstract: An electronic control unit coupled to a transmission line of a differential signal includes: a first suppression circuit suppressing a ringing effect and decreasing an impedance of the line for a first time interval when a level of the differential signal changes; a second suppression circuits suppressing a ringing effect and decreasing the impedance of the line for a second time interval when the level of the differential signal changes; and a switching unit isolating the second suppression circuit from the line when the operation power source energizes the electronic control unit, and connecting the second suppression circuit to the line when the operation power source does not energize the electronic control unit.

Abstract: A valve device includes: valves configured to control a flow of processing gases supplied to a process vessel; a housing in which first flow paths through which the processing gases flow are formed; a heat diffuser configured to cover the housing and diffuse heat of the housing; a heating part configured to cover the housing covered with the heat diffuser and heat the housing via the heat diffuser; a supply configured to supply a coolant to a second flow path formed between the housing and the heat diffuser; and a controller configure to control the heating part to heat the housing to a first temperature when a predetermined process is performed on a target substrate, and before a start of a cleaning process of the process vessel, control the heating part to stop heating of the housing and control the supply to supply the coolant to the second flow path.

Abstract: A differential device includes a plurality of differential gears, a plurality of differential gear support members respectively supporting the plurality of differential gears, a pair of output gears meshing with each of the plurality of differential gears, a support member having a plurality of opposite ends-supporting parts supporting opposite end parts of the respective differential gear support member, and a space being formed in a middle part of the support member, a recess part being formed between two of the opposite ends-supporting parts of the support member that are adjacent to each other, the recess part extending from an outside in a radial direction of the support member toward an inside in the radial direction, each of the plurality of opposite ends-supporting parts having one support portion supporting at least one end part of the differential gear support member, and a through hole being formed in the one support portion.

Abstract: An inspection apparatus includes an imaging unit that captures an image of a board having a land on which a solder piece has been printed, an image of the board having a component mounted on the solder piece, or an image of the board having the component soldered to the land, a land determination unit that determines a position of an element on the board other than the land from the image of the board captured by the imaging unit, and determines a position of the land in the image based on the determined position of the element, and an inspection unit that inspects the solder piece or component on the land using the position of the land determined by the land determination unit as a reference.

Abstract: An article sorting facility includes a plurality of storage members each configured to store one or more articles, a plurality of article transport vehicles each capable of traveling in at least a portion of a preset travel lane with one or more support members on board, each support member being configured to support one or more articles; a plurality of work areas each configured to allow work to be performed to transfer articles between one or more storage members and at least one of the one or more support members on board an article transport vehicle in the travel lane, wherein each of the work areas is located adjacent to one or more storage members and to the travel lane, wherein the plurality of work areas are arranged one adjacent to another along the travel lane, and wherein two or more article transport vehicles are in the travel lane simultaneously to travel in a line.

Abstract: The present invention relates to a thermoplastic elastomer for carbon fiber reinforced plastic bonding lamination, which is contained in a layer to be laminated on a layer composed of a carbon-fiber reinforced plastic, wherein the thermoplastic elastomer for carbon fiber reinforced plastic bonding lamination contains a styrene-based thermoplastic elastomer and a polymer modified by an ?,?-unsaturated carboxylic acid, the styrene-based thermoplastic elastomer contains components (a) to (d), and a concentration of an ?,?-unsaturated carboxylic acid derived from the polymer modified by the ?,?-unsaturated carboxylic acid is 0.01 to 10% by mass.

Abstract: A technique for interconnecting chips by using an interconnection substrate is disclosed. The interconnection substrate includes a base substrate, a first group of electrodes on the base substrate for a first chip to be mounted, and a second group of electrodes on the base substrate for a second chip to be mounted. The interconnection substrate further includes an interconnection layer that includes a first set of pads for the first chip, a second set of pads for the second chip, traces and an organic insulating material. The interconnection layer is disposed on the base substrate and located within a defined area on the base substrate between the first group of electrodes and the second group of the electrodes.

Abstract: A sliding system includes a pair of sliding members having sliding surfaces that can relatively move while facing each other and a lubricant oil interposed between the sliding surfaces facing each other. At least one of the sliding surfaces includes a coating surface of a crystalline Cr plating film. The lubricant oil contains an oil-soluble molybdenum compound comprising a trinuclear Mo structure. In particular, considerably low friction properties can be developed by a combination of the Cr plating film, in which at least one of three types of peak area intensity ratios (P1 to P3) as obtained by X-ray diffraction falls within a predetermined range (P1?0.015, P2?0.02, P3?0.03), and the lubrication oil which contains the trinuclear Mo structure.