Abstract: A method of fabricating a connection structure is disclosed. The method includes providing a substrate that has a top surface and includes a set of pads for soldering, each of which has a pad surface exposed from the top surface of the substrate. The method also includes applying a surface treatment to a part of the top surface of the substrate close to the pads and the pad surface of each pad so as to make at least the part of the top surface and the pad surfaces of the pads rougher. The surface treatment includes sandblasting.

Abstract: A transparent display device includes a first transparent substrate, light-emitting units arranged on the first transparent substrate, and a wiring unit connected to each of the light-emitting units, wherein each of the light-emitting units includes a light-emitting diode having a surface area of 1 mm2 or less, and wherein a display region includes a heat dissipation promotion unit that promotes heat dissipation in the display region.

Abstract: The present invention includes embodiments of a semiconductor package designed to transfer heat from one or more bridges within the package to ambient external to the package in addition to conducting the heat through any semiconductor chips encapsulated within the package. A laminated substrate has one or more horizontal layer heat conduction paths and one or more vertical substrate heat conduction paths. The vertical substrate heat conduction paths collect heat from one or more of the horizontal layer heat conduction paths, and eventually conduct the heat out of the semiconductor package, e.g. into a lid or heat sink.

Abstract: Embodiments are disclosed for a method for restoring a wearable biological sensor. The method includes determining that a wearable biological marker sensor comprising a reference electrode is placed within a restoration apparatus. The restoration apparatus includes a correct reference electrode, a counter electrode, and a chloride solution. The reference electrode is in electrical contact with the correct reference electrode and the counter electrode through the chloride solution. The method additionally includes determining whether the reference electrode is degraded based on a voltage differential between the reference electrode and the correct reference electrode. The method also includes restoring the reference electrode, if the reference electrode is degraded, by applying a voltage to a circuit. The circuit includes the reference electrode and the counter electrode. Further, multiple chloride ions of the chloride solution bond with a plurality of silver atoms of the reference electrode.

Abstract: There is provided a imaging device including: an N-type region formed for each pixel and configured to perform photoelectric conversion; an inter-pixel light-shielding wall penetrating a semiconductor substrate in a depth direction and formed between N-type regions configured to perform the photoelectric conversion, the N-type regions each being formed for each of pixels adjacent to each other; a P-type layer formed between the N-type region configured to perform the photoelectric conversion and the inter-pixel light-shielding wall; and a P-type region adjacent to the P-type layer and formed between the N-type region and an interface on a side of a light incident surface of the semiconductor substrate.

Abstract: A method of fabricating a connection structure is disclosed. The method includes providing a substrate that has a top surface and includes a set of pads for soldering, each of which has a pad surface exposed from the top surface of the substrate. The method also includes applying a surface treatment to a part of the top surface of the substrate close to the pads and the pad surface of each pad so as to make at least the part of the top surface and the pad surfaces of the pads rougher.

Abstract: An article sorting facility includes a plurality of storage members each configured to store one or more articles, a plurality of article transport vehicles each capable of traveling in at least a portion of a preset travel lane with one or more support members on board, each support member being configured to support one or more articles; a plurality of work areas each configured to allow work to be performed to transfer articles between one or more storage members and at least one of the one or more support members on board an article transport vehicle in the travel lane, wherein each of the work areas is located adjacent to one or more storage members and to the travel lane, wherein the plurality of work areas are arranged one adjacent to another along the travel lane, and wherein two or more article transport vehicles are in the travel lane simultaneously to travel in a line.

Abstract: An article sorting facility includes a plurality of storage members each configured to store one or more articles, a plurality of article transport vehicles each capable of traveling in at least a portion of a preset travel lane with one or more support members on board, each support member being configured to support one or more articles; a plurality of work areas each configured to allow work to be performed to transfer articles between one or more storage members and at least one of the one or more support members on board an article transport vehicle in the travel lane, wherein each of the work areas is located adjacent to one or more storage members and to the travel lane, wherein the plurality of work areas are arranged one adjacent to another along the travel lane, and wherein two or more article transport vehicles are in the travel lane simultaneously to travel in a line.

Abstract: An interconnection structure is disclosed. The interconnection structure includes a base substrate, a set of conductive pads disposed on the base substrate and an interconnection layer disposed on the base substrate. The interconnection layer has an edge located next to the set of the conductive pads and includes a set of side connection pads located and disposed at the edge of the interconnection layer. Each side connection pad is arranged with respect to a corresponding one of the conductive pads disposed on the base substrate.

Abstract: A method of fabricating a connection structure is disclosed. The method includes providing a substrate that has a top surface and includes a set of pads for soldering, each of which has a pad surface exposed from the top surface of the substrate. The method also includes applying a surface treatment to a part of the top surface of the substrate close to the pads and the pad surface of each pad so as to make at least the part of the top surface and the pad surfaces of the pads rougher.

Abstract: A differential device includes a plurality of differential gears, one or a plurality of differential gear support members supporting the differential gears respectively, a support part supporting the differential gear support members, a pair of output gears meshing with each of the differential gears, a washer disposed on the output gears, one of cover members covering the back face side of the one of the output gears and has part of a planetary carrier and another cover member covering a back face side of the other output gear, one of the cover members formed on one of the output gears an abutment part that receives the washer, a plurality of through holes provided at intervals in a peripheral direction at positions where at least part thereof overlaps the abutment part, and a plurality of recess parts provided in parts where the through holes and the abutment part intersect.

Abstract: A differential device includes a plurality of differential gears, a plurality of differential gear support members respectively supporting the plurality of differential gears, a pair of output gears meshing with each of the plurality of differential gears, a support member having a plurality of opposite ends-supporting parts supporting opposite end parts of the respective differential gear support member, and a space being formed in a middle part of the support member, a recess part being formed between two of the opposite ends-supporting parts of the support member that are adjacent to each other, the recess part extending from an outside in a radial direction of the support member toward an inside in the radial direction, each of the plurality of opposite ends-supporting parts having one support portion supporting at least one end part of the differential gear support member, and a through hole being formed in the one support portion.

Abstract: An article sorting facility includes a plurality of storage members each configured to store one or more articles, a plurality of article transport vehicles each capable of traveling in at least a portion of a preset travel lane with one or more support members on board, each support member being configured to support one or more articles; a plurality of work areas each configured to allow work to be performed to transfer articles between one or more storage members and at least one of the one or more support members on board an article transport vehicle in the travel lane, wherein each of the work areas is located adjacent to one or more storage members and to the travel lane, wherein the plurality of work areas are arranged one adjacent to another along the travel lane, and wherein two or more article transport vehicles are in the travel lane simultaneously to travel in a line.

Abstract: A copper alloy includes, by mass %: Mg: 0.15%-0.35%; and P: 0.0005%-0.01%, with a remainder being Cu and unavoidable impurities, wherein [Mg]+20×[P]<0.5 is satisfied. Among the unavoidable impurities, H is 10 mass ppm or less, O is 100 mass ppm or less, S is 50 mass ppm or less, and C is 10 mass ppm or less. In addition, 0.20<(NFJ2/(1?NFJ3))0.5?0.45 is satisfied where a proportion of J3, in which all three grain boundaries constituting a grain boundary triple junction are special grain boundaries, to a total grain boundary triple junctions is NFJ3, and a proportion of J2, in which two grain boundaries constituting a grain boundary triple junction are special grain boundaries and one grain boundary is a random grain boundary, to the total grain boundary triple junctions is NFJ2.

Abstract: A differential device includes a differential gear mechanism having a plurality of differential gears, a plurality of differential gear support bodies supporting the plurality of differential gears, and a pair of output gears meshing with each of the differential gears; and a differential case having a support member having a plurality of opposite ends-supporting parts supporting opposite end parts of each of the differential gear support bodies, a first cover member covering a back face of one of the output gears and capable of being joined to the support member, and a second cover member covering a back face of the other output gear and capable of being joined to the support member, wherein a recess portion facing a back face of each of the differential gears is formed in an outer support part, supporting of the differential gear support body on an outer side of the output gear.

Abstract: An inspection management system that manages inspection of an inspection apparatus in a production line including a manufacturing apparatus of a product and the inspection apparatus includes: an acquisition unit configured to acquire inspection content data including an inspection standard for each component; an inspection content setting unit configured to set inspection content; a setting-related information acquisition unit configured to acquire setting-related information including at least a time at which new inspection content is set when the inspection content setting unit sets the new inspection content; a storage unit configured to retain the setting-related information in association with a history of the setting of the inspection content; a setting-related information reading unit configured to read the setting-related information retained in the storage unit; and an output unit configured to be able to output the setting-related information.

Abstract: A sliding member has a sliding surface sliding under a wet condition in which a lubricant oil exists. The sliding surface is coated with a laminate film comprising an upper layer and a lower layer. The lower layer comprises hydrogen-free amorphous carbon (hydrogen-free DLC) and carbon particles dispersed on or in the hydrogen-free DLC. The hydrogen-free DLC has a hydrogen content of 5 atom % or less when the lower layer as a whole is 100 atom %. The upper layer comprises boron-containing amorphous carbon (B-DLC) and has protrusions on a surface side of the upper layer along the carbon particles of the lower layer. The B-DLC has a boron content of 1-40 atom % when the upper layer as a whole is 100 atom %. The protrusions have a particle diameter of 0.5-5 ?m and exist with a density of 20 protrusions/100 ?m2 or more.

Abstract: A method of forming solder bumps includes preparing a substrate having a surface on which a plurality of electrode pads are formed, forming a resist layer on the substrate, the resist layer having a plurality of openings, each of the openings being aligned with a corresponding electrode pad of the plurality of electrode pads, forming a conductive pillar in each of the openings of the resist layer, forming conductive layers to cover at least side walls of the resist layer in the openings to block gas emanating from the resist layer, filling molten solder in each of the openings in which the conductive layers has been formed and removing the resist layer.

Abstract: A method of forming solder bumps includes preparing a substrate having a surface on which a plurality of electrode pads are formed, forming a resist layer on the substrate, the resist layer having a plurality of openings, each of the openings being aligned with a corresponding electrode pad of the plurality of electrode pads, forming a conductive pillar in each of the openings of the resist layer, forming conductive layers to cover at least side walls of the resist layer in the openings to block gas emanating from the resist layer, filling molten solder in each of the openings in which the conductive layers has been formed and removing the resist layer.

Abstract: A differential device includes a differential gear mechanism having a plurality of differential gears, a plurality of differential gear support bodies supporting the plurality of differential gears, and a pair of output gears meshing with each of the differential gears; and a differential case having a support member having a plurality of opposite ends-supporting parts supporting opposite end parts of each of the differential gear support bodies, a first cover member covering a back face of one of the output gears and capable of being joined to the support member, and a second cover member covering a back face of the other output gear and capable of being joined to the support member, wherein a recess portion facing a back face of each of the differential gears is formed in an outer support part, supporting the differential gear support body on an outer side of the output gear.