Abstract: A combustion ash handling method of handling combustion ash discharged from a combustion furnace that combusts a petroleum-based fuel includes: separating the combustion ash into a heavy component and a light component by a dry-type separation technique; feeding the light component to the combustion furnace as a fuel; and recovering the heavy component. A metal such as vanadium is separated and extracted from the heavy component of the combustion ash.

Abstract: An article sorting facility includes a plurality of storage members each configured to store one or more articles, a plurality of article transport vehicles each capable of traveling in at least a portion of a preset travel lane with one or more support members on board, each support member being configured to support one or more articles; a plurality of work areas each configured to allow work to be performed to transfer articles between one or more storage members and at least one of the one or more support members on board an article transport vehicle in the travel lane, wherein each of the work areas is located adjacent to one or more storage members and to the travel lane, wherein the plurality of work areas are arranged one adjacent to another along the travel lane, and wherein two or more article transport vehicles are in the travel lane simultaneously to travel in a line.

Abstract: To improve adhesion between a plating film reducing contact electrical resistance and a copper alloy plate containing Mg. A copper alloy plate containing Mg of more than 1.2% by mass and 2% by mass or less and the balance Cu and inevitable impurities in a center portion in a plate thickness direction, in the copper alloy plate, a surface Mg concentration at a surface is 30% or less of a center Mg concentration at the center portion in the plate thickness direction, a surface layer portion having a depth from the surface to where a Mg concentration is 90% of the center Mg concentration is provided, and in the surface layer portion, the Mg concentration increases from the surface toward the center portion of the plate thickness direction with a concentration gradient of 0.2% by mass/?m or more and 50% by mass/?m or less.

Abstract: An article sorting facility includes a plurality of storage members each configured to store one or more articles, a plurality of article transport vehicles each capable of traveling in at least a portion of a preset travel lane with one or more support members on board, each support member being configured to support one or more articles; a plurality of work areas each configured to allow work to be performed to transfer articles between one or more storage members and at least one of the one or more support members on board an article transport vehicle in the travel lane, wherein each of the work areas is located adjacent to one or more storage members and to the travel lane, wherein the plurality of work areas are arranged one adjacent to another along the travel lane, and wherein two or more article transport vehicles are in the travel lane simultaneously to travel in a line.

Abstract: A valve device includes: valves configured to control a flow of processing gases supplied to a process vessel; a housing in which first flow paths through which the processing gases flow are formed; a heat diffuser configured to cover the housing and diffuse heat of the housing; a heating part configured to cover the housing covered with the heat diffuser and heat the housing via the heat diffuser; a supply configured to supply a coolant to a second flow path formed between the housing and the heat diffuser; and a controller configure to control the heating part to heat the housing to a first temperature when a predetermined process is performed on a target substrate, and before a start of a cleaning process of the process vessel, control the heating part to stop heating of the housing and control the supply to supply the coolant to the second flow path.

Abstract: In a differential device in which a differential case has a pair of case half bodies that are mutually adjacently disposed in the axial direction, one case half body has a cutout part that extends in the axial direction while having one end opening on a face opposing the other case half body and that enables a shaft portion of a pinion shaft to be inserted thereinto, the other case half body has a support projecting portion that is fitted into the cutout part in the axial direction, and in an assembled state of the differential device in which the pair of case half bodies are joined to each other, the shaft portion of the pinion shaft inserted into the cutout part is held between the cutout part and the support projecting portion, and the pinion shaft is fixed to the differential case. Such differential device has easy assembly.

Abstract: An interconnection structure is disclosed. The interconnection structure includes a base substrate, a set of conductive pads disposed on the base substrate and an interconnection layer disposed on the base substrate. The interconnection layer has an edge located next to the set of the conductive pads and includes a set of side connection pads located and disposed at the edge of the interconnection layer. Each side connection pad is arranged with respect to a corresponding one of the conductive pads disposed on the base substrate.

Abstract: A sensor includes a light emitting element, a photodetector element for receiving light emitted by the light emitting element, and a circuit board having the light emitting element and the photodetector element mounted thereon. A light emitting surface of the light emitting element is facing the circuit board which is provided with a light-transmitting portion for transmitting the light emitted by the light emitting element.

Abstract: This pure copper plate includes Cu having a purity of 99.96 mass % or higher, with a remainder of unavoidable impurities, wherein an amount of P is 2 mass ppm or less, and a total amount of Pb, Se, and Te is 10 mass ppm or less. The amount of S may be in a range of 2 mass ppm or more and 20 mass ppm or less.

Abstract: There is provided a imaging device including: an N-type region formed for each pixel and configured to perform photoelectric conversion; an inter-pixel light-shielding wall penetrating a semiconductor substrate in a depth direction and formed between N-type regions configured to perform the photoelectric conversion, the N-type regions each being formed for each of pixels adjacent to each other; a P-type layer formed between the N-type region configured to perform the photoelectric conversion and the inter-pixel light-shielding wall; and a P-type region adjacent to the P-type layer and formed between the N-type region and an interface on a side of a light incident surface of the semiconductor substrate.

Abstract: A source material container includes a housing, a tray assembly and a plurality of cylindrical members. The housing provides a carrier gas introduction port and an opening through which a gas containing source material vapor is outputted. The tray assembly trays stacked in the housing. The cylindrical members are arranged in a radial direction between the tray assembly and the housing. The outermost cylindrical member provides a slit and each of the other cylindrical members than the outermost cylindrical member provides a plurality of slits. From the introduction port to the gap between the tray assembly and the innermost cylindrical member, the flow path of the carrier gas is branched in a stepwise manner in the height direction.

Abstract: This copper alloy for electronic or electric devices includes: Mg: 0.15 mass % or greater and less than 0.35 mass %; and P: 0.0005 mass % or greater and less than 0.01 mass %, with a remainder being Cu and unavoidable impurities, wherein an amount of Mg [Mg] and an amount of P [P] in terms of mass ratio satisfy [Mg]+20×[P]<0.5, and 0.20<(NFJ2/(1?NFJ3))0.5?0.45 is satisfied in a case where a proportion of J3, in which all three grain boundaries constituting a grain boundary triple junction are special grain boundaries, to total grain boundary triple junctions is represented by NFJ3, and a proportion of J2, in which two grain boundaries constituting a grain boundary triple junction are special grain boundaries and one grain boundary is a random grain boundary, to the total grain boundary triple junctions is represented by NFJ2.

Abstract: In a differential device including a pair of side gears, a plurality of pinion gears and a pinion shaft, the pinion shaft includes a plurality of shaft parts rotatably fitted to and supporting the plurality of pinion gears respectively, and an annular support part linking the plurality of shaft parts to each other, an annular recess portion is formed in an inner peripheral face of the support part, the pinion shaft has an oil guide part that guides lubricating oil within the recess portion to a part where the shaft part and the pinion gear are fitted together, and an inner end portion of at least one of the side gears protrudes into an inner space of the support part and is positioned within a width of the recess portion in an axial direction of the rotating shaft.

Abstract: There is provided a imaging device including: an N-type region formed for each pixel and configured to perform photoelectric conversion; an inter-pixel light-shielding wall penetrating a semiconductor substrate in a depth direction and formed between N-type regions configured to perform the photoelectric conversion, the N-type regions each being formed for each of pixels adjacent to each other; a P-type layer formed between the N-type region configured to perform the photoelectric conversion and the inter-pixel light-shielding wall; and a P-type region adjacent to the P-type layer and formed between the N-type region and an interface on a side of a light incident surface of the semiconductor substrate.

Abstract: An interconnection layer carrying structure for transferring an interconnection layer onto a substrate is disclosed. The interconnection layer carrying structure includes a support substrate, a release layer on the support substrate; and an interconnection layer on the release layer. The interconnection layer includes an organic insulating material and a set of pads embedded in the organic insulating material. The set of the pads is configured to face towards the support substrate. The support substrate has a base part where the interconnection layer is formed and an extended part extending outside the base part.

Abstract: An inspection management system having a plurality of processes and managing final inspection performed to inspect a completed product and one or more intermediate inspections performed to inspect an intermediate product manufactured in the processes earlier than a final process includes: an inspection content data acquisition unit that acquires inspection content data including an inspection standard for each inspection item of the product; an inspection content setting unit that sets inspection content based on the inspection content data acquired by the inspection content data acquisition unit; a simulation unit that simulates inspection in accordance with assumed inspection content; an inspection standard calculation unit that calculates an inspection standard more appropriate than a current inspection standard based on the simulation; and an output unit that outputs base information indicating that at least the inspection standard calculated by the inspection standard calculation unit is more appropriate

Abstract: An interconnection layer carrying structure for transferring an interconnection layer onto a substrate is disclosed. The interconnection layer carrying structure includes a support substrate, a release layer on the support substrate; and an interconnection layer on the release layer. The interconnection layer includes an organic insulating material and a set of pads embedded in the organic insulating material. The set of the pads is configured to face towards the support substrate. The support substrate has a base part where the interconnection layer is formed and an extended part extending outside the base part.

Abstract: A copper alloy includes, by mass %: Mg: 0.15%-0.35%; and P: 0.0005%-0.01%, with a remainder being Cu and unavoidable impurities, wherein [Mg]+20×[P]<0.5 is satisfied. Among the unavoidable impurities, H is 10 mass ppm or less, O is 100 mass ppm or less, S is 50 mass ppm or less, and C is 10 mass ppm or less. In addition, 0.20<(NFJ2/(1?NFJ3))0.5?0.45 is satisfied where a proportion of J3, in which all three grain boundaries constituting a grain boundary triple junction are special grain boundaries, to a total grain boundary triple junctions is NFJ3, and a proportion of J2, in which two grain boundaries constituting a grain boundary triple junction are special grain boundaries and one grain boundary is a random grain boundary, to the total grain boundary triple junctions is NFJ2.

Abstract: A door service hole cover includes a cover component that is configured to cover a service hole, and a shock absorption component that is integral to the cover component. The shock absorption component includes a cabin inner component, at least a portion of which projects from the cover component toward the inside of the cabin and which is hollow and open toward the outside of the cabin; and a fragile portion formed on a side surface of the cabin inner component and configured to allow the cabin inner component to crush and deform upon application of a force acting in the direction of projection of the cabin inner component. Upon application of a force acting in the direction of projection, the cabin inner component crushes inwardly and deforms while being twisted.

Abstract: The present invention includes embodiments of a semiconductor package designed to transfer heat from one or more bridges within the package to ambient external to the package in addition to conducting the heat through any semiconductor chips encapsulated within the package. A laminated substrate has one or more horizontal layer heat conduction paths and one or more vertical substrate heat conduction paths. The vertical substrate heat conduction paths collect heat from one or more of the horizontal layer heat conduction paths, and eventually conduct the heat out of the semiconductor package, e.g. into a lid or heat sink.