Patents by Inventor Hiroyuki Nakamura

Hiroyuki Nakamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230396233
    Abstract: In some embodiments, a surface acoustic wave device can include a piezoelectric substrate and an interdigital transducer electrode implemented on a surface of the piezoelectric substrate, such that the surface acoustic device supports a surface acoustic wave having a wavelength ? and a phase velocity less than 3,000 m/s with an electromechanical coupling coefficient of at least 9.0. In some embodiments, the phase velocity less than 2,000 m/s, and the surface acoustic wave can include a lowest asymmetry (A0) mode. In some embodiments, such a surface acoustic wave device can be implemented in products such as a radio-frequency filter, a radio-frequency module and a wireless device.
    Type: Application
    Filed: May 30, 2023
    Publication date: December 7, 2023
    Inventors: Hiroyuki NAKAMURA, Rei GOTO, Keiichi MAKI, Michio KADOTA, Shuji TANAKA
  • Patent number: 11824515
    Abstract: An acoustic wave device that includes a spinel layer, a piezoelectric layer and an interdigital transducer electrode on the piezoelectric layer is disclosed. The piezoelectric layer is disposed between the interdigital transducer electrode and the spinel layer. The acoustic wave device is configured to generate an acoustic wave having a wavelength of ?. The piezoelectric layer can have a thickness than is less than ?. In some embodiments, the acoustic wave device can include a temperature compensating layer that is disposed between the piezoelectric layer and the spinel layer.
    Type: Grant
    Filed: December 29, 2021
    Date of Patent: November 21, 2023
    Assignee: Skyworks Solutions, Inc.
    Inventors: Gong Bin Tang, Rei Goto, Hiroyuki Nakamura, Keiichi Maki
  • Patent number: 11820536
    Abstract: A projection unit (12) of an interference power estimation device (1) projects an orbit of a satellite onto a map representing a ground surface. A range acquisition unit (13) determines a plurality of ranges on the map so that the projected orbit is included in the ranges. An altitude calculation unit (14) calculates an altitude of the orbit of the satellite in each of the ranges. A range interference calculation unit (16) calculates, for each of the ranges, an interference power between the satellite at a position determined by a latitude and a longitude of the range and the altitude calculated for the range and a radio station installed on the ground surface. An estimation result calculation unit (17) selects, as an estimation result, a maximum value among the interference powers calculated for each of the ranges.
    Type: Grant
    Filed: September 2, 2019
    Date of Patent: November 21, 2023
    Assignee: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Hideyuki Tsuboi, Yutaka Imaizumi, Kazuto Goto, Kota Ito, Naoki Kita, Hiroyuki Nakamura
  • Patent number: 11813880
    Abstract: A liquid ejection apparatus includes a liquid ejection head that is detachably attached and ejects a liquid, and a control section that is configured to transmit a delivery request for a new liquid ejection head to a server apparatus via a network.
    Type: Grant
    Filed: December 28, 2022
    Date of Patent: November 14, 2023
    Assignee: Seiko Epson Corporation
    Inventors: Hiroyuki Nakamura, Izumi Nozawa, Yuta Komatsu
  • Patent number: 11812292
    Abstract: There are provided an information collecting device configured to collect a frame A transmitted and received between a wireless LAN base station that is an evaluation target and a wireless LAN terminal subordinate to the wireless LAN base station that is the evaluation target and a frame B transmitted and received between a wireless LAN base station that is a non-evaluation target and a wireless LAN terminal subordinate to the wireless LAN base station that is the non-evaluation target, and extract radio information on communication quality of each of the wireless LAN base stations from a header of a corresponding one of the frames A and B, and a wireless LAN communication quality estimation device configured to acquire, from the wireless LAN base station that is the evaluation target, information on the number of currently connected wireless LAN terminals, acquire, from the information collecting device, the radio information on the communication quality of each of the wireless LAN base stations, and analyze
    Type: Grant
    Filed: October 18, 2019
    Date of Patent: November 7, 2023
    Assignee: Nippon Telegraph and Telephone Corporation
    Inventors: Masayoshi Nabeshima, Shinya Otsuki, Tomoaki Ogawa, Hiroshi Sakamoto, Makoto Umeuchi, Junichi Iwatani, Hiroyuki Nakamura
  • Publication number: 20230339720
    Abstract: Provided is a reel member and an adhesive film winding body capable of suppressing sticking and blocking and preventing falling off. A real member includes: a winding core 3 around which an adhesive film 2 is to be wound; a pair of reel flanges 4 provided on both sides of the winding core 3; and a plurality of ribs 5 formed on an inner surface 4a of the reel flange 4, protruding from the inner surface 4a, and extending from the center side to the peripheral edge side of the reel flange 4, wherein in the rib 5, a rib top width W1 in contact with the adhesive film 2 is narrower than a rib base width W2 in contact with the inner surface 4a in cross-sectional view.
    Type: Application
    Filed: November 18, 2020
    Publication date: October 26, 2023
    Applicant: DEXERIALS CORPORATION
    Inventors: Kazunori HAMAZAKI, Hiroyuki NAKAMURA, Tomohisa KAWAI
  • Publication number: 20230345182
    Abstract: An integrated device package is disclosed. The integrated device package can include a printed circuit board and a microelectronicmechanical systems die that is at least partially disposed within the printed circuit board and electrically coupled to the printed circuit board. The integrated device package can include a filler material that is at least partially disposed between the microelectronicmechanical systems die and the printed circuit board. The integrated device package can include a lid that is coupled to the printed circuit board. The lid and the microelectronicmechanical systems die are spaced by a gap defining a back volume.
    Type: Application
    Filed: March 27, 2023
    Publication date: October 26, 2023
    Inventors: Takanori Yasuda, Siarhei Dmitrievich Barsukou, Keiichi Maki, Hiroyuki Nakamura
  • Publication number: 20230343659
    Abstract: An integrated device package is disclosed. The integrated device package can include a carrier that has an opening extending at least partially through a thickness of the carrier. The integrated device package can include a microelectronicmechanical systems die that is at least partially disposed in the opening and mechanically and electrically coupled to the carrier. The integrated device package can include a lid that is coupled to the carrier. The lid and the microelectronicmechanical systems die are spaced by a gap defining a back volume.
    Type: Application
    Filed: March 27, 2023
    Publication date: October 26, 2023
    Inventors: Takanori Yasuda, Siarhei Dmitrievich Barsukou, Keiichi Maki, Hiroyuki Nakamura
  • Publication number: 20230345648
    Abstract: An integrated device package is disclosed. The integrated device package can include a carrier that has a multilayer structure having a first layer and a second layer. The first layer at least partially defines a lower side of the carrier. An electrical resistance of the second layer is greater than an electrical resistance of the first layer. The integrated device package can include a microelectronicmechanical systems die that is mounted on an upper side of the carrier opposite the lower side. The integrated device package can include a lid that is coupled to the carrier. The lid and the microelectronicmechanical systems die are spaced by a gap defining a back volume.
    Type: Application
    Filed: March 27, 2023
    Publication date: October 26, 2023
    Inventors: Takanori Yasuda, Siarhei Dmitrievich Barsukou, Keiichi Maki, Hiroyuki Nakamura
  • Publication number: 20230331730
    Abstract: A crystal of 7-((3R,5S)-1-acryloyl-5-methylpyrrolidin-3-yl)-4-amino-6-(cyclopropylethynyl)-N-((R)-1-phenylethyl)-7H-pyrrolo[2,3-d]pyrimidine-5-carboxamide (compound (I)), and a crystal thereof with an acid (salt crystal or co-crystal) are provided. There are provided: a type II crystal of compound (I) with fumaric acid, having characteristic peaks at three or more diffraction angles (2? ± 0.2 °) selected from 5.5°, 6.8°, 9.3°, 13.4°, 15.3°, 16.3°, 18.5°, 19.8°, 22.0°, and 24.5° in a powder X-ray diffraction spectrum; a (free-form) type II crystal of compound (I) having characteristic peaks at three or more diffraction angles selected from 8.3°, 14.8°, 17.3°, 18.0°, 19.1°, 20.3°, 21.0°, 22.5°, 23.0°, and 26.2° in a powder X-ray diffraction spectrum; a (free-form) type I crystal of compound (I) having characteristic peaks at three or more diffraction angles selected from 9.9°, 11.7°, 13.2°, 17.7°, 18.1°, 18.8°, and 20.
    Type: Application
    Filed: July 14, 2021
    Publication date: October 19, 2023
    Applicant: TAIHO PHARMACEUTICAL CO., LTD.
    Inventors: Hiroyuki NAKAMURA, Hiroyoshi YAMANAKA, Takahiro ASAI
  • Publication number: 20230336159
    Abstract: A surface acoustic wave (SAW) filter package comprises a substrate, one or more trenches formed in the substrate, a SAW filter formed in each trench of the one or more trenches, and a cavity forming layer extending horizontally across the substrate and each trench.
    Type: Application
    Filed: April 7, 2023
    Publication date: October 19, 2023
    Applicant: SKYWORKS SOLUTIONS, INC.
    Inventors: Yuya Hiramatsu, Hiroyuki Nakamura, Keiichi Maki, Kyohei Kobayashi
  • Publication number: 20230331087
    Abstract: Information related to a vehicle can be displayed by projecting an image based on the information on a road surface or the like. An image projection apparatus that projects an image includes: an acquisition unit that acquires information to be displayed; and an image projection unit that projects the image based on the information to be displayed acquired by the acquisition unit.
    Type: Application
    Filed: June 23, 2023
    Publication date: October 19, 2023
    Inventors: Yasuhiko KUNII, Nobuyuki KAKU, Toshinori SUGIYAMA, Hiroyuki NAKAMURA, Hiroshi CHIBA, Masahiro KISHIGAMI, Hiroyuki KAJIKAWA, Chohei ONO, Megumi KURACHI, Noriaki HARADA
  • Publication number: 20230311740
    Abstract: Based on information about a vehicle, the information can be projected and displayed onto a road surface or the like. An image projection apparatus, which projects an image, includes an acquisition unit that acquires the information about the vehicle, and an image projection unit that projects the image based on the information acquired by the acquisition unit.
    Type: Application
    Filed: June 1, 2023
    Publication date: October 5, 2023
    Inventors: Yasuhiko KUNII, Nobuyuki KAKU, Masahiro KISHIGAMI, Hiroyuki NAKAMURA, Megumi KURACHI, Takuya SHIMIZU
  • Publication number: 20230308081
    Abstract: Aspects of this disclosure relate to a surface acoustic wave device. The surface acoustic wave device includes a piezoelectric layer and an interdigital transducer. The interdigital transducer electrode includes a pair of electrodes, each electrode having a bus bar and fingers extending from the bus bar. The interdigital transducer electrode has an interdigital region defined by a portion of the fingers of the electrodes that interdigitate with each other. A dielectric layer is disposed over the interdigital transducer electrode outside the interdigital region and configured to reduce a loss of the surface acoustic wave device.
    Type: Application
    Filed: February 23, 2023
    Publication date: September 28, 2023
    Inventors: Gong Bin Tang, Rei Goto, Hiroyuki Nakamura
  • Publication number: 20230296450
    Abstract: Provided are a temperature sensor that performs high-speed sensing, whose cost is low, and whose layout is freely designed, the temperature sensor eliminating the need for complicated operations, and a method for manufacturing the temperature sensor. In a temperature sensor 1, terminal portions 9 of a connector portion 7 are exposed to an outside of a pipe section 2, a connector-side embedded portion 8 of the connector portion 7 is embedded in an embedding portion 4 of a side wall portion 3, an exposed portion 12 of a housing portion 11 is disposed in the pipe section 2, and an embedded base 13 of the housing portion 11 is embedded in the embedding portion 4. The housing portion 11 is made of a metal.
    Type: Application
    Filed: August 25, 2021
    Publication date: September 21, 2023
    Applicants: NIFCO INC., SEMITEC Corporation
    Inventors: Hiroyuki NAKAMURA, Takuhiko NAKAJIMA, Satoshi IKEYA
  • Patent number: 11752870
    Abstract: Information related to a vehicle can be displayed by projecting an image based on the information on a road surface or the like. An image projection apparatus that projects an image includes: an acquisition unit that acquires information to be displayed; and an image projection unit that projects the image based on the information to be displayed acquired by the acquisition unit.
    Type: Grant
    Filed: January 3, 2022
    Date of Patent: September 12, 2023
    Assignee: MAXELL, LTD.
    Inventors: Yasuhiko Kunii, Nobuyuki Kaku, Toshinori Sugiyama, Hiroyuki Nakamura, Hiroshi Chiba, Masahiro Kishigami, Hiroyuki Kajikawa, Chohei Ono, Megumi Kurachi, Noriaki Harada
  • Publication number: 20230283255
    Abstract: Aspects of this disclosure relate to acoustic wave devices on stacked die. A first die can include first acoustic wave device configured to generate a boundary acoustic wave. A second die can include a second acoustic wave device configured to generate a second boundary acoustic wave, in which the second die is stacked with the first die. The first acoustic wave resonator can include a piezoelectric layer, an interdigital transducer electrode on the piezoelectric layer, and high acoustic velocity layers on opposing sides of the piezoelectric layer. The high acoustic velocity layers can each have an acoustic velocity that is greater than a velocity of the boundary acoustic wave.
    Type: Application
    Filed: February 24, 2023
    Publication date: September 7, 2023
    Inventors: Hiroyuki Nakamura, Rei Goto, Keiichi Maki
  • Patent number: 11750174
    Abstract: Multiplexers are disclosed. A multiplexer can include a first filter and a second filter that are coupled to a common node. The second filter can include a first type of acoustic wave resonators (e.g., bulk acoustic wave resonators) and a series acoustic wave resonator of a second type (e.g., a surface acoustic wave resonator) that is coupled between the acoustic wave resonators of the first type and the common node. The first filter can provide a single-ended radio frequency signal. In certain embodiments, the first filter can be a receive filter and the second filter can be a transmit filter.
    Type: Grant
    Filed: June 30, 2021
    Date of Patent: September 5, 2023
    Assignee: Skyworks Solutions, Inc.
    Inventors: Yoshiaki Ando, Yasuyuki Saito, Hiroyuki Nakamura
  • Publication number: 20230271421
    Abstract: A liquid discharge apparatus includes a liquid discharge head configured to discharge liquid. The liquid discharge apparatus includes a reservoir configured to store liquid to be supplied to the liquid discharge head. The reservoir is provided at a position lower than the liquid discharge head. The liquid discharge apparatus includes a supply flow path configured to communicate with the liquid discharge head and the reservoir. The supply flow path is provided with a joint detachable from the liquid discharge head. The liquid discharge apparatus includes a retainer configured to retain the joint detached from the liquid discharge head. The joint has a coupler to be coupled to the liquid discharge head. The retainer is configured to retain the joint with the coupler facing up.
    Type: Application
    Filed: February 23, 2023
    Publication date: August 31, 2023
    Inventors: Hiroyuki NAKAMURA, Satoshi INOMATA, Akihiro TOYA
  • Publication number: 20230256746
    Abstract: A liquid ejecting apparatus includes a transport unit that transports a medium along a transport path, a liquid ejecting head that performs recording on the transported medium by ejecting liquid from a nozzle formed at a nozzle surface, a mounting portion on which a liquid storage portion for storing the liquid supplied to the liquid ejecting head is mounted, and a first discharge port that delivers the medium on which the recording is performed toward a media processing apparatus that performs processing on the medium, in which the mounting portion is disposed at a position higher than the nozzle surface, and a first transport path which is a portion of the transport path from a position corresponding to the liquid ejecting head to the first discharge port passes above the mounting portion.
    Type: Application
    Filed: April 26, 2023
    Publication date: August 17, 2023
    Inventors: Hiroyuki NAKAMURA, Izumi NOZAWA