Abstract: Sapphire substrates are used chiefly for epitaxial growth of nitride semiconductor layers, to provide a sapphire substrate of which the shape and/or amount of warping can be controlled efficiently and precisely and of which substrate warping that occurs during layer formation can be suppressed and substrate warping behavior can be minimized, to provide nitride semiconductor layer growth bodies, nitride semiconductor devices, and nitride semiconductor bulk substrates using such substrates, and to provide a method of manufacturing these products. Reformed domain patterns are formed within a sapphire substrate and the warp shape and/or amount of warping of the sapphire substrate are controlled by means of multiphoton absorption by condensing and scanning a pulsed laser through a polished surface of the sapphire substrate.

Abstract: A laser processing machine having a laser beam irradiation unit is provided. The laser beam irradiation unit includes: a laser beam oscillation section; a beam splitter adapted to split the laser beam emitted from the laser beam oscillation section into a first laser beam and a second laser beam; a condenser lens adapted to condense the first and second laser beams; a prism adapted to lead the first and second laser beams split by the beam splitter to the condenser lens; a first angle-changing mirror disposed on a first optical path adapted to lead the first laser beam split by the beam splitter; a second angle-changing mirror disposed on a second optical path adapted to lead the second laser beam split by the beam splitter to the prism; and a half-wave plate disposed in the first or second optical path to allow one of respective directions of the first and second polarization planes to be aligned with the other.

Abstract: A method of dividing an optical device wafer includes: a laser beam processing step of performing laser beam processing on the face side of an optical device wafer so as to form breakage starting points along streets; a protective plate bonding step of bonding the face side of the optical device wafer to a surface of a highly rigid protective plate with a bonding agent permitting peeling; a back side grinding step of grinding the back side of the optical device wafer so as to form the optical device wafer to a finished thickness of optical devices; a dicing tape adhering step of adhering the back-side surface of the optical device wafer to a dicing tape; a cut groove forming step of cutting the protective plate bonded to the optical device wafer along the streets so as to form cut grooves; and a wafer dividing step of exerting an external force on the optical device wafer through the protective plate, so as to break up the optical device wafer along the breakage starting points formed along the streets, there

Abstract: An in-vehicle display device mounted on a vehicle includes: an application execution element for executing an application program; a display element for displaying an image according to a image display instruction input from the application execution element when the application execution element executes the application program; a determination element for determining whether a predetermined certification information is attached to the application program; and a change instruction input element for inputting a change instruction into the display element when the determination element determines that the predetermined certification information is not attached to the application program. The change instruction is one of an extension instruction and a size reduction instruction and the extension instruction provides to extend an update interval of the image, and the size reduction instruction provides to reduce a display region of the image.

Abstract: An image processing apparatus comprises: a reception unit adapted to receive image data transmitted from a host computer; first and second communication units adapted to communicate with a second image processing apparatus different from the image processing apparatus; a determination unit adapted to determine a type of image data; and a decision unit adapted to decide, on the basis of determination by the determination unit, whether to use the first communication unit or the second communication unit to transfer the image data.

Abstract: A vehicle wiper apparatus for wiping a windshield glass with a wiper blade includes drive means for reciprocating the wiper blade in an arcuate wiping area, and a first washer fluid spray means, provided on the drive means, for spraying a washer fluid. The first washer fluid spray means sprays the washer fluid onto a area in an upward wiping direction of the wiper blade when the wiper blade is located near its stop position, and sprays the washer fluid onto a area in a downward wiping direction of the wiper blade when the wiper blade is located near its inversion position.

Abstract: A method of dividing an optical device wafer includes: a laser beam processing step of performing laser beam processing to provide an optical device wafer with breakage starting points along streets on the face side of the optical device wafer; a protective plate bonding step of bonding the face side of the optical device wafer to a surface of a highly rigid protective plate with a bonding agent permitting peeling; a back side grinding step of grinding the back side of the optical device wafer so as to form the optical device wafer to a finished thickness of the optical devices; a wafer supporting step of adhering the back-side surface of the optical device wafer to a surface of a dicing tape, and peeling the protective plate adhered to the face side of the optical device wafer; and a wafer dividing step of exerting an external force on the optical device wafer so as to break up the optical device wafer along the streets along which the breakage starting points have been formed, thereby dividing the optical d

Abstract: A light emitting device including a sapphire layer and a light emitting layer formed on the sapphire layer. The sapphire layer has a polygonal sectional shape whose internal angle is an obtuse angle, such as a regular hexagonal shape. Light emitted from the light emitting layer is totally reflected on one side surface of the sapphire layer and next transmitted through another side surface of the sapphire layer.

Abstract: A program generation program used in a personal computer processes information on relationship between an action and a pair of a state of a system and an event to create a program for incorporating a new state in a state transition table. The computer reads the state transition table in a storage medium and selects the state specified in the state transition table. The computer generates a program that determines whether the selected state is an exceptional state or a normal state on the basis of state information in the state transition table. Based on the result of the determination, the program performs an action including a state transition or a process allocated to the exceptional state specified in the state transition table when the state is the exceptional.

Abstract: A dividing method for an optical device wafer includes a protective plate adhering step of releasably adhering the surface of an optical device wafer to the surface of a protective plate, a reverse face grinding step of grinding the reverse face of the optical device wafer, a dicing tape sticking step of sticking the reverse face of the optical device wafer on the surface of a dicing tape, a protective plate grinding step of grinding the reverse face of the protective plate adhered to the optical device wafer stuck on the dicing tape so as to have a predetermined thickness, a laser working step of irradiating a laser beam upon the protective plate along the streets formed on the optical device wafer to carry out laser working, which forms break starting points along the streets, for the protective plate, and a wafer dividing step of applying external force to the protective plate to break the protective plate along the break starting points to break the optical device wafer along the streets thereby to divide

Abstract: A controller which exits between a client apparatus and an image processing apparatus and which controls access from the client apparatus such that the client apparatus can use a network server function of the image processing apparatus, its control method and control program and storage medium. To accomplish this, the controller which exists between a client terminal and an image processing apparatus and which controls data transmitted from the client terminal to the image processing apparatus comprises information providing unit which provides setup information of the controller to the client terminal and transfer unit which transfers setup information of the image processing apparatus to the client terminal.

Abstract: A dividing method for an optical device wafer includes a protective plate adhering step of releasably adhering the surface of an optical device wafer to the surface of a protective plate, a reverse face grinding step of grinding the reverse face of the optical device wafer, a dicing tape sticking step of sticking the reverse face of the optical device wafer on the surface of a dicing tape, a protective plate grinding step of grinding the reverse face of the protective plate adhered to the optical device wafer stuck on the dicing tape so as to have a predetermined thickness, a laser working step of irradiating a laser beam upon the protective plate along the streets formed on the optical device wafer to carry out laser working, which forms break starting points along the streets, for the protective plate, and a wafer dividing step of applying external force to the protective plate to break the protective plate along the break starting points to break the optical device wafer along the streets thereby to divide

Abstract: A method of dividing an optical device wafer includes: a laser beam processing step of performing laser beam processing on the face side of an optical device wafer so as to form breakage starting points along streets; a protective plate bonding step of bonding the face side of the optical device wafer to a surface of a highly rigid protective plate with a bonding agent permitting peeling; a back side grinding step of grinding the back side of the optical device wafer so as to form the optical device wafer to a finished thickness of optical devices; a dicing tape adhering step of adhering the back-side surface of the optical device wafer to a dicing tape; a cut groove forming step of cutting the protective plate bonded to the optical device wafer along the streets so as to form cut grooves; and a wafer dividing step of exerting an external force on the optical device wafer through the protective plate, so as to break up the optical device wafer along the breakage starting points formed along the streets, there

Abstract: An optical device wafer dividing method includes a rear surface grinding step for grinding a rear surface of the optical device wafer; a dicing tape sticking step for sticking the front surface of the optical device wafer bonded with the reinforcing substrate to the front surface of a dicing tape; a laser processing step for emitting a laser beam along the streets formed on the optical device wafer from the rear surface of the reinforcing substrate to perform laser processing on the reinforcing substrate along the streets to form fracture starting points; and a wafer dividing step for applying an external force along the fracture starting points of the reinforcing substrate to fracture the reinforcing substrate along the fracture starting points to fracture the optical device wafer along the streets.

Abstract: A method of dividing an optical device wafer includes: a laser beam processing step of performing laser beam processing to provide an optical device wafer with breakage starting points along streets on the face side of the optical device wafer; a protective plate bonding step of bonding the face side of the optical device wafer to a surface of a highly rigid protective plate with a bonding agent permitting peeling; a back side grinding step of grinding the back side of the optical device wafer so as to form the optical device wafer to a finished thickness of the optical devices; a wafer supporting step of adhering the back-side surface of the optical device wafer to a surface of a dicing tape, and peeling the protective plate adhered to the face side of the optical device wafer; and a wafer dividing step of exerting an external force on the optical device wafer so as to break up the optical device wafer along the streets along which the breakage starting points have been formed, thereby dividing the optical d

Abstract: An optical device wafer dividing method includes a rear surface grinding step for grinding a rear surface of the optical device wafer; a dicing tape sticking step for sticking the front surface of the optical device wafer bonded with the reinforcing substrate to the front surface of a dicing tape; a laser processing step for emitting a laser beam along the streets formed on the optical device wafer from the rear surface of the reinforcing substrate to perform laser processing on the reinforcing substrate along the streets to form fracture starting points; and a wafer dividing step for applying an external force along the fracture starting points of the reinforcing substrate to fracture the reinforcing substrate along the fracture starting points to fracture the optical device wafer along the streets.

Abstract: The present invention aims to effectively perform image data transfer between an image generation controller and an image processing controller in either of color image printing and black-and-white image printing. Respective signal lines of Y, M, C and K are provided in a video interface formed between a PDL controller and the image processing controller. When the color image is printed by a printer of one-drum structure, data of a one color for four lines are simultaneously transferred by using the four signal lines, and this transfer operation is repeated for one page and for the four colors. When the black-and-white image is printed, black data for the four lines are simultaneously transferred by using the four signal lines, and this transfer operation is repeated for one page.

Abstract: A laser processing machine having a laser beam irradiation unit is provided. The laser beam irradiation unit includes: a laser beam oscillation section; a beam splitter adapted to split the laser beam emitted from the laser beam oscillation section into a first laser beam and a second laser beam; a condenser lens adapted to condense the first and second laser beams; a prism adapted to lead the first and second laser beams split by the beam splitter to the condenser lens; a first angle-changing mirror disposed on a first optical path adapted to lead the first laser beam split by the beam splitter; a second angle-changing mirror disposed on a second optical path adapted to lead the second laser beam split by the beam splitter to the prism; and a half-wave plate disposed in the first or second optical path to allow one of respective directions of the first and second polarization planes to be aligned with the other.

Abstract: A controller which exits between a client apparatus and an image processing apparatus and which controls access from the client apparatus such that the client apparatus can use a network server function of the image processing apparatus, its control method and control program and storage medium. To accomplish this, the controller which exists between a client terminal and an image processing apparatus and which controls data transmitted from the client terminal to the image processing apparatus comprises information providing unit which provides setup information of the controller to the client terminal and transfer unit which transfers setup information of the image processing apparatus to the client terminal.

Abstract: A controller which exists between a client apparatus and an image processing apparatus and which controls access from the client apparatus such that the client apparatus can use a network server function of the image processing apparatus, its control method and control program and storage medium. To accomplish this, the controller which exists between a client terminal and an image processing apparatus and which controls data transmitted from the client terminal to the image processing apparatus comprises an information providing unit which provides setup information of the controller to the client terminal and a transfer unit which transfers setup information of the image processing apparatus to the client terminal.