Patents by Inventor Hitoshi Hoshino

Hitoshi Hoshino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LSI package and internal connecting method used therefor
    Publication number: 20010050426
    Abstract: The present invention is provides an LSI package without employing steps for forming solder bumps on a bare chip and soldering to an interposer. In the present invention, a bare chip is mounted on the LSI package by forming wiring patterns which connect to bare chip I/O terminals in a build-up layer of a substrate. Furthermore, the wiring patterns are formed so as to connect outer I/O terminals on the substrate.
    Type: Application
    Filed: March 14, 2001
    Publication date: December 13, 2001
    Inventors: Hitoshi Hoshino, Tomiji Sato, Atsushi Taga
  • Hand-held mobile phone terminal
    Patent number: 6061579
    Abstract: A hand-held satellite mobile phone terminal contains an antenna deployment element with a small antenna attached to the tip area of the antenna deployment element The antenna deployment element is usually folded and stored on the rear side surface of the body of the hand-held satellite mobile phone terminal, and is deployed to become vertical to the rear side surface of the hand-held satellite mobile phone terminal body when it is used. The antenna deployment element is attached to the body of the hand-held satellite mobile phone terminal through a rotational axis so that the small antenna attached to the antenna deployment element can be rotated after deployment in order for its plane to become parallel with the ground surface. Also, the hand-held satellite mobile phone terminal is usable both in a satellite communication system and in a terrestrial cellular communication system.
    Type: Grant
    Filed: June 24, 1997
    Date of Patent: May 9, 2000
    Assignee: Advanced Space Communications Research Laboratory
    Inventors: Hiroyuki Arai, Hitoshi Hoshino, Yuichi Otsu, Takashi Miyoshi
  • Method of manufacturing a semiconductor device
    Patent number: 5242838
    Abstract: A semiconductor chip 4 is fixed to an island portion 16 of a lead frame, an electrode pad 22 of the semiconductor chip and the inner end portion of an external lead 18 of the lead frame are connected with an electrically conductive thin wire 24 and the semiconductor chip 4 is sealed with plastic together with the island portion 16 and the inner end portion of the external lead 18. The external lead 18 is cut off and isolated from the frame portion 12 and, with the island portion 16 retained by the frame portion 12 via a connecting portion 14, the external lead 18 is made to contact a measuring terminal 10 of the testing machine to carry out the electrical characteristic test of the semiconductor chip 4. Thereafter, the connecting portion 14 is cut off to remove the frame portion 12. After the removal, or simultaneously with that, the external lead 18 may be formed.
    Type: Grant
    Filed: July 20, 1992
    Date of Patent: September 7, 1993
    Assignee: NEC Corporation
    Inventor: Hitoshi Hoshino
  • Dry etching of metal film
    Patent number: 4350563
    Abstract: A process for dry etching an aluminum film or an aluminum based film in the production of a semiconductor device, wherein a mixed gas of carbon chloride and boron chloride is used as the etchant gas.
    Type: Grant
    Filed: July 31, 1980
    Date of Patent: September 21, 1982
    Assignee: Fujitsu Limited
    Inventors: Tadakazu Takada, Kazuo Tokitomo, Hitoshi Hoshino