Abstract: A method of carrying out the laser processing of a wafer with a laser beam processing machine comprising a chuck table for holding a wafer, a laser beam application means for applying a laser beam to the wafer held on the chuck table and a processing-feed means for processing-feeding the chuck table and the laser beam application means relative to each other, comprising the steps of a wafer affixing step for putting the wafer on the surface of a protective tape mounted on an annular frame, a wafer holding step for holding the wafer put on the protective tape on the chuck table, and a laser beam application step for applying a laser beam having a predetermined wavelength from the laser beam application means to the wafer held on the chuck table and processing-feeding the wafer with the processing-feed means, wherein the protective tape is made of a material which transmits the laser beam having a predetermined wavelength applied from the laser beam application means.

Abstract: A workpiece dividing method comprising applying a laser beam from one surface side of a workpiece permeable to the laser beam. The laser beam applied from the one surface side of the workpiece is focused onto the other surface of the workpiece or its vicinity to deteriorate a region ranging from the other surface of the workpiece to a predetermined depth. The deterioration of the workpiece is substantially melting and resolidification.

Abstract: To provide a method of processing a sapphire substrate, where reduction in luminance of light emitting devices can be suppressed if a sapphire substrate is divided into individual light emitting devices by irradiation of a laser beam, a pulsed laser beam having a small pulse energy of 0.6 ?J to 10 ?J, and an extremely small pulse width in a range of femto-second is irradiated to the sapphire substrate while a condensing point is positioned within each of regions corresponding to predetermined division lines on the sapphire substrate so that affected zones are formed, thereby the laser beam can be irradiated even at a high peak power density of 4×1013 W/cm2 to 5×1015 W/cm2, consequently each of the affected zones can be formed at only a desired condensing point within the sapphire substrate, and necessary processing can be performed while damage to nitride semiconductors or the sapphire substrate is minimized.

Abstract: A controller which exists between a client apparatus and an image processing apparatus and which controls access from the client apparatus such that the client apparatus can use a network server function of the image processing apparatus, its control method and control program and storage medium. To accomplish this, the controller which exists between a client terminal and an image processing apparatus and which controls data transmitted from the client terminal to the image processing apparatus comprises an information providing unit which provides setup information of the controller to the client terminal and a transfer unit which transfers setup information of the image processing apparatus to the client terminal.

Abstract: A vehicle wiper apparatus for wiping a windshield glass with a wiper blade includes drive means for reciprocating the wiper blade in an arcuate wiping area, and a first washer fluid spray means, provided on the drive means, for spraying a washer fluid. The first washer fluid spray means sprays the washer fluid onto a area in an upward wiping direction of the wiper blade when the wiper blade is located near its stop position, and sprays the washer fluid onto a area in a downward wiping direction of the wiper blade when the wiper blade is located near its inversion position.

Abstract: A wafer laser processing method for forming a groove by applying a pulse laser beam to the back surface of a wafer comprising light emitting elements which are formed in a plurality of areas sectioned by a plurality of dividing lines on the front surface of a sapphire substrate, along the dividing lines, wherein an energy density of a focal spot of the pulse laser beam is set to 1 J/cm2 or more.

Abstract: A wafer processing method for dividing a wafer having optical devices that are formed in a plurality of areas sectioned by dividing lines formed in a lattice pattern on the front surface, along the dividing lines, which comprises a laser beam application step of applying a laser beam to the wafer along the dividing lines from the side of the back surface thereof to form grooves having a predetermined depth in the back surface; a protective sheet affixing step of affixing a protective sheet to the front surface of the wafer having the grooves in the back surface; a dividing step of dividing the wafer having the protective sheet affixed to the front surface along the grooves; and a grinding step of grinding the back surface of the wafer divided along the grooves in a state of the protective sheet being affixed to the wafer, to remove the grooves.

Abstract: A method of laser processing a gallium nitride substrate, for forming a dividing groove along dividing lines that section devices formed on a gallium nitride substrate, the method comprising the step of applying a pulse laser beam having a wavelength of 200 to 365 nm along the dividing lines that section the devices formed on the gallium nitride substrate.

Abstract: A method of carrying out the laser processing of a wafer with a laser beam processing machine comprising a chuck table for holding a wafer, a laser beam application means for applying a laser beam to the wafer held on the chuck table and a processing-feed means for processing-feeding the chuck table and the laser beam application means relative to each other, comprising the steps of a wafer affixing step for putting the wafer on the surface of a protective tape mounted on an annular frame, a wafer holding step for holding the wafer put on the protective tape on the chuck table, and a laser beam application step for applying a laser beam having a predetermined wavelength from the laser beam application means to the wafer held on the chuck table and processing-feeding the wafer with the processing-feed means, wherein the protective tape is made of a material which transmits the laser beam having a predetermined wavelength applied from the laser beam application means.

Abstract: A laser processing method for forming a laser groove along dividing lines by applying a pulse laser beam along the dividing lines formed on a workpiece, the method comprising the steps of forming the focusing spot of the pulse laser beam in a shape of oval, positioning the long axis of the oval focusing spot along each of the dividing lines, and moving the focusing spot and the workpiece along the dividing line relative to each other.

Abstract: A program generation program used in a personal computer processes information on relationship between an action and a pair of a state of a system and an event to create a program for incorporating a new state in a state transition table. The computer reads the state transition table in a storage medium and selects the state specified in the state transition table. The computer generates a program that determines whether the selected state is an exceptional state or a normal state on the basis of state information in the state transition table. Based on the result of the determination, the program performs an action including a state transition or a process allocated to the exceptional state specified in the state transition table when the state is the exceptional.

Abstract: A semiconductor wafer processing method for dividing a semiconductor wafer comprising semiconductor chips, which are composed of a laminate consisting of an insulating film and a functional film laminated on the front surface of a semiconductor substrate and are sectioned by streets, into individual semiconductor chips by cutting the wafer with a cutting blade along the streets, the method comprising a laser groove forming step for forming laser grooves which reach the semiconductor substrate by applying a pulse laser beam to the streets of the semiconductor wafer; and a cutting step for cutting the semiconductor substrate with the cutting blade along the laser grooves formed in the streets of the semiconductor wafer, wherein in the laser groove forming step, spots of the pulse laser beam applied to the streets are shaped into rectangular spots by a mask member and the processing conditions are set to satisfy L>(V/Y) (in which Y (Hz) is a repetition-frequency of the pulse laser beam, V (mm/sec) is a proces

Abstract: A wafer processing method for dividing a wafer having optical devices that are formed in a plurality of areas sectioned by dividing lines formed in a lattice pattern on the front surface, along the dividing lines, which comprises a laser beam application step of applying a laser beam to the wafer along the dividing lines from the side of back surface thereof to form grooves having a predetermined depth in the back surface; a protective sheet affixing step of affixing a protective sheet to the front surface of the wafer having the grooves in the back surface; a dividing step of dividing the wafer having the protective sheet affixed to the front surface along the grooves; and a grinding step of grinding the back surface of the wafer divided along the grooves in a state of the protective sheet being affixed to the wafer, to remove the grooves.

Abstract: An image processing apparatus comprises: a reception unit adapted to receive image data transmitted from a host computer; first and second communication units adapted to communicate with a second image processing apparatus different from the image processing apparatus; a determination unit adapted to determine a type of image data; and a decision unit adapted to decide, on the basis of determination by the determination unit, whether to use the first communication unit or the second communication unit to transfer the image data.

Abstract: A workpiece dividing method comprising applying a laser beam from one surface side of a workpiece permeable to the laser beam. The laser beam applied from the one surface side of the workpiece is focused onto the other surface of the workpiece or its vicinity to deteriorate a region ranging from the other surface of the workpiece to a predetermined depth. The deterioration of the workpiece is substantially melting and resolidification.

Abstract: The present invention aims to effectively perform image data transfer between an image generation controller and an image processing controller in either of color image printing and black-and-white image printing. Respective signal lines of Y, M, C and K are provided in a video interface formed between a PDL controller and the image processing controller. When the color image is printed by a printer of one-drum structure, data of a one color for four lines are simultaneously transferred by using the four signal lines, and this transfer operation is repeated for one page and for the four colors. When the black-and-white image is printed, black data for the four lines are simultaneously transferred by using the four signal lines, and this transfer operation is repeated for one page.

Abstract: The present invention is provides an LSI package without employing steps for forming solder bumps on a bare chip and soldering to an interposer. In the present invention, a bare chip is mounted on the LSI package by forming wiring patterns which connect to bare chip I/O terminals in a build-up layer of a substrate. Furthermore, the wiring patterns are formed so as to connect outer I/O terminals on the substrate.

Abstract: The present invention is provides an LSI package without employing steps for forming solder bumps on a bare chip and soldering to an interposer. In the present invention, a bare chip is mounted on the LSI package by forming wiring patterns which connect to bare chip I/O terminals in a build-up layer of a substrate. Furthermore, the wiring patterns are formed so as to connect outer I/O terminals on the substrate.

Abstract: A controller which exits between a client apparatus and an image processing apparatus and which controls access from the client apparatus such that the client apparatus can use a network server function of the image processing apparatus, its control method and control program and storage medium. To accomplish this, the controller which exists between a client terminal and an image processing apparatus and which controls data transmitted from the client terminal to the image processing apparatus comprises information providing unit which provides setup information of the controller to the client terminal and transfer unit which transfers setup information of the image processing apparatus to the client terminal.

Abstract: The present invention is provides an LSI package without employing steps for forming solder bumps on a bare chip and soldering to an interposer. In the present invention, a bare chip is mounted on the LSI package by forming wiring patterns which connect to bare chip I/O terminals in a build-up layer of a substrate. Furthermore, the wiring patterns are formed so as to connect outer I/O terminals on the substrate.