Abstract: Provided are semiconductor devices and methods of manufacturing the same. the device may include a semiconductor substrate, a first conductive pattern provided in the semiconductor substrate to have a first width at a surface level of the semiconductor substrate, a barrier pattern covering the first conductive pattern and having a second width substantially greater than the first width, a second conductive pattern partially covering the barrier pattern and having a third width substantially smaller than the second width, and an insulating pattern disposed on a sidewall of the second conductive pattern. The second width may be substantially equal to or less than to a sum of the third width and a width of the insulating pattern.

Abstract: A semiconductor device and a method of fabricating a semiconductor device. The semiconductor device includes an interlayer insulation layer pattern, a metal wire pattern exposed by a passage formed by a via hole formed in the interlayer insulation layer pattern to input and output an electrical signal, and a plated layer pattern directly contacting the metal wire pattern and filling the via hole. The method includes forming an interlayer insulation layer having a metal wire pattern to input and output an electrical signal formed therein, forming a via hole to define a passage that extends through the interlayer insulation layer until at least a part of the metal wire pattern is exposed, and forming a plated layer pattern to fill the via hole and to directly contact the metal wire pattern by using the metal wire pattern exposed through the via hole as a seed metal layer.

Abstract: The present invention relates to a graft copolymer including a polysaccharide as a main chain and a phosphorylcholine analogous group-containing monomer as a side chain, and a composition for skin and hair care including the copolymer as an active ingredient. The graft copolymer according to the present invention exhibits more improved moisturizing capacity and better biocompatibility than the existing polysaccharide-based graft copolymer by introducing a phosphorylcholine analogous group-containing compound, and accordingly, the composition for hair and skin care including the same also has improved moisturizing capacity, protection capacity of damaged hair, skin affinity, a skin barrier function, and the like.

Abstract: Provided are a satellite VSAT apparatus and a control method thereof. The satellite VSAT apparatus according to an exemplary embodiment of the present invention can switch a modulation type of a signal to be transmitted from an indoor unit (IDU) to the outdoor unit to a linear or non-linear type in a case in which outputting of a transmitted signal is not controlled to an outdoor unit due to limitations, that is, there is no function such as an automatic signal level control in a block up-converter (BUC), a case in which transmission output limitation is large due to a lot of interference requirements for an adjacent channel, a case in which the number of adjacent channels (carriers) is large, or a case in which adjacent channel interference is large due to a frequency in a satellite multi-beam environment and polarization reuse, in a satellite VSAT apparatus system which aims at a low-priced user terminal.

Abstract: Provided is a method of establishing an uplink in a mobile satellite communication system, the method including: receiving a random uplink access signal from terminals included in a coverage of a satellite beam; estimating a location of each of the terminals; calculating an uplink transmission point in time when each of the terminals transmits an uplink signal, based on the estimated location of each of the terminals; transmitting, to each of the terminals, the calculated uplink transmission point in time; and receiving the uplink signal from each of the terminals at the calculated uplink transmission point in time.

Abstract: In one embodiment, the method includes forming a conductive via structure in a base layer. The base layer has a first surface and a second surface, and the second surface is opposite the first surface. The method further includes removing the second surface of the base layer to expose the conductive via structure such that the conductive via structure protrudes from the second surface, and forming a first lower insulating layer over the second surface such that an end surface of the conductive via structure remains exposed by the first lower insulating layer.

Abstract: A method of routing a wireless network is provided. The method is performed by each of a group of nodes and includes: receiving a routing request signal; determining whether a node itself is a destination node, by referring to a traffic distribution table showing traffic throughput of the group of nodes and an intermediate-node weight table showing weights of intermediate nodes on all paths between the group of nodes and a source node, wherein a route path is selected by referring to the weights of intermediate nodes; and when it is determined that the node itself is the destination node transmitting a routing response signal to the source node that has transmitted the routing request signal, and receiving a packet from the source node, wherein the transmitting and receiving are performed by the determined destination node. By using the method, traffic in wireless network extreme communications can be distributed at intermediate nodes as well as at destination nodes.

Abstract: A semiconductor device including a lower layer, an insulating layer on a first side of the lower layer, an interconnection structure in the insulating layer, a via structure in the lower layer. The via structure protrudes into the insulating layer and the interconnection structure.

Abstract: Provided is a semiconductor device. The semiconductor device may include a substrate and a stacked insulation layer on a sidewall of an opening which penetrates the substrate. The stacked insulation layer can include at least one first insulation layer and at least one second insulation layer whose dielectric constant is different than that of the first insulation layer. One insulation layer may be a polymer and one insulation layer may be a silicon based insulation layer. The insulation layers may be uniform in thickness or may vary as a distance from the substrate changes.

Abstract: A method of manufacturing a semiconductor device includes forming an integrated circuit region on a semiconductor wafer. A first metal layer pattern is formed over the integrated circuit region. A via hole is formed to extend through the first metal layer pattern and the integrated circuit region. A final metal layer pattern is formed over the first metal layer pattern and within the via hole. A plug is formed within the via hole. Thereafter, a passivation layer is formed to overlie the final metal layer pattern.

Abstract: An automatic white balance adjusting apparatus and method based on detection of an effective area. The automatic white balance adjusting apparatus may detect the effective area by using a color temperature, a luminance, and a correlation, and may adjust a white balance with respect to the detected effective area.

Abstract: The present invention relates to a method of seamlessly providing a satellite multimedia Internet service to a fixed subscriber belonging to a lower user network even in a satellite shadow environment and shortening a hand-over processing time between heterogeneous networks by applying a fast layer 3 hand-over technology between satellite and wireless networks in a mobile satellite terminal device.

Abstract: Provided are semiconductor devices and methods of manufacturing the same. the device may include a semiconductor substrate, a first conductive pattern provided in the semiconductor substrate to have a first width at a surface level of the semiconductor substrate, a barrier pattern covering the first conductive pattern and having a second width substantially greater than the first width, a second conductive pattern partially covering the barrier pattern and having a third width substantially smaller than the second width, and an insulating pattern disposed on a sidewall of the second conductive pattern. The second width may be substantially equal to or less than to a sum of the third width and a width of the insulating pattern.

Abstract: Provided is an image interpolation method and apparatus using a reference block depending on a direction. The image interpolation method may generate a horizontal reference block and a vertical reference block each with respect to an inputted image, and determine interpolation directivity with respect to the inputted image using the generated horizontal reference block and vertical reference block, thereby performing an interpolation on an image based on accurate interpolation directivity. In particular, the image interpolation method may determine whether to verify interpolation directivity depending on an edge intensity of an inputted image, thereby performing a color filter array (CFA) interpolation on an image based on an edge direction without determining the interpolation directivity, when the edge intensity is strong.

Abstract: The present invention relates to an apparatus and method of providing a content push service, a mobile terminal, and a method of operating a mobile terminal. According to an exemplary embodiment of the present invention, a user datagram protocol (UDP) port is set between the mobile terminal and a content push service providing server. In addition, the mobile terminal drives an application that receives the content push service through the set user datagram protocol (UDP) port, by the request of the content push service providing server. The mobile terminal receives the content push service from the content push service providing server through the driven application. Accordingly, it is not necessary to select a specific identifier for each of existing applications and recognize a specific identifier for each node of the mobile communication network.

Abstract: In a semiconductor device package having a stress relief spacer, and a manufacturing method thereof, metal interconnect fingers extend from the body of a chip provide for chip interconnection. The metal fingers are isolated from the body of the chip by a stress-relief spacer. In one example, such isolation takes the form of an air gap. In another example, such isolation takes the form of an elastomer material. In either case, mismatch in coefficient of thermal expansion between the metal interconnect fingers and the body of the chip is avoided, alleviating the problems associated with cracking and delamination, and leading to improved device yield and device reliability.

Abstract: A system for controlling temperature of an antenna module including a heat generating module, and a radome and an underbody cover that enclose the heat generating module. The system includes: a heat collecting unit mounted on inner surface of the antenna module; a heat discharging unit mounted on outer surface of the antenna module; and a heat transfer unit for transferring heat from the heat collecting unit to the heat discharging unit.

Abstract: The present invention separates inputted triple play IP data into Internet and TV data and voice (VoIP) data, encodes the Internet and TV data permitting a long delay time according to the existing DVB-S2 standard, and encodes the voice data permitting only a short delay time according to a DVB-RCS+M standard based 4K mode. Each encoded data is subjected to the orthogonal modulation and the orthogonally modulated voice data is subjected to a direct sequence spectrum spread according to a spreading factor. The spread spectrum signal is multiplexed in a SCPC frequency division multiple access (FDMA) scheme so as to overlap with frequencies allocated to each user.

Abstract: Disclosed is a phase error estimating an apparatus and a method which provides improved convergence speed and tracking speed even in mobile channel environment by variably applying the step size for phase error estimation according to channel status. The apparatus for estimating a phase error includes: a posterior probability (APP) average calculating unit for calculating an APP average value from a soft decision result of a currently received symbol; a step size determining unit for determining a step size variably according to channel status; and a phase error estimating unit for estimating a phase error of the currently received symbol from a phase error of a previously received symbol and the APP average value by using the variably determined step size.

Abstract: A semiconductor chip, a method of fabricating the same, and a stack module and a memory card including the semiconductor chip include a first surface and a second surface facing the first surface is provided. At least one via hole including a first portion extending in a direction from the first surface of the substrate to the second surface of the substrate and a second portion that is connected to the first portion and has a tapered shape. At least one via electrode filling the at least one via hole is provided.