Abstract: A cleaning fixture assembly for protecting an electrostatic chuck suitable for supporting semiconductor substrates during a cleaning process contains a plate configured to align with and engage a backside of the electrostatic chuck, the plate having an annular seal portion surrounding a pocket. The cleaning fixture assembly also contains a first O-ring engaging the annular seal portion of the plate, a plurality of through-holes in the pocket of the plate, and a plurality of O-rings surrounding the plurality of through-holes in the pocket of the plate. The plurality of through-holes are configured to be aligned with and in fluid communication with lift pin holes and helium holes in the backside of the electrostatic chuck, and the plurality of O-rings are positioned to allow cleaning media to engage the lift pin holes and helium holes in the electrostatic chuck during a cleaning process while sealing the cleaning media from reaching the backside of the electrostatic chuck.

Abstract: The invention discloses a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a recess is formed in the device carrier and a conductive element is disposed on the substrate, wherein the substrate is disposed on the device carrier and the conductive element is located in the recess of the device carrier. The conductive pattern in the substrate is electrically connected to the device carrier and I/O terminals of the first conductive element. The invention also discloses a method for manufacturing a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a portion of the conductive pattern in the substrate can be modified.

Abstract: A method for providing a part with a plasma resistant ceramic coating for use in a plasma processing chamber is provided. A patterned mask is placed on the part. A film is deposited over the part. The patterned mask is removed. A plasma resistant ceramic coating is applied on the part.

Abstract: A multi-antenna system uses non-radiation coupling edges to achieve isolation. A first radiation antenna, a second radiation antenna and at least one isolator are disposed on the surface of a substrate, wherein each of the first radiation antenna and the second radiation has a resonance radiating portion, a feeding portion, and at least one non-radiation coupling edge. The isolator is disposed between the first and second radiating antennas, extending from the non-radiation coupling edge of the first radiating antenna to that of the second radiating antenna. By disposing the isolator beside the non-radiation coupling edges, the near field coupling energy between the first and second radiating antennas is cancelled out, thereby improving the isolation of the antenna. By changing the length of the isolator, the resonant frequency of the system can be adjusted.

Abstract: A method for providing a logic synthesis of a pipeline circuit is disclosed. The method includes: providing a circuit design of the pipeline circuit, wherein the circuit design includes a first logic module as a current stage, and based on an operation of the first logic module, generating a first time marked graph (TMG) that corresponds to a plurality of behavioral phases of the first logic module, wherein the first TMG includes a plurality of vertexes and a plurality of edges, wherein each vertex corresponds to one of the plurality of behavioral phases that occur in sequence and each edge is coupled between two respective vertexes thereby corresponding to a transition from one behavioral phase to another subsequently occurring behavioral phase.

Abstract: An apparatus for conditioning a component of a processing chamber is provided. A tank for holding a megasonic conditioning solution is provided. A mount holds the component immersed in a megasonic conditioning solution, when the tank is filled with the megasonic conditioning solution. A megasonic conditioning solution inlet system delivers the megasonic conditioning solution to the tank. A megasonic transducer head comprises at least one megasonic transducer to provide megasonic energy to the megasonic conditioning solution, wherein the megasonic energy is delivered to the component via the megasonic conditioning solution. A megasonic conditioning solution drain system drains the megasonic conditioning solution from the tank at a location above where the component is held in the megasonic conditioning solution. An actuator moves the megasonic transducer head across the tank.

Abstract: A method for coating a part body for use in a plasma processing chamber is provided. The part body is received into a chamber. At least part of a surface of the part body is coated by physical vapor deposition or chemical vapor deposition with a coating with a thickness of no more than 30 microns consisting essentially of a Lanthanide series or Group III or Group IV element in an oxyfluoride.

Abstract: A fluid handling component for a vacuum chamber of a semiconductor substrate processing apparatus is provided. The fluid handling component comprises interior fluid wetted surfaces and an atomic layer deposition (ALD) or molecular layer deposition (MLD) barrier coating on the interior fluid wetted surfaces wherein the fluid wetted surfaces which include the ALD or MLD barrier coating are configured to be contacted by a process gas and/or fluid during a semiconductor substrate processing process wherein the ALD or MLD barrier coating protects the underlying fluid wetted surfaces from erosion and/or corrosion.

Abstract: A method for conditioning and cleaning a silicon part is provided. The silicon part is heated to a temperature of at least 300° C. in the presence of oxygen to form an outer surface of the silicon part into silicon oxide. The silicon part is placed in a wet bath wherein the bath is a solution that selectively etches silicon oxide with respect to silicon.

Abstract: The present disclosure provides a projection system and a light screen generating device thereof. The light screen generating device includes a movable carrier module, a first light-emitting module, and a second light-emitting module. The first light-emitting module includes a plurality of first light-emitting structures disposed on the movable carrier module. Each of the first light-emitting structures generates an invisible light screen, and the invisible light screens respectively generated by the first light-emitting structures are mated with each other to form a spliced invisible light screen for increasing light emission uniformity. The second light-emitting module includes a second light-emitting structure that is disposed on the movable carrier module and that generates a visible light screen parallel to and overlapping the spliced invisible light screen.

Abstract: An optical touch control system and an optical sensor thereof are provided. The optical sensor can be applied to a display having a display surface. The optical sensor includes a connecting frame, a light curtain module and a light emitter. The connecting frame has a first end portion and a second end portion opposite the first end portion. The light curtain module is disposed between the first end portion and the second end portion of the connecting frame. The light curtain module includes a light emitter electrically connected to the display so as to generate an invisible light curtain parallel to the display surface. The optical detection module is disposed on the second end portion of the connecting frame. The optical detection module includes a light detector electrically connected to the display so as to retrieve information about a touch location where an object touches the invisible light curtain.

Abstract: An interactive display system includes an input device and an image interaction module. The input device has a touch portion including a built-in first light-emitting module and a built-in second light-emitting module. The image interaction module includes a display module, a first image-capturing module, a second image-capturing module and a processing module. The processing module captures invisible light generated by the first light-emitting module through the first image-capturing module, for determining and obtaining the position of the touch portion. The processing module captures visible light generated by the second light-emitting module through the second image-capturing module according to the position of the touch portion, for determining and obtaining a predetermined color light source provided by the visible light generated by the second light-emitting module.

Abstract: A method for conditioning and cleaning a silicon part is provided. The silicon part is heated to a temperature of at least 300° C. in the presence of oxygen to form an outer surface of the silicon part into silicon oxide. The silicon part is placed in a wet bath wherein the bath is a solution that selectively etches silicon oxide with respect to silicon.

Abstract: A coating system for forming an atomic layer deposition (ALD) or a molecular layer deposition (MLD) barrier coating on interior fluid wetted surfaces of a fluid handling component for a vacuum chamber of a semiconductor substrate processing apparatus. The coating system includes the fluid handling component, wherein the interior fluid wetted surfaces define a process region of the coating system, a gas supply system in fluid communication with the process region of the component wherein the gas supply system supplies process gases to the process region of the component through the inlet port thereof such that an ALD or MLD barrier coating can be formed on the fluid wetted surfaces of the fluid handling component, and an exhaust system in fluid communication with the process region of the component wherein the exhaust system exhausts the process gases from the process region of the component through the outlet port thereof.

Abstract: The present disclosure provides a projection system and a light screen generating device thereof. The light screen generating device includes a movable carrier module, a first light-emitting module, and a second light-emitting module. The first light-emitting module includes a plurality of first light-emitting structures disposed on the movable carrier module. Each of the first light-emitting structures generates an invisible light screen, and the invisible light screens respectively generated by the first light-emitting structures are mated with each other to form a spliced invisible light screen for increasing light emission uniformity. The second light-emitting module includes a second light-emitting structure that is disposed on the movable carrier module and that generates a visible light screen parallel to and overlapping the spliced invisible light screen.

Abstract: A method for providing a logic synthesis of a pipeline circuit is disclosed. The method includes: providing a circuit design of the pipeline circuit, wherein the circuit design includes a first logic module as a current stage, and based on an operation of the first logic module, generating a first time marked graph (TMG) that corresponds to a plurality of behavioral phases of the first logic module, wherein the first TMG includes a plurality of vertexes and edges, wherein each vertex corresponds to one of the plurality of behavioral phases that occur in sequence and each edge is coupled between two respective vertexes thereby corresponding to a transition from one behavioral phase to another subsequently occurring behavioral phase.

Abstract: In one embodiment, a dual phase cleaning chamber may include a turbulent mixing chamber, a fluid diffuser, an isostatic pressure chamber and a rupture mitigating nozzle. The turbulent mixing chamber may be in fluid communication with a first fluid inlet and a second fluid inlet. The fluid diffuser may be in fluid communication with the turbulent mixing chamber. The rupture mitigating nozzle may include a first fluid collecting offset, a second fluid collecting offset, and a displacement damping projection. The displacement damping projection may be disposed between the first and second fluid collecting offset and may be offset away from each of the first fluid collecting offset and the second fluid collecting offset, and towards the fluid diffuser. A pressurized cleaning fluid introduced from the first fluid inlet, the second fluid inlet, or both flows through the outlet passage of the first and second fluid collecting offset.

Abstract: A method for conditioning a ceramic layer with a thickness of less than 150 ?m over a substrate is provided. The ceramic layer is cleaned. A region of the ceramic layer is scanned with a pulsed excimer laser beam at a repetition rate of 3-300 Hz.

Abstract: A dielectric window cleaning apparatus may be used for cleaning a dielectric window of a plasma processing device. The dielectric window cleaning apparatus may comprise a window support base, a fluid containing enclosure, a window rotating mechanism, a spray arm, and multiple fluid spraying nozzles. The fluid containing enclosure may include at least one overflow containment sidewall and may be located at least partially under and at least partially around a portion of the window support base. The window rotating mechanism may be operatively connected to the window support base and may rotate the window support base. The spray arm may be in fluid communication with a fluid source and may include a fluid flow channel. The multiple fluid spraying nozzles may each expel fluid from the fluid flow channel in a window cleansing spray.

Abstract: The invention discloses a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a recess is formed in the device carrier and a conductive element is disposed on the substrate, wherein the substrate is disposed on the device carrier and the conductive element is located in the recess of the device carrier. The conductive pattern in the substrate is electrically connected to the device carrier and I/O terminals of the first conductive element. The invention also discloses a method for manufacturing a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a portion of the conductive pattern in the substrate can be modified.