Patents by Inventor Hong Liao

Hong Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160211187
    Abstract: A semiconductor monitoring device includes a substrate, a die seal ring formed on the substrate, a deep n-typed well formed in the substrate under the die seal ring, and a monitoring device electrically connected to the die seal ring. The monitoring device is formed in a scribe line region defined on the substrate. A width of the deep n-typed well is larger than a width of the die seal ring.
    Type: Application
    Filed: January 16, 2015
    Publication date: July 21, 2016
    Inventors: Xing Hua Zhang, Chi-Fa Ku, Hong Liao, Ye Chao Li, Hui Yang
  • Patent number: 9331200
    Abstract: A method for fabricating semiconductor device is disclosed. The method includes the steps of: providing a substrate having a gate structure thereon; and forming a first epitaxial layer, a second epitaxial layer, and a silicide layer in the substrate adjacent to the gate structure. Preferably, the first epitaxial layer, the second epitaxial layer, and the silicide layer comprise SiGeSn.
    Type: Grant
    Filed: January 6, 2015
    Date of Patent: May 3, 2016
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Lanxiang Wang, Hong Liao, Chao Jiang, Duan Quan Liao, Ye Chao Li
  • Publication number: 20160093687
    Abstract: The present invention provides a method for fabricating a capacitor structure, including the steps of: providing a substrate; forming a first conductive structure and a dielectric structure over the substrate, wherein the first conductive structure is enclosed by the dielectric structure; forming a first trench in the dielectric structure, so that a first surface of the first conductive structure is exposed through the first trench; forming a first capacitor electrode and a capacitor dielectric layer on a bottom and a sidewall of the first trench and on a top surface of the dielectric structure, so that the first capacitor electrode is electrically contacted with the first surface of the first conductive structure; and removing the first capacitor electrode and the capacitor dielectric layer on the top surface of the dielectric structure; forming a second capacitor electrode on a surface of the capacitor dielectric layer. A capacitor structure is also provided.
    Type: Application
    Filed: December 10, 2015
    Publication date: March 31, 2016
    Inventors: Chien-Li Kuo, Kuei-Sheng WU, Ju-Bao ZHANG, Rui-Huang CHENG, Xing-Hua ZHANG, Hong LIAO
  • Patent number: 9209344
    Abstract: The present invention provides a method of forming a doping region. A substrate is provided, and a poly-silicon layer is formed on the substrate. A silicon oxide layer is formed on the poly-silicon layer. An implant process is performed to form a doping region in the poly-silicon layer. The present invention further provides a method for forming a MOS.
    Type: Grant
    Filed: October 8, 2012
    Date of Patent: December 8, 2015
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Hao Su, Hang Hu, Hong Liao
  • Publication number: 20150321399
    Abstract: A component for manufacturing an apparel accessory or a fastening element is formed of a molten thermoplastic polymer and an additive distributed into the molten thermoplastic polymer. A method of manufacturing said apparel accessory or said fastening element made of said component includes a step of fixedly molding the component of the present invention to a base of an accessory. A molded product made of said component is well decorative and highly durable.
    Type: Application
    Filed: July 22, 2014
    Publication date: November 12, 2015
    Inventors: Chia-Wei HONG, Chia-Hong LIAO
  • Publication number: 20150303120
    Abstract: A method for fabricating semiconductor package structure is disclosed. The method includes: providing a wafer having a front side and a backside; forming a plurality of through-silicon vias (TSVs) in the wafer and a plurality of metal interconnections on the TSVs, in which the metal interconnections are exposed from the front side of the wafer; performing a monitoring step to screen for TSV failures from the backside of the wafer; and bonding the wafer to a substrate.
    Type: Application
    Filed: April 20, 2014
    Publication date: October 22, 2015
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Jubao Zhang, Xing Hua Zhang, Hong Liao
  • Patent number: 9130292
    Abstract: A card connector includes an insulating body and electrical terminals of which each has a fastening portion molded in the insulating body, an elastic arm extending outward and rearward from an external end of the fastening portion and inclined upward during extending, and a soldering portion formed from the other end of the fastening portion. The distal end of the elastic arm further extends and then is bent downward to from a protecting arm. A notching is opened in the elastic arm and extends to the protecting arm. An inner edge of the notching slantwise extends upward and towards the protecting arm and then is arched upward to form a contact arm of which the arch peak rises above the bend peak of the protecting arm. The distal edge of the contact arm protrudes towards two sides to form a pair of blocking ears blocked under the protecting arm.
    Type: Grant
    Filed: June 5, 2014
    Date of Patent: September 8, 2015
    Assignee: CHENG UEI PRECISION INDUSTRY CO., LTD.
    Inventors: Bao-Geng Xie, Wei-Hong Liao, Yin-Lung Wu
  • Patent number: 9102826
    Abstract: Embodiments include a curable composition comprising an epoxy resin, a non-halogen flame retardant agent comprising at least two of an aryl-cyanato group and at least two of a phosphorus group, and a styrene and maleic anhydride copolymer. Embodiments include method of preparing the curable composition, prepregs that include a reinforcement component and the curable composition, and an electrical laminate formed with the curable composition.
    Type: Grant
    Filed: June 30, 2011
    Date of Patent: August 11, 2015
    Assignee: Blue Cube IP LLC
    Inventors: Hongyu Chen, Annie Gui Hong Liao
  • Patent number: 9097980
    Abstract: A transmission box using AMHS for transferring reticle pod is provided, wherein an OHT (Overhead Hoist Transfer) system is disposed on the transmission box to perform mechanical transferring of the reticle pod for greatly reducing risks of damaging reticles caused by operators when transferring, streamlining the allocation of operators, and thus decreasing the time needed for process to complete.
    Type: Grant
    Filed: September 30, 2011
    Date of Patent: August 4, 2015
    Assignee: GUDENG PRECISION INDUSTRIAL CO, Ltd.
    Inventors: Chen-Wei Ku, Pao-Yi Lu, Kun-Hong Liao, Jain-Ping Sheng
  • Patent number: 9093850
    Abstract: A charging dock adapted for charging a hand-held device includes a pedestal defining an opening, an electrical connector, a fastening plate slantwise disposed to a rear of the electrical connector, a plurality of first elastic elements restrained between the pedestal and the insulating housing, a metal braking piece disposed to a bottom of the pedestal, and a plurality of second elastic elements respectively restrained between button caps and the pedestal. The electrical connector is telescopically and slantwise disposed to the bottom of the pedestal and partially projects in or out of the opening. The hand-held device is capable of pressing on or being apart away from the button caps to make the button caps stretch out or draw back to drive the attaching portions to be attached to or apart away from the magnetic elements under the elasticity function of the second elastic elements.
    Type: Grant
    Filed: June 20, 2013
    Date of Patent: July 28, 2015
    Assignee: CHENG UEI PRECISION INDUSTRY CO., LTD.
    Inventors: Xiang Wang, Guang Li Huang, Wei Hong Liao, Yin-Lung Wu
  • Publication number: 20150194761
    Abstract: A water-proof connector includes an internal housing, a plurality of terminals, an internal shell, an external shell, an external housing and a sealing ring. The internal housing has a base portion and a tongue board. The tongue board defines a plurality of terminal grooves which the terminals are integrated in thereof. The internal shell has a top wall, a bottom wall and two side walls which corporately define a receiving chamber for receiving the internal housing and the terminals. The external shell has a top plate, a rear plate and two side plates which enclose two sides of the internal shell and the rear of the internal housing. The external housing has a top board, a bottom board, a rear board and two side boards which corporately define a receiving cavity for receiving the internal housing, internal shell and external shell. The sealing ring sheathes outside the external housing.
    Type: Application
    Filed: January 8, 2014
    Publication date: July 9, 2015
    Applicant: Cheng Uei Precision Industry Co., Ltd.
    Inventors: BAO-GENG XIE, WEI-HONG LIAO, YIN-LUNG WU
  • Patent number: 9076025
    Abstract: A card connector includes an insulating body defining at least one receiving cavity for receiving an electronic card, electrical terminals disposed in the insulating body and projecting into the receiving cavity for contacting with the electronic card, and a securing part. One wall of the receiving cavity is opened with a slot and a ring-shaped receiving groove communicated with the slot and penetrating through the wall to communicate with the receiving cavity. A pillar is formed in the receiving groove. The securing part has a semi-ring elastic portion sleeved round the pillar and located in the receiving groove, and a pair of positioning arms parallelly extending from free ends of the elastic portion to be inserted in the slot and elastically abut against two inner sidewalls of the slot. The elastic portion projects into the receiving cavity for elastically resisting against one side edge of the electronic card.
    Type: Grant
    Filed: June 12, 2013
    Date of Patent: July 7, 2015
    Assignee: CHENG UEI PRECISION INDUSTRY CO., LTD.
    Inventors: Xiang Wang, Wei Hong Liao, Yin-Lung Wu
  • Patent number: 9061543
    Abstract: A wheel hub includes a wheel rim and a support. The wheel rim has an inner rim surface, an outer rim surface and a connection concave. The wheel rim is composed of a metallic layer and a carbon fiber layer. The outer rim surface has an outer wall to be the metallic layer. The wheel hub is composed of the metallic layer and the carbon fiber layer. Compared to the conventional wheel hub made of a single metallic material or a carbon fiber material, the wheel hub made of metal and carbon fiber of the present invention is light in weight, endurable, and cost-effective. The outer wall of the outer rim surface of the conventional wheel hub is easily to be damaged by an external force when in use, which result in a break of the carbon fiber to lose the strength of the carbon fiber.
    Type: Grant
    Filed: June 26, 2013
    Date of Patent: June 23, 2015
    Assignee: QUSET COMPOSITE TECHNOLOGY CORPORATION
    Inventors: Yuan-Hong Liao, Kuo-Ting Liao
  • Publication number: 20150069500
    Abstract: A vertical transistor device comprises a substrate, a first source, a drain, a first gate dielectric layer, a first gate electrode and a first doping region. The substrate has at least one protruding portion. The first source having a first conductivity type is formed on the substrate. The drain having the first conductivity type is disposed on the protruding portion. The first gate electrode is disposed adjacent to a first sidewall of the protruding portion. The first gate dielectric layer is disposed between the first gate electrode and the first sidewall as well as being disposed adjacent to the first source and the drain. The first doping region having a second conductivity type is formed beneath the protruding portion and adjacent to the first source.
    Type: Application
    Filed: September 11, 2013
    Publication date: March 12, 2015
    Applicant: UNITED MICROELECTRONICS CORPORATION
    Inventors: Hao SU, Hang Hu, Hong Liao
  • Patent number: 8974257
    Abstract: An electrical connector includes an insulating housing and a plurality of electrical terminals. A top face of the insulating housing is concaved downward to define a plurality of terminal grooves alternately arranged into two rows along two longitudinal sides of the insulating housing. Each terminal groove extends transversely to have the outer end thereof penetrate through a corresponding side face of the insulating housing. The inner ends of the two rows of terminal grooves are alternate with one another along a substantial longitudinal middle of the insulating housing. The electrical terminals are firstly assembled downward and then pushed transversely inward to be assembled in the terminal grooves respectively.
    Type: Grant
    Filed: October 16, 2013
    Date of Patent: March 10, 2015
    Assignee: Cheng Uei Precision Industry Co., Ltd.
    Inventors: Bao-Geng Xie, Wei-Hong Liao, Yin-Lung Wu
  • Patent number: 8956194
    Abstract: A battery connector includes an insulating body and a plurality of electrical terminals. The insulating body defines a plurality of terminal grooves for receiving the electrical terminals therein. The electrical terminals each has a substantially U-shaped supporting portion which has a fastening portion levelly extending in the bottom and an elastic portion curved upward and then extending frontward from a rear end of the fastening portion. A front end of the fastening portion is bent downward and then extends frontward to form a soldering tail. A front end of the elastic portion is bent downward and extends frontward to form a pre-pressing portion extending frontward beyond a front end of the soldering tail in vertical direction. A front end of the pre-pressing portion slantwise extends upward and then is curved downward to form a contact portion projecting in front of the soldering tail.
    Type: Grant
    Filed: May 7, 2013
    Date of Patent: February 17, 2015
    Assignee: Cheng Uei Precision Industry Co., Ltd.
    Inventors: Bao-Geng Xie, Wei-Hong Liao, Yin-Lung Wu
  • Publication number: 20150003961
    Abstract: A fan system includes a stator assembly and a monitoring and sensing module. The stator assembly is electrically connected to the monitoring and sensing module, and the latter includes at least one sensor unit, at least one monitoring unit and a signal processing unit. The sensor unit of the monitoring and sensing module senses an operating state of the fan system, and the signal processing unit processes the sensing results of the sensor unit and actively generates a warning in the event of an abnormal operating state of the fan system, so as to protect the fan system against an operation failure due to any abnormal operating state and thereby reduce the fan system's maintenance cost.
    Type: Application
    Filed: July 1, 2013
    Publication date: January 1, 2015
    Inventors: Sung-Hsiang Tsang, Yu-An Lin, Yi-Hong Liao
  • Publication number: 20140375271
    Abstract: A charging dock adapted for charging a hand-held device includes a pedestal defining an opening, an electrical connector, a fastening plate slantwise disposed to a rear of the electrical connector, a plurality of first elastic elements restrained between the pedestal and the insulating housing, a metal braking piece disposed to a bottom of the pedestal, and a plurality of second elastic elements respectively restrained between button caps and the pedestal. The electrical connector is telescopically and slantwise disposed to the bottom of the pedestal and partially projects in or out of the opening. The hand-held device is capable of pressing on or being apart away from the button caps to make the button caps stretch out or draw back to drive the attaching portions to be attached to or apart away from the magnetic elements under the elasticity function of the second elastic elements.
    Type: Application
    Filed: June 20, 2013
    Publication date: December 25, 2014
    Inventors: Xiang Wang, Guang Li Huang, Wei Hong Liao, Yin-Lung Wu
  • Publication number: 20140370722
    Abstract: A card connector includes an insulating body defining at least one receiving cavity for receiving an electronic card, electrical terminals disposed in the insulating body and projecting into the receiving cavity for contacting with the electronic card, and a securing part. One wall of the receiving cavity is opened with a slot and a ring-shaped receiving groove communicated with the slot and penetrating through the wall to communicate with the receiving cavity. A pillar is formed in the receiving groove. The securing part has a semi-ring elastic portion sleeved round the pillar and located in the receiving groove, and a pair of positioning arms parallelly extending from free ends of the elastic portion to be inserted in the slot and elastically abut against two inner sidewalls of the slot. The elastic portion projects into the receiving cavity for elastically resisting against one side edge of the electronic card.
    Type: Application
    Filed: June 12, 2013
    Publication date: December 18, 2014
    Inventors: Xiang Wang, Wei Hong Liao, Yin-Lung Wu
  • Patent number: D728476
    Type: Grant
    Filed: April 4, 2013
    Date of Patent: May 5, 2015
    Assignee: Cheng Uei Precision Industry Co., Ltd.
    Inventors: Bao-Geng Xie, Wei-Hong Liao, Yin-Lung Wu