Patents by Inventor Hong Liao

Hong Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230386832
    Abstract: Embodiment methods for performing a high pressure anneal process during the formation of a semiconductor device, and embodiment devices therefor, are provided. The high pressure anneal process may be a dry high pressure anneal process in which a pressurized environment of the anneal includes one or more process gases. The high pressure anneal process may be a wet anneal process in which a pressurized environment of the anneal includes steam.
    Type: Application
    Filed: August 4, 2023
    Publication date: November 30, 2023
    Inventors: Szu-Ying Chen, Ya-Wen Chiu, Cheng-Po Chau, Yi Che Chan, Chih Ping Liao, YungHao Wang, Sen-Hong Syue
  • Patent number: 11825943
    Abstract: A telescopic slide rail support pulley structure includes a first rail provided with multiple mounting holes and a first rolling carriage, a second rail include notch, a positioning hole and a second rolling carriage, a support pulley assembly provided with an upper roller, a lower roller, a support holder and a connecting portion, and a third rail. The connecting portion of the support pulley assembly is mounted to the notch of the second rail. The support pulley assembly also has an upper roller groove and a lower roller groove. The upper roller is arranged in the upper roller groove. The lower roller is arranged in the lower roller groove. The third rail is connected to the second rail through the second rolling carriage. The second rail is connected to the first rail through the first rolling carriage.
    Type: Grant
    Filed: September 16, 2021
    Date of Patent: November 28, 2023
    Assignee: Nan Juen International Co., Ltd.
    Inventors: Xin-Hong Wei, Wei-Liang Liao, Ke-Yi Ku
  • Patent number: 11807542
    Abstract: A method for preparing urea ammonium nitrate solution from waste nitric acid after stripping tin from circuit board includes: causing the waste nitric acid after stripping tin and the ammonia water to undergo neutralizing and precipitating reaction through acid-base neutralization, filtering, thereby obtaining tin-containing filter mud and a primary filtrate; adding iron powders into to the primary filtrate to initiate copper-iron replacement reaction, filtering, thereby obtaining iron-containing coarse copper powders and a secondary filtrate; adding hydrogen peroxide to the secondary filtrate, filtering, thereby obtaining an iron-containing sludge and a tertiary filtrate; adding a heavy metal capturing agent to the tertiary filtrate, filtering, thereby obtaining a heavy metal sludge and an ammonium nitrate solution; measuring a concentration of the ammonium nitrate solution, adding urea and liquid fertilizer corrosion inhibitor to obtain a urea/ammonium nitrate dilute solution, evaporating and concentrating
    Type: Grant
    Filed: June 6, 2019
    Date of Patent: November 7, 2023
    Assignee: SHENZHEN ENVIRONMENTAL TECHNOLOGY GROUP CO. LTD.
    Inventors: Wei-Hong Wang, Jian-Gang Wu, Chao-Lin Mao, Chun-Hua Liao, Chang-Ming Chen, Kuan-Wei Huang, Xue-Qiang Huang
  • Publication number: 20230337795
    Abstract: A method for manufacturing a luggage formed by composite material includes the steps: A) using a vacuum molding method to make a thermoplastic sheet into a shell; B) placing the shell in an inner cavity mold area of a heating mold to correspond the outer surface of the shell to the inner wall surface of the inner cavity mold area; C) setting the outer surface of the thermosetting carbon fiber plastic layer on the inner surface of the shell ; D) setting the reinforcing layer on the inner surface of the thermosetting carbon fiber plastic layer at the location corresponding to the corner of the shell; and E) placing an airbag in the receiving area of the shell and inflating the airbag to support the inner surface of the thermosetting carbon fiber plastic layer and the reinforcing layer.
    Type: Application
    Filed: July 3, 2023
    Publication date: October 26, 2023
    Inventors: Yuan-Hong LIAO, Su-Chun WU
  • Publication number: 20230326776
    Abstract: A cart for wafer transportation includes a cart body, a separator disposed between first and second wafer holders, an airtight lock configured to seal the cart body. A wafer transfer system includes a cart including a space for holding a wafer holder, a first workstation configured to load the wafer holder into the space and pressurize the space, and a second workstation configured to depressurize the space and unload the wafer holder from the space, wherein the cart is transportable between the first workstation and the second workstation. A method for transporting wafers includes docking a cart in a workstation; loading a wafer holder into a space of the cart; pressurizing the space to cause a pressure of the space to be greater than an atmospheric pressure; maintaining the pressure of the space at the pressure; and moving the cart carrying the wafer holder away from the workstation.
    Type: Application
    Filed: August 24, 2022
    Publication date: October 12, 2023
    Inventors: Ren-Hau Wu, Cheng-Kang Hu, Chieh-Chun Lin, Jia-Hong Liao, Cheng-Yi Liu
  • Patent number: 11773262
    Abstract: A resin comprises at least one compound selected from one of the following formulas
    Type: Grant
    Filed: December 16, 2019
    Date of Patent: October 3, 2023
    Assignee: A.C.R. TECH CO., LTD.
    Inventors: Shih-Hao Liao, Min-Yuan Yang, Ya-Yen Chou, Jheng-Hong Ciou, Cheng-Chung Chen
  • Publication number: 20230264171
    Abstract: Chromatography resins having mixed mode ligands and methods of using such resins are provided.
    Type: Application
    Filed: April 27, 2023
    Publication date: August 24, 2023
    Inventors: CHRISTOPHER BELISLE, HONG CHEN, YUEPING XU, JIALI LIAO, XUEMEI HE
  • Patent number: 11735484
    Abstract: Semiconductor device and the manufacturing method thereof are disclosed. An exemplary semiconductor device comprises a first semiconductor stack and a second semiconductor stack over a substrate, wherein each of the first and second semiconductor stacks includes semiconductor layers stacked up and separated from each other; a dummy spacer between the first and second semiconductor stacks, wherein the dummy spacer contacts a first sidewall of each semiconductor layer of the first and second semiconductor stacks; and a gate structure wrapping a second sidewall, a top surface, and a bottom surface of each semiconductor layer of the first and second semiconductor stacks.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: August 22, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chih-Yu Hsu, Jian-Hao Chen, Chia-Wei Chen, Shan-Mei Liao, Hui-Chi Chen, Cheng Hong Yang, Shih-Hao Lin, Kuo-Feng Yu, Feng-Cheng Yang, Yen-Ming Chen
  • Patent number: 11736856
    Abstract: An earphone device includes a speaker unit, an inner housing body and an outer housing body. The inner housing body covers the speaker unit through an insert molding technique. The outer housing body covers the inner housing body through the insert molding technique.
    Type: Grant
    Filed: October 26, 2021
    Date of Patent: August 22, 2023
    Assignee: Jabil Circuit (Singapore) Pte. Ltd.
    Inventors: Wen-Hong Wang, Ching-Feng Lin, Chia-Chien Chen, Po-Cheng Huang, Shih-Hsien Yang, Cheng-Kun Chiang, Ching-Hsin Chen, Ching-Chieh Lin, Che-Hao Liao
  • Patent number: 11734790
    Abstract: Disclosed are a method and apparatus for recognizing a landmark in a panoramic image. The method includes steps of performing projection transformation on the panoramic image so as to generate a projection image; conducting semantic segmentation on the projection image so as to determine a landmark region and a road surface region; correcting distortion in the landmark region so as to produce a corrected landmark region; and recognizing the landmark in the corrected landmark region.
    Type: Grant
    Filed: March 9, 2021
    Date of Patent: August 22, 2023
    Assignee: Ricoh Company, Ltd.
    Inventors: Ke Liao, Weitao Gong, Hong Yi, Wei Wang
  • Patent number: 11705462
    Abstract: An electronic device includes a substrate, multiple transversal signal lines, a first vertical signal line, a second vertical signal line, a shielding wire, and multiple pixel structures. The first vertical signal line is intersected with the transversal signal lines. The second vertical signal line is intersected with the transversal signal lines and connected to one of the transversal signal lines. An orthogonal projection of the shielding wire on the substrate is located between an orthogonal projection of the first vertical signal line and an orthogonal projection of the second vertical signal line on the substrate. One of the pixel structures is surrounded by a corresponding one of the transversal signal lines and the second vertical signal line and includes an active device. A gate and a source of the active device is electrically connected to the corresponding one transversal signal line and the first vertical signal line respectively.
    Type: Grant
    Filed: August 17, 2020
    Date of Patent: July 18, 2023
    Assignee: Au Optronics Corporation
    Inventors: Ya-Ling Hsu, Min-Tse Lee, Ti-Kuei Yu, Yueh-Chi Wu, Shu-Wen Liao, Hung-Chia Liao, Yueh-Hung Chung, Jia-Hong Wang, Ping-Wen Chen, Sheng-Yen Cheng, Chen-Hsien Liao
  • Publication number: 20230204901
    Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a circuit assembly. The movable assembly is configured to connect an optical element, the movable assembly is movable relative to the fixed assembly, and the optical element has an optical axis. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The circuit assembly includes a plurality of circuits and is affixed to the fixed assembly.
    Type: Application
    Filed: February 23, 2023
    Publication date: June 29, 2023
    Inventors: Sin-Hong LIN, Yung-Ping YANG, Wen-Yen HUANG, Yu-Cheng LIN, Kun-Shih LIN, Chao-Chang HU, Yung-Hsien YEH, Mao-Kuo HSU, Chih-Wei WENG, Ching-Chieh HUANG, Chih-Shiang WU, Chun-Chia LIAO, Chia-Yu CHANG, Hung-Ping CHEN, Wei-Zhong LUO, Wen-Chang LIN, Shou-Jen LIU, Shao-Chung CHANG, Chen-Hsin HUANG, Meng-Ting LIN, Yen-Cheng CHEN, I-Mei HUANG, Yun-Fei WANG, Wei-Jhe SHEN
  • Patent number: 11688792
    Abstract: Dual self-aligned gate endcap (SAGE) architectures, and methods of fabricating dual self-aligned gate endcap (SAGE) architectures, are described. In an example, an integrated circuit structure includes a first semiconductor fin having a cut along a length of the first semiconductor fin. A second semiconductor fin is parallel with the first semiconductor fin. A first gate endcap isolation structure is between the first semiconductor fin and the second semiconductor fin. A second gate endcap isolation structure is in a location of the cut along the length of the first semiconductor fin.
    Type: Grant
    Filed: November 15, 2021
    Date of Patent: June 27, 2023
    Assignee: Intel Corporation
    Inventors: Sairam Subramanian, Walid M. Hafez, Sridhar Govindaraju, Mark Liu, Szuya S. Liao, Chia-Hong Jan, Nick Lindert, Christopher Kenyon
  • Publication number: 20230193290
    Abstract: A SEC12-like protein gene CPU1 and application thereof in improving soybean phosphorus efficiency are disclosed. Through genome-wide association studies, a major genetic locus affecting soybean phosphorus efficiency is identified, and the candidate gene CPU1 is discovered and validated. There are natural variations in gene CPU1 in soybean population, including two alleles, phosphorus-inefficient allele CPU1-H1 and phosphorus-efficient allele CPU1-H2. Studies based on CPU1-transformation plants shows that inhibiting the expression of the allele CPU1-H2 significantly reduces soybean phosphorus efficiency, and ultimately reduces the biomass and yield of transgenic plants. The present disclosure provides new scientific insights into genetic bases underlying natural phenotypic variation in crops, and provides novel allele resources for molecular breeding of phosphorus efficiency.
    Type: Application
    Filed: October 26, 2022
    Publication date: June 22, 2023
    Applicant: Fujian Agriculture and Forestry University
    Inventors: Zilong GUO, Zhichang CHEN, Hong LIAO
  • Publication number: 20230193027
    Abstract: A resin, including a compound having the following Formula 1-1: wherein n ranges from 1 to 5, and R1, R2, R3 and R4 are as defined herein.
    Type: Application
    Filed: December 5, 2022
    Publication date: June 22, 2023
    Inventors: Shih-Hao LIAO, Min-Yuan YANG, Ya-Yen CHOU, Jheng-Hong CIOU, Cheng-Chung CHEN
  • Publication number: 20230193016
    Abstract: A benzoxazine resin, including a compound of the following Formula 1-1: where R1, R2, and R3 are as defined herein.
    Type: Application
    Filed: December 6, 2022
    Publication date: June 22, 2023
    Inventors: Shih-Hao LIAO, Min-Yuan YANG, Ya-Yen CHOU, Jheng-Hong CIOU, Cheng-Chung CHEN
  • Patent number: 11671948
    Abstract: A method of supporting active bandwidth part (BWP) switching under carrier aggregation (CA) is proposed. To avoid longer switching delay and multiple interruptions in other component carriers (CCs)/cells, the starting time of the later active BWP switching in one cell should fall outside the switching delay of the earlier active BWP switching in another cell. If the later active BWP switching is DCI-based, then the network should schedule the later active BWP switching outside the switching delay of the earlier active BWP switching. If the later active BWP switching is timer-based, then the UE should not perform the later active BWP switching until the earlier active BWP switching is completed.
    Type: Grant
    Filed: September 13, 2021
    Date of Patent: June 6, 2023
    Assignee: MediaTek INC.
    Inventors: Pei-Kai Liao, Wei-De Wu, Jia-Hong Syu
  • Patent number: 11666888
    Abstract: Chromatography resins having mixed mode ligands and methods of using such resins are provided.
    Type: Grant
    Filed: February 5, 2019
    Date of Patent: June 6, 2023
    Assignee: BIO-RAD LABORATORIES, INC.
    Inventors: Christopher Belisle, Hong Chen, Yueping Xu, Jiali Liao, Xuemei He
  • Patent number: 11619561
    Abstract: A fan inspection jig includes a jig assembly having multiple spring abutment pillars for holding two sides of a fan (or a series fan) to make the fan or the series fan positioned in a suspending position. A vibration sensor is disposed in at least one of the spring abutment pillars of two sides of the fan for measuring a vibration signal of the fan in operation.
    Type: Grant
    Filed: September 27, 2021
    Date of Patent: April 4, 2023
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Jyh-Ren Lee, Yi-Hong Liao
  • Patent number: D996699
    Type: Grant
    Filed: January 2, 2020
    Date of Patent: August 22, 2023
    Assignee: ROE VISUAL CO., LTD.
    Inventors: Chen Lu, Hong Zhang, Xin Liao