Patents by Inventor Hong Liao
Hong Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8912561Abstract: A phosphor composition is provided. The phosphor composition comprises a phosphor nucleus and a hydrophobic layer. The hydrophobic layer is bonded on a surface of the phosphor nucleus and consists of an organic compound with a hydrophobic functional group.Type: GrantFiled: August 7, 2013Date of Patent: December 16, 2014Assignee: Lextar Electronics CorporationInventors: Yong-Hong Liao, Yun-Yi Tien, Jian-Chin Liang
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Patent number: 8890084Abstract: A method for analyzing circuit pattern is disclosed. The method includes the steps of: providing a plurality of monitor metal line structures formed on discrete locations of a substrate corresponding to different values of variable factors; performing a defect review to identify failure locations of the monitor metal line structures; determining a failure tendency of the monitor metal line structures so as to determine a boundary of the variable factors; and determining whether adjustment is to be made to product metal line structures.Type: GrantFiled: September 3, 2013Date of Patent: November 18, 2014Assignee: United Microelectronics Corp.Inventors: Bin Guo, Xu Ma, Hong Liao
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Publication number: 20140335737Abstract: A battery connector includes an insulating body and a plurality of electrical terminals. The insulating body defines a plurality of terminal grooves for receiving the electrical terminals therein. The electrical terminals each has a substantially U-shaped supporting portion which has a fastening portion levelly extending in the bottom and an elastic portion curved upward and then extending frontward from a rear end of the fastening portion. A front end of the fastening portion is bent downward and then extends frontward to form a soldering tail. A front end of the elastic portion is bent downward and extends frontward to form a pre-pressing portion extending frontward beyond a front end of the soldering tail in vertical direction. A front end of the pre-pressing portion slantwise extends upward and then is curved downward to form a contact portion projecting in front of the soldering tail.Type: ApplicationFiled: May 7, 2013Publication date: November 13, 2014Applicant: Cheng Uei Precision Industry Co., Ltd.Inventors: Bao-Geng Xie, Wei-Hong Liao, Yin-Lung Wu
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Patent number: 8803170Abstract: A light source module includes a substrate, a first LED package and a second LED package. The first and second LED packages are disposed on the substrate. The first LED package includes a first blue LED chip and a first phosphor. The first blue LED chip emits light in the range of the wavelength for blue light. The first phosphor is used to convert the wavelength of a portion of the light emitted from the first blue LED chip. The second LED package includes a second blue LED chip and a second phosphor. The second blue LED chip emits light in the range of the wavelength for blue light. The second phosphor is used to convert the wavelength of a portion of the light emitted from the second blue LED chip. The wavelength associated with the second phosphor is greater than that associated with the first phosphor.Type: GrantFiled: August 9, 2012Date of Patent: August 12, 2014Assignee: Lextar Electronics CorporationInventors: Pei-Song Cai, Yong-Hong Liao, Tzu-Pu Lin, Yun-Yi Tien, Jian-Chin Liang
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Publication number: 20140138723Abstract: A phosphor composition is provided. The phosphor composition comprises a phosphor nucleus and a hydrophobic layer. The hydrophobic layer is bonded on a surface of the phosphor nucleus and consists of an organic compound with a hydrophobic functional group.Type: ApplicationFiled: August 7, 2013Publication date: May 22, 2014Applicant: Lextar Electronics CorporationInventors: Yong-Hong Liao, Yun-Yi Tien, Jian-Chin Liang
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Publication number: 20140128509Abstract: Embodiments include a curable composition comprising an epoxy resin, a non-halogen flame retardant agent comprising at least two of an aryl-cyanato group and at least two of a phosphorus group, and a styrene and maleic anhydride copolymer. Embodiments include method of preparing the curable composition, prepregs that include a reinforcement component and the curable composition, and an electrical laminate formed with the curable composition.Type: ApplicationFiled: June 30, 2011Publication date: May 8, 2014Applicant: DOW Global Technologies LLCInventors: Hongyu Chen, Annie Gui Hong Liao
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Publication number: 20140128545Abstract: Embodiments include curable compositions including an epoxy resin and a hardener component including a terpolymer having first constitutional unit, a second constitutional unit, and a third constitutional unit, where the epoxy group to the second constitutional unit has a molar ratio in a range of 1.0:1.0 to 2.7:1.0. Embodiments include prepregs that include a reinforcement component and the curable composition and an electrical laminate formed with the curable composition.Type: ApplicationFiled: June 30, 2011Publication date: May 8, 2014Applicant: DOW Global Technologies LLCInventors: Jia Wen Xiong, Hongyu Chen, Michael Mullins, Chao Zhang, Annie Gui Hong Liao, Wayne Yi Zhang
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Publication number: 20140099751Abstract: The present invention provides a method of forming a doping region. A substrate is provided, and a poly-silicon layer is formed on the substrate. A silicon oxide layer is formed on the poly-silicon layer. An implant process is performed to form a doping region in the poly-silicon layer. The present invention further provides a method for forming a MOS.Type: ApplicationFiled: October 8, 2012Publication date: April 10, 2014Applicant: UNITED MICROELECTRONICS CORP.Inventors: Hao Su, Hang Hu, Hong Liao
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Publication number: 20140061855Abstract: A capacitor structure includes a first conductive structure, a dielectric structure, a first capacitor electrode, a capacitor dielectric layer, and a second capacitor electrode. The first conductive structure is disposed over a substrate. The dielectric structure is disposed over the substrate and partially enclosing the first conductive structure. The dielectric structure has a trench. A first surface of the first conductive structure is exposed through the trench of the dielectric structure. The first capacitor electrode is disposed on a bottom and a sidewall of the trench. The first capacitor electrode is electrically contacted with the first surface of the first conductive structure. The capacitor dielectric layer is disposed on a surface of the first capacitor electrode. The second capacitor electrode is disposed on a surface of the capacitor dielectric layer and filled in the trench.Type: ApplicationFiled: September 6, 2012Publication date: March 6, 2014Applicant: UNITED MICROELECTRONICS CORPORATIONInventors: Chien-Li KUO, Kuei-Sheng WU, Ju-Bao ZHANG, Rui-Huang CHENG, Xing-Hua ZHANG, Hong LIAO
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Publication number: 20140065866Abstract: A receptacle connector adapted for engaging with a plug connector includes an inner insulating housing, a plurality of terminals integrally molded to the inner insulating housing, a shielding shell, a waterproof plate and an outer insulating housing. The shielding shell is looped from a first metal plate with an inserting space being formed therein. The inner insulating housing together with the terminals is inserted into the inserting space. The shielding shell defines two buckling holes. The waterproof plate is made of a second metal plate thinner than the first metal plate in thickness, and is fastened on the shielding shell. Two opposite sides of the waterproof plate are punched upward to form two receiving hats corresponding to the two buckling holes. The outer insulating housing is integrally molded around the shielding shell, the waterproof plate and the inner insulating housing with soldering portions of the terminals projected outside.Type: ApplicationFiled: September 6, 2012Publication date: March 6, 2014Applicant: Cheng Uei Precision Industry Co., LTD.Inventors: Bao-Geng Xie, Wei-Hong Liao, Yin-Lung Wu
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Patent number: 8662599Abstract: A wheel hub includes a wheel rim and a support. The wheel rim has an inner rim surface, an outer rim surface and a connection concave. The wheel rim is composed of a metallic layer and a carbon fiber layer. The outer rim surface has an outer wall to be the metallic layer. The wheel hub is composed of the metallic layer and the carbon fiber layer. Compared to the conventional wheel hub made of a single metallic material or a carbon fiber material, the wheel hub made of metal and carbon fiber of the present invention is light in weight, endurable, and cost-effective. The outer wall of the outer rim surface of the conventional wheel hub is easily to be damaged by an external force when in use, which result in a break of the carbon fiber to lose the strength of the carbon fiber.Type: GrantFiled: May 22, 2009Date of Patent: March 4, 2014Assignee: Quset Composite Technology CorporationInventors: Yuan-Hong Liao, Kuo-Ting Liao
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Patent number: 8662928Abstract: A receptacle connector adapted for engaging with a plug connector includes an inner insulating housing, a plurality of terminals integrally molded to the inner insulating housing, a shielding shell, a waterproof plate and an outer insulating housing. The shielding shell is looped from a first metal plate with an inserting space being formed therein. The inner insulating housing together with the terminals is inserted into the inserting space. The shielding shell defines two buckling holes. The waterproof plate is made of a second metal plate thinner than the first metal plate in thickness, and is fastened on the shielding shell. Two opposite sides of the waterproof plate are punched upward to form two receiving hats corresponding to the two buckling holes. The outer insulating housing is integrally molded around the shielding shell, the waterproof plate and the inner insulating housing with soldering portions of the terminals projected outside.Type: GrantFiled: September 6, 2012Date of Patent: March 4, 2014Assignee: Cheng UEI Precision Industry Co., Ltd.Inventors: Bao-Geng Xie, Wei-Hong Liao, Yin-Lung Wu
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Patent number: 8657607Abstract: A socket connector includes an insulating body having a base portion and a holding portion extending upward from a front of the base portion. The holding portion defines a terminal fillister spread to the base portion. A plurality of openings is opened in a front face of the holding portion and communicates with the terminal fillister. A terminal group is molded in the terminal fillister of the insulating body. The terminal group has a plurality of elastic touching arms stretching outside the insulating body, and a plurality of contact slices exposed through the openings respectively. A magnetic body is curved from a magnetic metal board and defines a window. The magnetic body is mounted around the holding portion with the window facing the openings of the insulating housing to further expose the contact slices therethrough. The terminal group further electrically contacts with the magnetic body.Type: GrantFiled: December 7, 2011Date of Patent: February 25, 2014Assignee: Cheng Uei Precision Industry Co., Ltd.Inventors: Bao-Geng Xie, Wei-Hong Liao, Ming-Chiang Chen
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Patent number: 8597033Abstract: A receptacle connector includes an insulating housing with a plurality of openings apart opened in a front face thereof. A terminal group includes a ground terminal embedded in the insulating housing. The terminal group has a plurality of contact slices molded in the insulating housing and exposed through the openings respectively, and a plurality of touching arms elastically stretching outside the insulating housing. At least one connecting member is molded in the insulating housing to electrically connect with the ground terminal, and has a connecting slice exposed outside and abreast with the front face of the insulating housing. A metal shell is mounted to the front face of the insulating housing and point welded with the connecting slice. A window is opened in the metal shell and located to face the openings for further exposing the contact slices therethrough. A waterproof washer is sealed around the metal shell.Type: GrantFiled: February 10, 2012Date of Patent: December 3, 2013Assignee: Cheng UEI Precision Industry Co., Ltd.Inventors: Bao-Geng Xie, Wei-Hong Liao, Ming-Chiang Chen
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Publication number: 20130285437Abstract: A wheel hub includes a wheel rim and a support. The wheel rim has an inner rim surface, an outer rim surface and a connection concave. The wheel rim is composed of a metallic layer and a carbon fiber layer. The outer rim surface has an outer wall to be the metallic layer. The wheel hub is composed of the metallic layer and the carbon fiber layer. Compared to the conventional wheel hub made of a single metallic material or a carbon fiber material, the wheel hub made of metal and carbon fiber of the present invention is light in weight, endurable, and cost-effective. The outer wall of the outer rim surface of the conventional wheel hub is easily to be damaged by an external force when in use, which result in a break of the carbon fiber to lose the strength of the carbon fiber.Type: ApplicationFiled: June 26, 2013Publication date: October 31, 2013Inventors: Yuan-Hong Liao, Kuo-Ting Liao
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Patent number: 8569389Abstract: An organic/inorganic hybrid composite proton exchange membrane is provided. The proton exchange membrane includes an inorganic material of about 0.5-30 parts by weight and an organic material of about 99.5-70 parts by weight per 100 parts by weight of the proton exchange membrane. A surface area of the inorganic material is about 50-3000 m2/g. The organic material includes a sulfonated polymer or a phosphoric acid doped polymer.Type: GrantFiled: December 29, 2010Date of Patent: October 29, 2013Assignee: Industrial Technology Research InstituteInventors: Li-Duan Tsai, Yong-Hong Liao, Shih-Wen Chen, Jiunn-Nan Lin, Chien-Ming Lai, Chiu-Ping Huang, Sung-Chun Chang
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Patent number: 8552075Abstract: A composite proton exchange membrane is made up of dispersed organized graphene in ion conducting polymer as a fuel barrier material. The composite proton exchange membrane includes an inorganic material of 0.001-10 wt % and an organic material of 99.999-90 wt %. The inorganic material is a graphene derivative with two-dimensional structure. The organic material includes a polymer material with sulfonic acid group.Type: GrantFiled: May 9, 2011Date of Patent: October 8, 2013Assignee: Industrial Technology Research InstituteInventors: Li-Duan Tsai, Hung-Chung Chien, Yong-Hong Liao
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Patent number: 8546914Abstract: A method for forming an embedded capacitor structure is provided. Firstly, a first dielectric layer having a trench therein on a substrate is provided. A capacitor structure is formed on the bottom surface of the trench. The capacitor structure includes a first metal layer, a capacitance-insulating layer and a second metal layer and the portion surface of the first metal layer on the bottom surface of the trench is exposed. A cap layer is formed on the top surface and the inner surface of the trench and on the capacitor structure. A second dielectric layer is formed on the cap layer. The portion of second dielectric layer and the portion of the cap layer are removed to form a plurality of contact windows therein, and the portion surface of the first metal layer and the portion surface of the second metal layer are exposed by the plurality of contact windows.Type: GrantFiled: July 19, 2011Date of Patent: October 1, 2013Assignee: United Microelectronics Corp.Inventors: Hao Su, Hang Hu, Hong Liao
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Patent number: 8546212Abstract: A manufacturing method of a semiconductor device includes the following steps. First, a substrate is provided. At least one gate trench and a first inter-layer dielectric layer are formed on the substrate. A work function metallic layer is then formed in the gate trench. A first contact hole is then formed in the first inter-layer dielectric layer. A main conductive layer is formed in the gate trench and the first contact hole simultaneously.Type: GrantFiled: December 21, 2011Date of Patent: October 1, 2013Assignee: United Microelectronics Corp.Inventors: Hao Su, Hang Hu, Hong Liao
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Publication number: 20130240921Abstract: A light source module includes a substrate, a first LED package and a second LED package. The first and second LED packages are disposed on the substrate. The first LED package includes a first blue LED chip and a first phosphor. The first blue LED chip emits light in the range of the wavelength for blue light. The first phosphor is used to convert the wavelength of a portion of the light emitted from the first blue LED chip. The second LED package includes a second blue LED chip and a second phosphor. The second blue LED chip emits light in the range of the wavelength for blue light. The second phosphor is used to convert the wavelength of a portion of the light emitted from the second blue LED chip. The wavelength associated with the second phosphor is greater than that associated with the first phosphor.Type: ApplicationFiled: August 9, 2012Publication date: September 19, 2013Applicant: LEXTAR ELECTRONICS CORPORATIONInventors: Pei-Song Cai, Yong-Hong Liao, Tzu-Pu Lin, Yun-Yi Tien, Jian-Chin Liang