Abstract: A semiconductor device and a method of manufacturing a semiconductor device, the semiconductor device including a substrate; a first insulating interlayer on the substrate; a first wiring in the first insulating interlayer on the substrate; an insulation pattern on a portion of the first insulating interlayer adjacent to the first wiring, the insulation pattern having a vertical sidewall and including a low dielectric material; an etch stop structure on the first wiring and the insulation pattern; a second insulating interlayer on the etch stop structure; and a via extending through the second insulating interlayer and the etch stop structure to contact an upper surface of the first wiring.

Abstract: The present invention relates to a positive electrode active material pre-dispersion composition which includes a lithium iron phosphate-based positive electrode active material, a dispersant, and a solvent, wherein the dispersant includes a hydrogenated nitrile butadiene rubber (HNBR), a slurry composition for a secondary battery positive electrode which is prepared by using the positive electrode active material pre-dispersion composition, a positive electrode for a secondary battery, and a lithium secondary battery including the positive electrode.

Abstract: Disclosed is a pharmaceutical composition for the prevention or treatment of preterm birth, comprising, as an active ingredient, an agent that inhibits the differentiation of fibroblasts into myofibroblasts in cervix.

Abstract: An electronic device is provided. The electronic device includes a first communication circuit, a second communication circuit, a processor configured to be electrically connected with the first communication circuit and the second communication circuit, and a memory configured to be electrically connected with the processor. The memory includes instructions, when executed by the processor, cause the processor to obtain location information of the electronic device, transmit a first message for requesting to change a state of the electronic device to a network, receive a first response message to the transmitted first message from the network, transmit a second message for requesting a parameter for an operation cycle of the second communication circuit to the network, receive a second response message to the second message from the network, and change the operation cycle of the second communication circuit to a value corresponding to a current state of the electronic device.

Abstract: A semiconductor may include a first inter metal dielectric (IMD) layer, a first blocking layer on the first IMD layer, a metal wiring and a second blocking layer. The first inter metal dielectric (IMD) layer may be formed on a substrate, the first IMD layer may include a low-k material having a dielectric constant lower than a dielectric constant of silicon oxide. The first blocking layer may be formed on the first IMD layer. The first blocking layer may include an oxide having a dielectric constant higher than the dielectric constant of the first IMD layer. The metal wiring may be through the first IMD layer and the first blocking layer. The second blocking layer may be formed on the metal wiring and the first blocking layer. The second blocking layer may include a nitride. The first and second blocking layers may reduce or prevent from the out gassing, so that a semiconductor device may have good characteristics.

Abstract: Methods and apparatus for automating the fiber laying process during the repair of composite structures made of fiber-reinforced plastic material based on the three-dimensional printing technique. Continuous fiber rovings (e.g., carbon fibers) impregnated with liquid epoxy can be directly printed onto the damaged surface of the composite structure (e.g., an aircraft component made of carbon fiber-reinforced plastic) without human manipulation in an autonomous manner.

Abstract: A negative electrode slurry including a lithium titanium oxide, a dispersant including a polar OH group and a non-polar alkyl group, a binder, and a solvent, and a method of preparing the same.

Abstract: A method of fabricating a semiconductor device comprises forming first and second align keys in a wafer, the second align key apart from the first align key, forming third and fourth align keys in the wafer, the third align key apart from the second align key, the fourth align key apart from the third align key, forming a fifth align key in the wafer, the fifth align key apart from the fourth align key, forming a first line pattern in the wafer using the second and third align keys, forming a second line pattern in the wafer using the fourth and fifth align keys, forming a first interposer including the first line pattern by cutting a space between the first and second align keys, and forming a second interposer, the second interposer including the second line pattern by cutting a space between the third and fourth align keys.

Abstract: Provided is an interposer structure. The interposer structure comprises an interposer substrate, an interlayer insulating film which covers a top surface of the interposer substrate, a capacitor structure in the interlayer insulating film and a wiring structure including a first wiring pattern and a second wiring pattern spaced apart from the first wiring pattern, on the interlayer insulating film, wherein the capacitor structure includes an upper electrode connected to the first wiring pattern, a lower electrode connected to the second wiring pattern, and a capacitor dielectric film between the upper electrode and the lower electrode.

Abstract: The method of manufacturing an interposer includes providing a substrate including a first region and a second region adjacent to the first region, forming a first mold structure on the substrate, forming a photoresist layer on the first mold structure, forming a first transfer pattern over the photoresist layer on the first region, using a first photomask, forming a second transfer pattern over the photoresist layer on the second region, using the first photomask, forming a mask pattern on the first mold structure, using the first transfer pattern and the second transfer pattern and forming a first trench and a second trench in the first mold structure, using the mask pattern, the first trench being formed in the first region, and the second trench being formed in the second region.

Abstract: Provided is a battery protection circuit module package capable of easily achieving high integration and size reduction. The battery protection circuit module package includes a terminal lead frame including a first internal connection terminal lead and a second internal connection terminal lead provided at two edges of the terminal lead frame and electrically connected to electrode terminals of a battery bare cell, and a plurality of external connection terminal leads provided between the first and second internal connection terminal leads and serving as a plurality of external connection terminals, and a device package including a substrate mounted on the terminal lead frame to be electrically connected to the terminal lead frame, and providing a battery protection circuit device thereon.

Abstract: Methods and apparatus for automating the fiber laying process during the repair of composite structures made of fiber-reinforced plastic material based on the three-dimensional printing technique. Continuous fiber rovings (e.g., carbon fibers) impregnated with liquid epoxy can be directly printed onto the damaged surface of the composite structure (e.g., an aircraft component made of carbon fiber-reinforced plastic) without human manipulation in an autonomous manner.

Abstract: A semiconductor memory device operates by applying a program pulse to a selected word line, updating a program pulse count value, determining a current sensing mode based upon the program pulse count value, and performing a program verify operation based upon the current sensing mode. The current sensing mode is determined by determining one of an individual state current sensing operation for determining verify pass or fail for one target program state and an all-state current sensing operation for determining verify pass or fail for all target program states.

Abstract: An electronic device is provided. The electronic device includes a first communication circuit, a second communication circuit, a processor configured to be electrically connected with the first communication circuit and the second communication circuit, and a memory configured to be electrically connected with the processor. The memory includes instructions, when executed by the processor, cause the processor to obtain location information of the electronic device, transmit a first message for requesting to change a state of the electronic device to a network, receive a first response message to the transmitted first message from the network, transmit a second message for requesting a parameter for an operation cycle of the second communication circuit to the network, receive a second response message to the second message from the network, and change the operation cycle of the second communication circuit to a value corresponding to a current state of the electronic device.

Abstract: Provided herein is a method of forming micropatterns, including: forming an etching target film on a substrate; forming a photosensitivity assisting layer on the etching target film, the photosensitivity assisting layer being terminated with a hydrophilic group; forming an adhesive layer on the photosensitivity assisting layer, the adhesive layer forming a covalent bond with the hydrophilic group; forming a hydrophobic photoresist film on the adhesive layer; and patterning the photoresist film.

Abstract: Provided is an energy harvester and an engine monitoring system. An engine monitoring system using an energy harvester includes at least one or more self-power generation wireless sensor nodes for generating electric energy using the energy harvester and monitoring an engine; and a management server that receives and manages sensing information received from the self-power generation wireless sensor nodes.

Abstract: A method of fabricating a battery protection circuit package according to one aspect of the present invention includes forming a first mounting structure by mounting battery protection circuit elements on a printed circuit board (PCB), forming a second mounting structure by mounting the first mounting structure on a lead frame which comprises an input/output terminal portion for external connection and at least one metal tab for battery cell connection, forming an encapsulation structure by encapsulating the second mounting structure with a molding material to encapsulate at least a part of the battery protection circuit elements while exposing the input/output terminal portion and the at least one metal tab of the lead frame, and bonding at least one flexible printed circuit board (FPCB) to the input/output terminal portion of the encapsulation structure.

Abstract: Semiconductor devices including a capacitor in which electrostatic capacity is improved by a simplified process and/or methods for fabricating the same are provided. The semiconductor device including an insulating structure defining a first trench on a substrate, a first conductive layer in the insulating structure, a first portion of an upper surface of the first conductive layer exposed by the first trench, a capacitor structure including a first electrode pattern on the first conductive layer, a dielectric pattern on the first electrode pattern, and a second electrode pattern on the dielectric pattern, the first electrode pattern extending along sidewalls and a bottom surface of the first trench and an upper surface of the insulating structure, and a first wiring pattern on the capacitor structure may be provided.

Abstract: The present invention relates to a grinder using induced electric fields. The grinder comprises: a grinding unit on which a plurality of protrusions for cutting are disposed on an outer circumferential surface thereof; a power unit disposed in the grinding unit to generate electric fields and attach the conductive materials to the grinding unit; and a chamber disposed outside the grinding unit and comprising beads that disperse and grind the conductive materials attached to the grinding unit, wherein the conductive materials have directionality by the electric fields of the power unit.

Abstract: Disclosed are modularized garment manufacturing method and system for small quantity batch production of garments. Basic components constituting an ordered garment are generated by analyzing shape graphic data of the ordered garment. For each basic component, basic patterns are generated for each dimension of the ordered garment. The basic patterns are compared with reference garment patterns stored in a garment pattern database to determine a pattern category of each basic pattern. Based on the pattern category of the basic patterns and information on garment production lines currently in operation, subdivided work modules are determined for each basic pattern.