Abstract: A memory device includes a stack structure, a memory element, a channel element, and a semiconductor layer. The stack structure includes a source layer, an insulating layer and gate electrode layers. The insulating layer is on the source layer. The gate electrode layers are on the insulating layer. The memory element is on electrode sidewall surfaces of the gate electrode layers. Memory cells are defined in the memory element between the channel element and the gate electrode layers. The semiconductor layer is electrically connected between the source layer and the channel element. The semiconductor layer and the source layer have an interface therebetween. The interface is at a location on an inside of an insulating sidewall surface of the insulating layer with a lateral offset relative to the insulating sidewall surface.

Abstract: An ovonic threshold switch includes a first electrode, a second electrode, and an In-doped chalcogenide-based selector layer disposed between the first electrode and the second electrode, in which the In-doped chalcogenide-based selector layer has an In compound content of about 2 at. % to about 10 at. %. A memory cell including the In-doped chalcogenide-based selector layer is also provided.

Abstract: A memory device comprises a stack of conductive layers, and an array of pillars through the stack. Each of the pillars comprises a plurality of series-connected memory cells located in a layout pattern of pillar locations at cross-points between the pillars and the conductive layers. The pillars in the array are arranged in a set of rows of pillars extending in a first direction. First and second source lines are disposed vertically through the pillars of first and second particular rows of pillars. The set of rows of pillars includes a subset of rows of pillars including multiple members disposed between the first source line and the second source line. A source line conductor is disposed beneath and electrically connected to the first source line, the second source line, and the subset of rows of pillars disposed between the first and second source lines.

Abstract: A voltage sensitive switching device has a first electrode, a second electrode, and a switching layer between the first and second electrodes, comprising a composition of carbon C, arsenic As, selenium Se and germanium Ge thermally stable to temperatures over 400° C. The switching device is used in 3D crosspoint memory.

Abstract: A memory device comprises a stack of conductive layers, and an array of pillars through the stack. Each of the pillars comprises a plurality of series-connected memory cells located in a layout pattern of pillar locations at cross-points between the pillars and the conductive layers. The pillars in the array are arranged in a set of rows of pillars extending in a first direction. First and second source lines are disposed vertically through the pillars of first and second particular rows of pillars. The set of rows of pillars includes a subset of rows of pillars including multiple members disposed between the first source line and the second source line. A source line conductor is disposed beneath and electrically connected to the first source line, the second source line, and the subset of rows of pillars disposed between the first and second source lines.

Abstract: A plurality of memory cells in a cross-point array in which the memory cell stacks in the cross-points include a switch element, a conductive barrier layer, and a confined cell structure in series, and having sides aligned within the cross-point area of the corresponding cross-point, the confined cell structure including surfactant spacers within the cross-point area having outside surfaces on a pair of opposing sides of the stack, and a body of programmable resistance memory material confined between inside surfaces of the surfactant spacers. The memory cells can be operated as multi-level cells in a 3D array.

Abstract: A semiconductor device includes a first electrode, a second electrode, and an In-doped chalcogenide-based selector layer disposed between the first electrode and the second electrode, in which the In-doped chalcogenide-based selector layer has an In compound content of about 2 at. % to about 10 at. %. A memory cell including the In-doped chalcogenide-based selector layer is also provided.

Abstract: A semiconductor device includes a first electrode, a second electrode, and an In-doped chalcogenide-based selector layer disposed between the first electrode and the second electrode, in which the In-doped chalcogenide-based selector layer has an In compound content of about 2 at. % to about 10 at. %. A memory cell including the In-doped chalcogenide-based selector layer is also provided.

Abstract: A memory device comprises a stack of conductive layers, and an array of pillars through the stack. Each of the pillars comprises a plurality of series-connected memory cells located in a layout pattern of pillar locations at cross-points between the pillars and the conductive layers. The pillars in the array are arranged in a set of rows of pillars extending in a first direction. First and second source lines are disposed vertically through the pillars of first and second particular rows of pillars. The set of rows of pillars includes a subset of rows of pillars including multiple members disposed between the first source line and the second source line. A source line conductor is disposed beneath and electrically connected to the first source line, the second source line, and the subset of rows of pillars disposed between the first and second source lines.

Abstract: A 3D memory includes a plurality of first access line levels, a plurality of second access line levels and a plurality of memory cell levels, the memory cell levels being disposed between corresponding first access line levels and second access line levels. The first access line levels include a plurality of first access lines extending in a first direction, and a plurality of remnants of a first sacrificial material disposed between the first access lines. The second access line levels include a plurality of second access lines extending in a second direction and a plurality of remnants of a second sacrificial material disposed between the second access lines. The memory cell levels include an array of memory pillars disposed in the cross-points between the first access lines and the second access lines in adjacent first and second access line levels.

Abstract: A device comprises a column of cells disposed in multiple levels of word lines including a pillar comprising a first vertical conductive line, a second vertical conductive line, and a vertical semiconductor body disposed between and in contact with the first and second vertical conductive lines. A pillar select line is adjacent to and separated by a gate dielectric from the vertical semiconductor body to form a pillar select switch, the pillar select line disposed beneath the first and second vertical conductive lines. A bottom select line is disposed beneath the first and second vertical conductive lines and insulated from the pillar select line and the first and second vertical conductive lines. The bottom select line is in current-flow contact with the vertical semiconductor body of the pillar.

Abstract: A plurality of memory cells in a cross-point array in which the memory cell stacks in the cross-points include a switch element, a conductive barrier layer, and a confined cell structure in series, and having sides aligned within the cross-point area of the corresponding cross-point, the confined cell structure including surfactant spacers within the cross-point area having outside surfaces on a pair of opposing sides of the stack, and a body of programmable resistance memory material confined between inside surfaces of the surfactant spacers. The memory cells can be operated as multi-level cells in a 3D array.

Abstract: An embodiment of the present invention discloses a memory device. The memory device includes a memory controller, a calculation memory and a functional circuit. The calculation memory is coupled to the memory controller, and is configured to receive a plurality of first signals to output a plurality of second signals. Each of the second signals has a reference value. The functional circuit is coupled to the calculation memory, and is configured to indicate the second signal which has the greatest or the smallest reference value among the second signals.

Abstract: A memory device comprises a stack of conductive strips separated by insulating layers on a substrate, and a vertical channel structure disposed in a hole through the stack of conductive strips to the substrate. A vertical channel structure is disposed in a hole through the stack of conductive strips to the substrate. Charge storage structures are disposed at cross points of the conductive strips and the vertical channel structure, the charge storage structures including multiple layers of materials. The insulating layers have sidewalls recessed from the vertical channel structure. A charge storage layer of the multiple layers of materials of the charge storage structures lines sidewalls of the insulating layers. Dielectric material is disposed between the vertical channel structure and the charge storage layer on sidewalls of the insulating layers.

Abstract: An embodiment of the present invention discloses a memory device. The memory device includes a memory controller, a calculation memory and a functional circuit. The calculation memory is coupled to the memory controller, and is configured to receive a plurality of first signals to output a plurality of second signals. Each of the second signals has a reference value. The functional circuit is coupled to the calculation memory, and is configured to indicate the second signal which has the greatest or the smallest reference value among the second signals.

Abstract: A memory apparatus and a data access method for a memory are provided. The data access method includes: receiving a data erase command for performing a data erase operation; and, during the data erase operation: configuring a selected memory cell block in the memory according to the data erase command; providing a flag memory cell corresponding to the selected memory cell block, erasing a data in the flag memory cell according to the data erase command, and keeping a data in a plurality of selected memory cells in the selected memory cell block unchanged.

Abstract: A memory device comprises a plurality of stacks of word lines alternating with insulating strips, the stacks being separated by trenches, the word lines extending in a first direction. A plurality of columns of vertical conductive structures is disposed in the trenches between adjacent stacks. Multi-layer films of memory material and channel material are disposed on sidewalls of word lines on at least one side of the trenches between adjacent vertical conductive structures in the plurality of vertical conductive structure, the channel material in ohmic contact with the vertical conductive structures. At locations of vertical conductive structures in the plurality of vertical conductive structures, the sidewalls of the word lines are recessed between insulating strips in the stacks to form recesses on the sidewalls of the word lines to isolate the word lines from vertical conductive structures.

Abstract: A memory includes a plurality of levels of word lines interleaved with a plurality of levels of channel lines. Horizontal data storage levels are disposed between the plurality of levels of word lines and the plurality of levels of channel lines, the data storage levels including respective arrays of data storage regions in cross points of word lines and channel lines in adjacent levels of the plurality of levels of word lines and the plurality of levels of channel lines. Respective arrays of holes outside of the cross points are disposed in the channel line and word line levels. The channel lines and word lines have sides defined by undercut etch perimeters, along with air gaps or voids between the channel lines and word lines in each level. The word lines, bit lines and data storage nodes in each layer are vertically self-aligned.

Abstract: A memory device comprises a plurality of stacks of word lines alternating with insulating strips, the stacks being separated by trenches, the word lines extending in a first direction. A plurality of columns of vertical conductive structures is disposed in the trenches between adjacent stacks. Multi-layer films of memory material and channel material are disposed on sidewalls of word lines on at least one side of the trenches between adjacent vertical conductive structures in the plurality of vertical conductive structure, the channel material in ohmic contact with the vertical conductive structures. At locations of vertical conductive structures in the plurality of vertical conductive structures, the sidewalls of the word lines are recessed between insulating strips in the stacks to form recesses on the sidewalls of the word lines to isolate the word lines from vertical conductive structures.

Abstract: An integrated circuit includes a three-dimensional cross-point memory having a plurality of levels of memory cells disposed in cross points of first access lines and second access lines with alternating wide and narrow regions. The manufacturing process of the three-dimensional cross-point memory includes patterning with three patterns: a first pattern to define the memory cells, a second pattern to define the first access lines, and a third pattern to define the second access lines.