Patents by Inventor Hsiang Wang

Hsiang Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12278272
    Abstract: In some embodiments, the present disclosure relates to a method of forming a transistor device. The method includes forming a source contact over a substrate, forming a drain contact over the substrate, and forming a gate contact material over the substrate. The gate contact material is patterned to define a gate structure that wraps around the source contact along a continuous and unbroken path.
    Type: Grant
    Filed: July 20, 2022
    Date of Patent: April 15, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Aurelien Gauthier Brun, Chun Lin Tsai, Jiun-Lei Jerry Yu, Po-Chih Chen, Yun-Hsiang Wang
  • Publication number: 20250110519
    Abstract: The present disclosure provides a low drop-out (LDO) circuit. The LDO circuit includes an input terminal, an output terminal, a cascode operational amplifier, and a power stage. The cascode operational amplifier is electrically connected to the input terminal. The power stage has a first terminal electrically connected to the input terminal, a second terminal electrically connected to an output node of the cascode operational amplifier, and a third terminal electrically connected to the output terminal.
    Type: Application
    Filed: December 12, 2024
    Publication date: April 3, 2025
    Inventor: YI-HSIANG WANG
  • Patent number: 12256575
    Abstract: An image sensor includes a first pixel array. The first pixel array includes multiple photo diodes and a polyhedron structure. The polyhedron structure is located above the photo diodes, and the polyhedron structure includes a bottom facet, a top facet, and at least one side facet. The bottom facet is located between the side facet and the photo diodes, and an orthogonal projection of the polyhedron structure overlaps with photo diodes. The polyhedron structure is configured to divide an incident light into a plurality of light beams focused in the photo diodes.
    Type: Grant
    Filed: June 7, 2022
    Date of Patent: March 18, 2025
    Assignee: VisEra Technologies Company Ltd.
    Inventors: Shin-Hong Kuo, Yu-Chi Chang, Zong-Ru Tu, Ching-Chiang Wu, Po-Hsiang Wang
  • Publication number: 20250089389
    Abstract: An image sensor includes a sensor layer and a color filter layer disposed on the sensor layer. The image sensor further includes a lens layer disposed on the color filter layer. The lens layer includes a plurality of micro lenses. The image sensor further includes a first cut filter layer disposed over the lens layer. The first surface of the first cut filter layer has a plurality of first protrusions.
    Type: Application
    Filed: September 12, 2023
    Publication date: March 13, 2025
    Inventors: Shin-Hong KUO, Po-Hsiang WANG, Han-Lin WU, Hung-Jen TSAI
  • Patent number: 12249274
    Abstract: A display device includes a display panel having a plurality of sub-pixel areas, each including a pixel circuit, each pixel circuit including: a diode, configured to be in a forward-biasing state during a display phase of the pixel circuit for light-emitting and configured to be in a reverse-biasing state in a sensing phase of the pixel circuit to generate a sensing voltage; a driving transistor for driving the diode during the display phase; a readout transistor, with a gate receiving the sensing voltage during the sensing phase to serve as a source follower; first to seventh transistors, gate control signals applied to the gates of the first to seventh transistors so that the pixel circuit switches between the display phase and the sensing phase; and a capacitor for storing a data voltage to be written to the diode in the display phase.
    Type: Grant
    Filed: November 2, 2023
    Date of Patent: March 11, 2025
    Assignee: Guangzhou Tyrafos Semiconductor Technologies Co., Ltd.
    Inventors: Ping-Hung Yin, Jia-Shyang Wang, Yu Hsiang Wang
  • Patent number: 12243719
    Abstract: The present disclosure relates to an integrated chip processing tool. The integrated chip processing tool includes a gas distribution ring configured to extend along a perimeter of a process chamber. The gas distribution ring includes a lower ring extending around the process chamber. The lower ring has a plurality of gas inlets arranged along a bottom surface of the lower ring and a plurality of gas conveyance channels arranged along an upper surface of the lower ring directly over the plurality of gas inlets. The gas distribution ring further includes an upper ring disposed on the upper surface of the lower ring and covering the plurality of gas conveyance channels. A plurality of gas outlets are arranged along opposing ends of the plurality of gas conveyance channels. A plurality of gas conveyance paths extending between the plurality of gas inlets and the plurality of gas outlets have approximately equal lengths.
    Type: Grant
    Filed: June 28, 2022
    Date of Patent: March 4, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Po-Hsiang Wang, Min-Chang Ching, Kuo Liang Lu, Bo-Han Chu
  • Patent number: 12243967
    Abstract: A pixel package includes an electrode structure, a plurality of light-emitting units arranged on the electrode structure, and a light transmitting layer. The electrode structure has an upper layer with a first upper sheet, a lower layer with a first lower sheet, and a supporting layer arranged between the upper layer and the lower layer. The electrode structure and the plurality of light-emitting units are fully embedded in the light transmitting layer. In a top view of the pixel package, the first upper sheet is overlapped with and larger than the first lower sheet.
    Type: Grant
    Filed: December 29, 2021
    Date of Patent: March 4, 2025
    Assignees: Epistar Corporation, Yenrich Technology Corporation
    Inventors: Chi-Chih Pu, Li-Yuan Huang, Tzu-Hsiang Wang, Ya-Wen Lin
  • Patent number: 12237133
    Abstract: A overload protection switch with a reverse restart switching structure that has a seesaw lampshade provided with a protruding block which extending downward from the outside of the seesaw lampshade to ensure that the seesaw lampshade and the moving rod are accurately positioned in the ON and OFF positions in the housing to form a three-stage switching type with bidirectional positioning and forms an overload protection switch that can continuously maintain sufficient insulation distance and does not reduce the insulation distance due to fatigue decay of the binary alloy conductive plate.
    Type: Grant
    Filed: September 28, 2023
    Date of Patent: February 25, 2025
    Inventors: Yi-Hsiang Wang, I-Ying Wang
  • Patent number: 12232254
    Abstract: The present disclosure provides a printed circuit board and a method thereof. The printed circuit board has a first substrate, at least one first trace layer and at least one second trace layer. The first substrate has a first surface and a second surface. The first surface and the second surface are corresponding to each other along an axis. The first trace layer is formed on the first surface and/or the second surface of the first substrate. The first trace layer has at least one first trace and at least one first gap beside the first trace by etching. The second trace layer is formed on the first trace layer. The second trace layer has at least one second trace and at least one second gap beside the second trace by etching.
    Type: Grant
    Filed: August 3, 2022
    Date of Patent: February 18, 2025
    Assignee: Unimicron Technology Corporation
    Inventors: Po-Hsiang Wang, Ming-Hao Wu
  • Publication number: 20250054885
    Abstract: Semiconductor structures and methods are provided. An exemplary method includes receiving a structure comprising a metal feature, a first passivation structure over the metal feature, and a first opening extending through the first passivation structure and exposing the metal feature. The exemplary method also includes forming a conductive layer in the first opening; forming a second passivation structure over the conductive layer, performing a first etching process to form a second opening extending through the second passivation structure and exposing the conductive layer, performing a second etching process to selectively remove an upper portion of the second passivation structure to enlarge an upper portion of the second opening, and after the performing of the second etching process, forming a conductive feature in the second opening.
    Type: Application
    Filed: January 4, 2024
    Publication date: February 13, 2025
    Inventors: Hsing-Hsiang Wang, Jiann-Horng Lin, Huan-Just Lin
  • Patent number: 12219882
    Abstract: A magnetic tunnel junction (MTJ) memory cell comprising a connection via structure, a bottom electrode disposed on the connection via structure, a memory material stack disposed on the bottom electrode, and a conductive contact structure disposed on the memory material stack, in which a bottom surface of the conductive contact structure is in direct contact with a memory material layer of the memory material stack.
    Type: Grant
    Filed: April 14, 2021
    Date of Patent: February 4, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Hsing-Hsiang Wang, Yu-Feng Yin, Jiann-Horng Lin, Huan-Just Lin
  • Patent number: 12219270
    Abstract: The present invention relates to an image sensing device comprising: an image sensing array and an image processing circuit. The image sensing array includes sensing units, and the sensing units respectively generate multiple pieces of pixel data. The multiple pieces of pixel data are generated according to different frame rates under different exposure periods, and include a first pixel data of a first subframe and a second pixel data of a second subframe. The first pixel data is generated by exposing a first exposure period for a first frame rate, and the second pixel data is generated by exposing a second exposure period for a second frame rate. The first frame rate is less than the second frame rate. The first exposure period is greater than the second exposure period, and multiple pieces of the second pixel data are generated during one image capturing operation.
    Type: Grant
    Filed: May 4, 2023
    Date of Patent: February 4, 2025
    Assignee: Guangzhou Tyrafos Semiconductor Technologies Co., Ltd.
    Inventors: Ping-Hung Yin, Jia-Shyang Wang, Yu Hsiang Wang
  • Publication number: 20250031332
    Abstract: An electronic device includes a chassis, a support bracket and a cable clip. The support bracket is disposed in the chassis. The cable clip includes a retainer and a fixing structure. The retainer is curved with a radian and formed with a curved accommodation space. The fixing structure extends from a back of the retainer. The cable clip is fixed on the support bracket by the fixing structure.
    Type: Application
    Filed: April 1, 2024
    Publication date: January 23, 2025
    Applicant: Wiwynn Corporation
    Inventor: Yen-Hsiang Wang
  • Patent number: 12204357
    Abstract: The present disclosure provides a low dropout (LDO) circuit. The LDO circuit includes an input terminal, an output terminal, a cascode operational amplifier, and a power stage. The cascode operational amplifier is electrically connected to the input terminal. The power stage has a first terminal electrically connected to the input terminal, a second terminal electrically connected to an output node of the cascode operational amplifier, and a third terminal electrically connected to the output terminal.
    Type: Grant
    Filed: March 10, 2022
    Date of Patent: January 21, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventor: Yi-Hsiang Wang
  • Patent number: 12188682
    Abstract: An evaporative-cooling window fan is configured to draw air from outdoors to indoors such that it is cooled and filtered as it passes there-through.
    Type: Grant
    Filed: January 25, 2023
    Date of Patent: January 7, 2025
    Inventors: Chi Hsiang Wang, Hao Han Wang
  • Patent number: 12192664
    Abstract: An image sensor and an operating method thereof are provided. The image sensor includes a first pixel circuit, a first column readout circuit, and a second column readout circuit. The first pixel circuit includes a first pixel unit, a first transfer transistor, a first reset transistor, a first readout transistor, and a first capacitor. The first column readout circuit includes a first circuit node. The second column readout circuit includes a bias transistor. A first terminal of the first reset transistor and a first terminal of the first readout transistor are coupled to the first circuit node, and a second terminal of the first readout transistor is coupled to the bias transistor.
    Type: Grant
    Filed: April 20, 2023
    Date of Patent: January 7, 2025
    Assignee: Guangzhou Tyrafos Semiconductor Technologies Co., LTD
    Inventors: Ping-Hung Yin, Jia-Shyang Wang, Yu-Hsiang Wang
  • Publication number: 20240428722
    Abstract: A light-emitting-diode driver structure applicable to driving a display panel and operation method thereof are provided. The LED driver structure includes at least one LED driving group, and the LED driving group is composed of a plurality of LED driving circuits which are serially connected in cascade. Each LED driving circuit of the LED driving group receives a data input signal in common. Upon receiving control signals, output signals are generated to drive the display panel. The multi-point driving circuit scheme can be fully or partially applied in the driver structure as required. In addition, a plurality of enable signals can be further adopted to activate each LED driving circuit, for avoiding the FIFO register used in the prior arts. By employing the disclosed technical contents, the present invention is effective in reducing both redundant power waste and circuit layout area of a conventional LED driver.
    Type: Application
    Filed: September 14, 2023
    Publication date: December 26, 2024
    Inventors: CHE-WEI YEH, YU-HSIANG WANG, HO-CHUN CHANG, PO-HSIANG FANG
  • Patent number: 12158039
    Abstract: An adapting sleeve has a main body segment, a rod passage, a tightening recess, and an abutting wall segment. The main body segment is adapted to be mounted in a tube segment of a fence door. The rod passage is formed through the main body segment for connecting a width adjusting rod of the fence door. The tightening recess is formed on an outer surface of the main body segment for connecting a tightening unit of the fence door. The abutting wall segment is located between the tightening recess and the rod passage. A thickness of the abutting wall segment is larger than a gap between the width adjusting rod and an inner surface of the rod passage. A material hardness of the abutting wall segment is lower than that of the width adjusting rod. The tightening unit abuts the width adjusting rod via the abutting wall segment.
    Type: Grant
    Filed: April 14, 2022
    Date of Patent: December 3, 2024
    Assignee: DEMBY DEVELOPMENT CO., LTD.
    Inventor: Tsung-Hsiang Wang
  • Publication number: 20240395741
    Abstract: A semiconductor device and method including depositing a passivation layer over an upper contact feature. In some embodiments, a polyimide (PI) layer is formed over the passivation layer. In an example, the PI layer is patterned to form a patterned PI layer including a first opening that exposes a portion of the passivation layer over the upper contact feature. In an embodiment, one or more etching processes are performed to form a second opening that exposes a top surface of the upper contact feature. In some embodiments, the one or more etching processes etches the passivation layer through the first opening to form a patterned passivation layer. In some examples, the one or more etching processes also recesses sidewall surfaces of the patterned PI layer from corners of the patterned passivation layer defined along opposing surfaces of the second opening.
    Type: Application
    Filed: May 23, 2023
    Publication date: November 28, 2024
    Inventors: Chung-Hao SU, Wen-Chiung TU, Hsing-Hsiang WANG, Chen-Chiu HUANG, Hsiang-Ku SHEN, Dian-Hau CHEN
  • Patent number: D1053155
    Type: Grant
    Filed: January 18, 2023
    Date of Patent: December 3, 2024
    Inventors: Yi-Hsiang Wang, I-Ying Wang